| Patent application number | Description | Published |
|---|
| 20090129026 | Heat sink for semiconductor device and semiconductor module assembly including the heat sink - Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a portion of the second surface of the heat sink base to which no clip is coupled; and second fins provided on portions of the second surface of the heat sink base to which a clip may be coupled. The semiconductor module assembly may secure the heat sinks to both surfaces of a semiconductor module using the clip. Accordingly, air may flow smoothly through the second fins on the portions to which the clip may be coupled, thereby improving the cooling function of the heat sinks. | 05-21-2009 |
| 20090130908 | Memory module, socket and mounting method providing improved heat dissipating characteristics - In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module. | 05-21-2009 |
| 20090273905 | Integrated circuit package and integrated circuit module - An integrated circuit package may include a board that may support an integrated circuit chip. A post pin may be provided on a surface of the board. The post pin may be electrically connected to the integrated circuit chip. A land pin may be provided on the other surface of the board. The land pin may be electrically connected to the integrated circuit chip. | 11-05-2009 |
| 20100038769 | WAFER STACKED PACKAGE WAVING BERTICAL HEAT EMISSION PATH AND METHOD OF FABRICATING THE SAME - A wafer stacked semiconductor package (WSP) having a vertical heat emission path and a method of fabricating the same are provided. The WSP comprises a substrate on which semiconductor chips are mounted; a plurality of semiconductor chips stacked vertically on the substrate; a cooling through-hole formed vertically in the plurality of semiconductor chips, and sealed; micro holes formed on the circumference of the cooling through-hole; and coolant filling the inside of the cooling through-hole. Accordingly, the WSP reduces a temperature difference between the semiconductor chips and quickly dissipates the heat generated by the stacked semiconductor chips. | 02-18-2010 |
| 20100059880 | SEMICONDUCTOR MODULE AND AN ELECTRONIC SYSTEM INCLUDING THE SAME - A three-dimensional semiconductor module and an electronic system including the same are provided. The semiconductor module includes a module substrate, a logic device formed on a part of the module substrate, and a plurality of memory devices formed on another part of the module substrate, wherein the plurality of memory devices are disposed perpendicular to the logic device, and the module substrate on which the plurality of memory devices are formed is supported by a supporter. The electronic system includes the semiconductor module. | 03-11-2010 |
| 20100181887 | LIGHT EMITTING DEVICE - A light emitting device with improved heat dissipation is provided. The light emitting device includes a first lead frame, a second lead frame, a light emitting element and a housing. The first lead frame includes a light emitting element mounting portion, a first heat dissipation portion extending from the light emitting element mounting portion in a first direction, and second and third heat dissipation portions extending from the light emitting element mounting portion in a second direction opposite to the first direction. The second lead frame extends in the second direction and is disposed between and spaced apart from the second and third heat dissipation portions. The light emitting element is mounted on the light emitting element mounting portion and is electrically coupled to the first and second lead frames. The housing encapsulates the first and second lead frames. The second and third heat dissipation portions have a first width and the second lead frame has a second width the same as or different from the first width. | 07-22-2010 |
| 20110032679 | SEMICONDUCTOR MODULE - A semiconductor module includes a semiconductor package generating thermal energy, a heat collecting member transferring thermal energy from the semiconductor package to a heat collection area in the heat collecting member, a heat radiating member transferring thermal energy received from the heat collecting member and package to the outside, and a thermoelectric device transferring thermal energy through the heat collection area to the heat radiating member via the thermoelectric effect. The heat collecting member and heat radiating member may be otherwise insulated so thermal energy is transferred and controlled by the thermoelectric device. The package may be a dynamic random access memory (DRAM), microprocessor, central processing unit (CPU), graphic processing unit (GPU), or flash memory. The heat radiating member may be an external case of a solid state disk (SSD), and the thermoelectric device may be a Peltier cooler controlled through a power line. | 02-10-2011 |
| 20110304035 | Package On Package Having Improved Thermal Characteristics - Provided is a package on package (POP) having improved thermal and electric signal transmitting characteristics. The POP may include a first semiconductor package, a second semiconductor package larger than the first semiconductor package and mounted on the first semiconductor package, and a heat slug adhered to a bottom of a second substrate of the second semiconductor package and surrounding a side of the first semiconductor package. The heat slug may be a capacitor. | 12-15-2011 |
