| Patent application number | Description | Published |
| 20100013384 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the disclosure provide an organic light-emitting display device and a manufacturing method of the organic light-emitting display device. The organic light-emitting display device includes a substrate; a display unit formed on the substrate; an encapsulation substrate formed above the display unit; a first sealant bonding the substrate and the encapsulation substrate; and a filler disposed between the substrate and the encapsulation substrate. In addition, a second sealant is provided to separate the the first sealant and the filler. The adhesive strength of the second sealant is greater than an adhesive strength of the filler. | 01-21-2010 |
| 20100148157 | ORGANIC LIGHT EMITTING APPARATUS AND METHOD OF MANUFACTURING THE SAME - Provided are an organic light emitting apparatus and a method of manufacturing the same. The organic light emitting apparatus includes: a filling material between a diode substrate on which an organic light emitting unit is formed and an encapsulation substrate; and an organic protection layer that is interposed between the organic light emitting unit and the filling material and includes at least one thermally depositable organic material. | 06-17-2010 |
| 20100227524 | METHOD OF MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY DEVICE - A method of manufacturing an organic light emitting diode (OLED) display device including a first substrate having a pixel region, and a second substrate attached to the first substrate, to seal the pixel region, the method including: applying a frit to a region of the second substrate; applying a laser beam to the frit, to plasticize the frit; aligning the first substrate and the second substrate; and applying a laser beam to the frit, to attach the first and second substrates. | 09-09-2010 |
| 20100279577 | Laser irradiation apparatus and method of manufacturing display device using the same - A laser irradiation apparatus for bonding a first substrate to a second substrate using bonding members and a method of manufacturing a display device using the same, the laser irradiation apparatus including a stage on which the first substrate is mounted, bonding members disposed between the first substrate and the second substrate, a laser oscillating member configured to irradiate a laser beam onto the bonding members, and a temperature maintaining member co-operating with the first substrate to maintain a temperature of the first substrate at a predetermined temperature. | 11-04-2010 |
| 20110037382 | Organic light emitting display device and method of manufacturing the same - An organic light emitting display (OLED) device and a method of manufacturing the same, the OLED device including a first substrate having an organic emission unit on a surface thereof, a second substrate above the first substrate, an inorganic sealing member between the first substrate and the second substrate, the inorganic sealing member bonding the first substrate and the second substrate. and a filler, the filler filling a space between the first substrate and the second substrate, wherein a volume of the filler is greater than a volume of a space between the first substrate, the second substrate, and the inorganic sealing member prior to bonding the first substrate and the second substrate. | 02-17-2011 |
| 20110057172 | Filler for sealing organic light emmiting device and method for manufacturing the organic light emmiting device using the same - A sealing filler for an organic light emitting device display includes a siloxane polymer having a surface tension of about 20 dyn/cm or less. The siloxane polymer may be represented by | 03-10-2011 |
| 20110062846 | Organic light emmiting device and filler for sealing the same - An organic light emitting device display includes a substrate, an organic light emitting diode array on the substrate, an encapsulation substrate on the organic light emitting diode array, and an internal filler between the organic light emitting diode array and the encapsulation substrate, the internal filler including a cross-linked silicone polymer. | 03-17-2011 |