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Jose J.
Jose J. Aizpuru, Murphy, TX US
| Patent application number | Description | Published |
|---|---|---|
| 20080224287 | OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE - Using one or more reference indicators in die attaching an optoelectronic device to a lead during the assembly of an optoelectronic package. One example method of assembling an optoelectronic package includes detecting a reference indicator included in a first component of an optoelectronic package. The method also includes die attaching a second component to the optoelectronic package at a die attach location. The die attach location is substantially aligned with the reference indicator along a line that intersects the reference indicator and is parallel to either an x-axis or a y-axis of an x-y coordinate system associated with the optoelectronic package. | 09-18-2008 |
Jose J. Estabil, Weston, CT US
| Patent application number | Description | Published |
|---|---|---|
| 20080315196 | TECHNIQUE FOR EVALUATING A FABRICATION OF A DIE AND WAFER - The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed. | 12-25-2008 |
| 20100304509 | CONTACTLESS TECHNIQUE FOR EVALUATING A FABRICATION OF A WAFER - The fabrication of the wafer may be analyzed starting from when the wafer is in a partially fabricated state. The value of a specified performance parameter may be determined at a plurality of locations on an active area of a die of the wafer. The specified performance parameter is known to be indicative of a particular fabrication process in the fabrication. Evaluation information may then be obtained based on a variance of the value of the performance parameter at the plurality of locations. This may be done without affecting a usability of a chip that is created from the die. The evaluation information may be used to evaluate how one or more processes that include the particular fabrication process that was indicated by the performance parameter value was performed. | 12-02-2010 |
Jose J. Pineda De Gyvez, Eindhoven NL
| Patent application number | Description | Published |
|---|---|---|
| 20100308897 | POWER ISLAND WITH INDEPENDENT POWER CHARACTERISTICS FOR MEMORY AND LOGIC - A power island for a system-on-a-chip (SoC) includes a first segment, a second segment, and a supply line. The first segment includes a hardware device and operates the hardware device at first power characteristics indicative of at least a first voltage. The second segment includes scalable logic and operates the scalable logic at second power characteristics indicative of at least a second voltage. The second power characteristics of the scalable logic are different from the first power characteristics of the hardware device. The supply line receives an external supply signal (VDD) and directs the external supply signal to both the first segment and the second segment. The second segment changes at least one power characteristic of the external supply signal to operate the scalable logic according to the second power characteristics. | 12-09-2010 |