| Patent application number | Description | Published |
|---|
| 20080261409 | PROCESSING DEVICE AND METHOD FOR PROCESSING A SUBSTRATE - A processing device for producing a layer system including at least one layer of an organic light emitting semiconductor material (OLED), comprises (1) a configuration of one or more treatment stations for processing the substrate in the treatment stations and (2) a first encapsulation module for providing an encapsulation element on the layer system deposited on the substrate. Furthermore, the processing device comprises at least a second encapsulation module, and is configured to provide the encapsulation element on the coated substrate in the first or second encapsulation module alternatively. By providing two encapsulation modules, the second module may be cleaned during a continuous operation of the processing device, while the first encapsulation module is generating an encapsulation on a coated substrate. In this way, a continuous operation of a coating device for depositing an OLED coating and an encapsulation element on the OLED coating is provided. | 10-23-2008 |
| 20090020416 | SPUTTER COATING DEVICE AND METHOD OF DEPOSITING A LAYER ON A SUBSTRATE - A sputter coating device comprises a vacuum coating chamber, substrates arranged within the coating chamber, a cylindrical hollow cathode including a rotatable target rotating around a central axis A, and a magnet assembly which is arranged within the hollow cathode such that confining plasma zones are generated in an area above the surface of the target. At least one substrate is to be coated. The substrate has an OLED layer deposited on the substrate surface. An intermediate area is arranged between the surface of the target and a shield that shields particles sputtered from the surface of the target that move in a direction toward the shield. On each side of the shield, passages are provided between the intermediate area and coating area. Through the passage, only sputtered particles that have been scattered in the intermediate area may enter the coating area via the passage, and impinge the OLED layer. | 01-22-2009 |
| 20090098293 | METHOD OF PROVIDING AN ENCAPSULATION LAYER STACK, COATING DEVICE AND COATING SYSTEM - A coating system or encapsulation module | 04-16-2009 |
| 20090293810 | ARRANGEMENT FOR COATING A SUBSTRATE - The invention relates to an arrangement for coating a substrate ( | 12-03-2009 |
| 20090293909 | ARRANGEMENT AND METHOD FOR REMOVING ALKALI- OR ALKALINE EARTH-METALS FROM A VACUUM COATING CHAMBER - The invention relates to a cleaning method in which from a vacuum coating chamber ( | 12-03-2009 |
| 20090317562 | PROCESSING SYSTEM AND METHOD FOR PROCESSING A SUBSTRATE - A processing system for processing a substrate includes a process chamber for receiving the substrate, a patterning device installed within the process chamber, and a mechanism for transferring the substrate into the process chamber and for aligning the substrate relative to the patterning device. | 12-24-2009 |
| 20090317927 | METHOD OF CLEANING A PATTERNING DEVICE, METHOD OF DEPOSITING A LAYER SYSTEM ON A SUBSTRATE, SYSTEM FOR CLEANING A PATTERNING DEVICE, AND COATING SYSTEM FOR DEPOSITING A LAYER SYSTEM ON A SUBSTRATE - A method of cleaning a patterning device, the patterning device having at least organic coating material (OLED material) deposited thereon, comprises the step of providing a cleaning plasma for removing the coating material from the patterning device by means of a plasma etching process. During the step of removing the coating material from the patterning device, the temperature of the patterning device does not exceed a critical temperature causing damage to the patterning device, while maintaining a plasma etching rate of at least 0.2 μm/min. In order to generate a pulsed cleaning plasma, pulsed energy is provided. The method can be carried out in a direct plasma etching process or in a remote plasma etching process. Different etching processes may be combined or carried out subsequently. | 12-24-2009 |
| 20100092658 | COATING OF MASKED SUBSTRATES - The present invention refers to a coating installation and a corresponding method or coating a substrate comprising the steps of:
| 04-15-2010 |
