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Joon-Sung
Joon-Sung Hong, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20100131583 | SERVER AND METHOD FOR PROVIDING MOBILE WEB SERVICE - A server for a mobile web service and a method for providing a web service are provided. The wired server stores an IP address of at least one mobile web server. When a request for access to a mobile web server is received, the wired server delivers the access request to the mobile web server or provides a service in place of the mobile web server, using a URL included in the access request. | 05-27-2010 |
Joon-Sung Kim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20080314621 | Parallel chip embedded printed circuit board and manufacturing method thereof - A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes. | 12-25-2008 |
| 20090113271 | Method and apparatus for parallel structured latin square interleaving in communication system - A method and apparatus for parallel structured Latin square interleaving in a communication system are provided. The method includes dividing input information bits into sub-blocks according to a parallel processing order, generating a first Latin square matrix or a second Latin square matrix by comparing the parallel processing order with a predetermined threshold, and interleaving by reading out the information bits divided into the sub-blocks according to the generated Latin square matrix. | 04-30-2009 |
Joon-Sung Lee, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20110123772 | CORE SUBSTRATE AND METHOD OF MANUFACTURING CORE SUBSTRATE - A core substrate and a method of manufacturing the core substrate are disclosed. In accordance with an embodiment of the present invention, the core substrate includes an adhesive resin layer having a mineral filler added therein, a metal sheet, which is patterned and embedded in the adhesive resin layer, and an insulation layer, which is stacked on both surfaces of the adhesive resin layer. Since a through-hole is formed to correspond to the number of via holes in accordance with a higher density of a printed circuit board, no conventional land is required to be formed, thereby reducing the defect of eccentricity. | 05-26-2011 |
| 20110126970 | METALLIC LAMINATE AND MANUFACTURING METHOD OF CORE SUBSTRATE USING THE SAME - A metallic laminate and a method of manufacturing a core substrate using the same are disclosed. In accordance with an embodiment of the present invention, the metallic laminate includes an insulation material, a carrier layer, which is stacked on both surfaces of the insulation layer and in which the carrier layer is a metal, and a first metal foil, which is stacked on one surface of the carrier layer. By symmetrically forming two core substrates on either surface above and below the insulation material, each process of forming the core substrate can be performed at the same time in the shape of a pair of facing core substrates, thereby increasing the productivity by twice. The remaining insulation material having the carrier layer stacked thereon can be used as a base substrate that is used to manufacture a printed circuit board, thus preventing unnecessary waste of the insulation material. | 06-02-2011 |
| 20110127073 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a metal core having Invar layers formed on either surface of a copper layer, an insulation layer, which is formed on one surface of the metal core, and a circuit pattern, which is coupled to one surface of the insulation layer. Thus, the printed circuit board can improve thermal conductivity and deformation resistance against warpage. | 06-02-2011 |
Joon-Sung Lim, Seoul KR
| Patent application number | Description | Published |
|---|---|---|
| 20090096005 | SEMICONDUCTOR MEMORY DEVICE INCLUDING DOUBLE SPACERS ON SIDEWALL OF FLATING GATE, ELECTRONIC DEVICE INCLUDING THE SAME - A semiconductor memory device includes a device isolation layer formed in a semiconductor substrate to define a plurality of active regions. Floating gates are disposed on the active regions. A control gate line overlaps top surfaces of the floating gates and crosses over the active regions. The control gate line has an extending portion disposed in a gap between adjacent floating gates and overlapping sidewalls of the adjacent floating gates. First spacers are disposed on the sidewalls of the adjacent floating gates. Each of the first spacers extends along a sidewall of the active region and along a sidewall of the device isolation layer. Second spacers are disposed between outer sidewalls of the first spacers and the extending portion and are disposed above the device isolation layer. An electronic device including a semiconductor memory device and a method of fabricating a semiconductor memory device are also disclosed. | 04-16-2009 |