Patent application number | Description | Published |
20090097306 | Phase-change random access memory device, system having the same, and associated methods - A phase-change random access memory (PRAM) device includes a PRAM cell array including a first sector and a second sector, a first global bit line coupled to a first local bit line of the first sector and a first local bit line of the second sector, and a first plurality of global bit line discharge units coupled to the first global bit line, the first plurality of global bit line discharge units configured to discharge the first global bit line in response to a first global discharge signal. | 04-16-2009 |
20090097307 | Phase-change random access memory device, system having the same, and associated methods - A phase-change random access memory (PRAM) device includes a PRAM cell array having a first bank that includes first to m | 04-16-2009 |
20090161419 | NONVOLATILE MEMORY, MEMORY SYSTEM, AND METHOD OF DRIVING - Provided are a nonvolatile memory and related method of programming same. The nonvolatile memory includes a memory cell array with a plurality of nonvolatile memory cells and a write circuit. The write circuit is configured to write first logic state data to a first group of memory cells during a first program operation using a first internally generated step-up voltage, and second logic state data to a second group of memory cells during a second program operation using an externally supplied step-up voltage. | 06-25-2009 |
20090279351 | SEMICONDUCTOR MEMORY DEVICES AND METHODS HAVING CORE STRUCTURES FOR MULTI-WRITING - A semiconductor memory device having an efficient core structure for multi-writing includes a data input/output line, a plurality of memory banks each comprising a plurality of memory cells, a first global bit line and a second global bit line which are shared by the plurality of memory banks, and a first write driver and a second write driver which are connected with the data input/output line and provide a program current to the plurality of memory banks through the first and second global bit lines, respectively. Each memory bank includes a first cell area connected with the first global bit line and a second cell area connected with the second global bit line. In a multi-write mode, the first cell area in a first memory bank among the plurality of memory banks and the second cell area in a second memory bank among the plurality of memory banks are simultaneously selected and data is written to memory cells in the selected first and second cell areas, so that data writing time is reduced under the same conditions as a normal write mode. | 11-12-2009 |
20090303807 | Semiconductor device and semiconductor system having the same - A semiconductor device according to example embodiments may be configured so that, when a read command for performing a read operation is input while a write operation is performed, and when a memory bank accessed by a write address during the write operation is the same as a memory bank accessed by a read address during the read operation, the semiconductor device may suspend the write operation automatically or in response to an internal signal until the read operation is finished and performs the write operation after the read operation is finished. | 12-10-2009 |
20090316474 | Phase change memory - The phase change memory device includes a plurality of memory banks, a plurality of local conductor lines connected to the plurality of memory banks, at least one global conductor line connected to the plurality of local conductor lines, and at least one repair control circuit configured to selectively replace at least one of the at least one global conductor line with at least one redundant global conductor line and configured to selectively replace at least one of the plurality of local conductor lines with at least one redundant local conductor line. | 12-24-2009 |
20100131708 | Semiconductor device having resistance based memory array, method of reading and writing, and systems associated therewith - In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write buffer configured to store data being written into the non-volatile memory cell array, and a write address buffer configured to store a write address associated with each data stored in the write buffer. An output circuit is configured to selectively output one of data read from the non-volatile memory array and data from the write buffer. A by-pass control circuit is configured to control the output circuit based on whether an input read address matches a valid write address stored in the write address buffer. An invalidation unit is configured to invalidate an address stored in the write address buffer if the stored write address matches an input write address. | 05-27-2010 |
20100246239 | Memory device using a variable resistive element - A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different. | 09-30-2010 |
20100329070 | Resistance Semiconductor Memory Device Having Three-Dimensional Stack and Word Line Decoding Method Thereof - A resistance semiconductor memory device of a three-dimensional stack structure, and a word line decoding method thereof, are provided. In the resistance semiconductor memory device of a three-dimensional stack structure, in which a plurality of word line layers and a plurality of bit line layers are disposed alternately and perpendicularly, and in which a plurality of memory cell layers are disposed between the word line layers and the bit line layers; the resistance semiconductor memory device includes a plurality of bit lines disposed on each of the bit line layers in a first direction as a length direction; a plurality of sub word lines disposed on each of the word line layers in a second direction as a length direction, intersected to the first direction; a plurality of memory cells disposed on the memory cell layers; and a plurality of main word lines individually disposed on a main word line layer specifically adapted over the bit line layers and the word line layers, in the second direction as a length direction, each one of the plurality of main word lines being shared by a predetermined number of sub word lines. An efficient word line decoding adequate to high integration can be achieved. | 12-30-2010 |
20110096611 | Semiconductor device and semiconductor system having the same - A semiconductor device according to example embodiments may be configured so that, when a read command for performing a read operation is input while a write operation is performed, and when a memory bank accessed by a write address during the write operation is the same as a memory bank accessed by a read address during the read operation, the semiconductor device may suspend the write operation automatically or in response to an internal signal until the read operation is finished and performs the write operation after the read operation is finished. | 04-28-2011 |
20110103134 | RESISTANCE RANDOM ACCESS MEMORY HAVING COMMON SOURCE LINE - A method writes data to a resistance random access memory (RRAM) memory cell through first and second write paths, and includes; applying a positive source voltage to a selected source line, applying a word line drive voltage to a selected word line, and applying a voltage at least twice the level of the positive source voltage to a selected bit line via the first write path when writing data having the first state in the memory cell, and applying a ground voltage to the selected bit line via the second write path when writing data having the second state in the memory cell. | 05-05-2011 |
20110170332 | Methods of Driving Nonvolatile Memory Devices that Utilize Read/Write Merge Circuits - An integrated circuit memory device includes an array of nonvolatile memory cells (e.g., variable resistance cells) having a first plurality of lines electrically coupled to memory cells therein. A read/write control circuit is provided. The read/write control circuit includes a read/write merge circuit and a column selection circuit. The read/write control circuit, which is configured to drive a selected one of the first plurality of lines with unequal write and read voltages during respective write and read operations, includes a compensating unit. This compensating unit is configured to provide a read compensation current to the selected one of the first plurality of lines circuit during the read operation. | 07-14-2011 |
20110170334 | NONVOLATILE MEMORY, MEMORY SYSTEM, AND METHOD OF DRIVING - Provided are a nonvolatile memory and related method of programming same. The nonvolatile memory includes a memory cell array with a plurality of nonvolatile memory cells and a write circuit. The write circuit is configured to write first logic state data to a first group of memory cells during a first program operation using an internally generated step-up voltage, and second logic state data to a second group of memory cells during a second program operation using an externally supplied step-up voltage. | 07-14-2011 |
20110222330 | NONVOLATILE MEMORY DEVICE COMPRISING ONE-TIME-PROGRAMMABLE LOCK BIT REGISTER - A nonvolatile memory device comprises a one-time-programmable (OTP) lock bit register. The nonvolatile memory device comprises a variable-resistance memory cell array comprising an OTP block that store data and a register that stores OTP lock state information indicating whether the data is changeable. The register comprises a variable memory cell. An initial value of the OTP lock state information is set to a program protection state. | 09-15-2011 |
20120269021 | MEMORY DEVICE USING A VARIABLE RESISTIVE ELEMENT - A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different. | 10-25-2012 |
20120307547 | RESISTIVE MEMORY DEVICES AND MEMORY SYSTEMS HAVING THE SAME - A nonvolatile memory device includes an array of resistive memory cells and a write driver, which is configured to drive a selected bit line in the array with a reset current pulse, which is responsive to a first external voltage input through a first terminal/pad of the memory device during a memory cell reset operation. The write driver is further configured to drive the selected bit line in sequence with a first set current pulse, which is responsive to the first external voltage, and a second set current pulse, which is responsive to a second external voltage input through a second terminal/pad of the memory device during a memory cell set operation. | 12-06-2012 |
20130308370 | MEMORY DEVICE AND SYSTEM WITH IMPROVED ERASE OPERATION - A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different. | 11-21-2013 |