| Patent application number | Description | Published |
|---|
| 20080251912 | Multi-Chip Module - A multi-chip module includes at least one integrated circuit chip that is electrically connected to first external terminals of the multi-chip module and at least one power semiconductor chip that is electrically connected to second external terminals of the multi-chip module. All first external terminals of the multi-chip module are arranged in a contiguous region of an terminal area of the multi-chip module. | 10-16-2008 |
| 20090001562 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed. One embodiment provides a module including a first carrier having a first mounting surface and a second mounting surface, a first semiconductor chip mounted onto the first mounting surface of the first carrier and having a first surface facing away from the first carrier, a first connection element connected to the first surface of the first semiconductor chip, a second semiconductor chip having a first surface facing away from the first carrier, a second connection element connected to the first surface of the second semiconductor chip, and a mold material covering the first connection element and the second connection element only partially. | 01-01-2009 |
| 20090026601 | SEMICONDUCTOR MODULE - A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm. | 01-29-2009 |
| 20090072379 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed. One embodiment includes a carrier, a semiconductor chip attached to the carrier, a first conducting line having a first thickness and being deposited over the semiconductor chip and the carrier and a second conducting line having a second thickness and being deposited over the semiconductor chip and the carrier. The first thickness is smaller than the second thickness. | 03-19-2009 |
| 20090174056 | SEMICONDUCTOR MODULE - A semiconductor module is disclosed. One embodiment provides a first semiconductor chip having a first contact pad on a first main surface and a second contact pad on a second main surface, a first electrically conductive layer applied to the first main surface, a second electrically conductive layer applied to the second main surface, and an electrically insulating material covering the first electrically conductive layer, wherein a surface of the second electrically conductive layer forms an external contact pad and the second electrically conductive layer has a thickness of less than 200 μm. | 07-09-2009 |
| 20090179311 | SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING THE SAME - A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the side edges, the rear side and the top side, on which surface-mountable external contacts are arranged. One embodiment includes power semiconductor components, wherein the metallic coating connects a rear side electrode to one of the surface-mountable external contacts on the top side of a power semiconductor chip. | 07-16-2009 |
| 20090230535 | SEMICONDUCTOR MODULE - A semiconductor module. In one embodiment, at least two semiconductor chips are placed on a carrier. The at least two semiconductor chips are then covered with a molding material. An exposed portion of the at least two semiconductor chips is provided. A first layer of conductive material is applied over the exposed portion of the at least two semiconductor chips to electrically connect to a contact pad on the exposed portion of the at least two semiconductor chips. The at least two semiconductor chips are singulated. | 09-17-2009 |
| 20090261468 | SEMICONDUCTOR MODULE - A semiconductor module. One embodiment provides at least two semiconductor chips placed on a carrier. The at least two semiconductor chips are then covered with a molding material to form a molded body. The molded body is thinned until the at least two semiconductor chips are exposed. Then, the carrier is removed from the at least two semiconductor chips. The at least two semiconductor chips are singulated. | 10-22-2009 |
| 20090289354 | ELECTRONIC MODULE - An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 μm. | 11-26-2009 |
| 20100001291 | ELECTRONIC DEVICE AND MANUFACTURING THEREOF - An electronic device and manufacturing thereof. One embodiment provides a carrier and multiple contact elements. The carrier defines a first plane. A power semiconductor chip is attached to the carrier. A body is formed of an electrically insulating material covering the power semiconductor chip. The body defines a second plane parallel to the first plane and side faces extends from the first plane to the second plane. At least one of the multiple contact elements has a cross section in a direction orthogonal to the first plane that is longer than 60% of the distance between the first plane and the second plane. | 01-07-2010 |
| 20100013106 | STACKED SEMICONDUCTOR CHIPS - Stacked semiconductor chips. One embodiment provides a device having a first body. A first power semiconductor chip and first external contact elements is provides. A second body includes a second semiconductor chip and second external contact elements. The second body is placed over the first body. The first external contact elements and the second external contact elements define a first plane. | 01-21-2010 |
| 20100264523 | Panel, Semiconductor Device and Method for the Production Thereof - A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components. | 10-21-2010 |
| 20100289135 | SEMICONDUCTOR CHIP PACKAGE - A semiconductor chip package is disclosed. One embodiment provides at least one semiconductor chip including contact elements on a first surface of the chip. An encapsulation layer covers the semiconductor chip. A metallization layer is applied above the first surface of the chip and the encapsulation layer. The metallization layer includes contact areas connected with the contact elements of the chip. External pins are connected with the contact areas. | 11-18-2010 |
