Patent application number | Description | Published |
20080247212 | MEMORY SYSTEM HAVING POINT-TO-POINT (PTP) AND POINT-TO-TWO-POINT (PTTP) LINKS BETWEEN DEVICES - A memory system has first and second primary memories and first and second secondary memories coupled to the first and second primary memories, respectively, the coupling comprising at least one point-to-point connection. A memory module includes at least two of the first and second primary and first and second secondary memories. A first connection element, such as a connector or solder, connects the memory module to a mother board. A second connection element, such as a connector or solder, connects at least one other of the first and second primary and first and second secondary memories to the mother board. At least one of the memories on the first memory module is coupled to at least one of the other memories. The memory system also includes a memory controller which is connected to the primary memories by a point-to-two-point link. | 10-09-2008 |
20090037800 | DATA PARALLELIZING RECEIVER - Provided is a data parallelizing receiver including an input signal receiver for externally receiving serial data as packets, sampling the serial data, aligning the sampled data in an input order, and converting the aligned data into parallel data to output the parallel data, a cyclic redundancy check (CRC) partial calculator for receiving the parallel data, classifying the parallel data into groups according to the input order, and performing a partial CRC calculation on each of the groups to sequentially output a plurality of partial CRC calculation results, and a CRC partial calculation merger for receiving the plurality of partial CRC calculation results and merging the partial CRC calculation results to output CRC calculation data. | 02-05-2009 |
20100142252 | RECONFIGURABLE INPUT/OUTPUT IN HIERARCHICAL MEMORY LINK - A memory system and memory module includes a plurality of memory devices, each having a plurality, e.g. four, ports for transmitting and receiving command signals, write data signals and read data signals. One of the memory devices is connected to a host or controller, and the remaining memories are connected together, typically by point-to-point links. When the memory system configuration is such that at least one of the ports in at least one of the memory devices is not used, one or more other ports can use the pins that may otherwise have been used by the unused ports. As a result, a set of reconfigurable, shared pins is defined in which two ports share the pins. The port that is not being used in a particular application for the memory device is not connected to the shared pins, and another port that is being used in the application is connected to the shared pins. This allows for the used of fewer package pins and, consequently, reduced package size. | 06-10-2010 |
20110246857 | MEMORY SYSTEM AND METHOD - A memory system includes a memory controller and a memory device. The memory device exchanges data through a first channel with the memory controller, exchanges a first cyclic redundancy check (CRC) code associated with the data through a second channel with the memory controller, and receives a command/address packet including a second CRC code associated with a command/address from the memory controller through a third channel. | 10-06-2011 |
20110289269 | MEMORY SYSTEM AND METHOD HAVING POINT-TO-POINT LINK - A memory system includes a controller for generating a control signal and a primary memory for receiving the control signal from the controller. A secondary memory is coupled to the primary memory, the secondary memory being adapted to receive the control signal from the primary memory. The control signal defines a background operation to be performed by one of the primary and secondary memories and a foreground operation to be performed by the other of the primary and secondary memories. The primary memory and the secondary memory are connected by a point-to-point link. At least one of the links between the primary and secondary memories can be an at least partially serialized link. At least one of the primary and secondary memories can include an on-board internal cache memory. | 11-24-2011 |
20120059984 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor package is disclosed. The semiconductor package includes a package interface, a stack of semiconductor chips, a plurality of stacks of through substrate vias, and an interface circuit. The package interface includes at least a first pair of terminals. Each stack of through substrate vias includes plural through substrate vias of respective ones of the semiconductor chips, each through substrate via electrically connected to a through substrate via of an immediately adjacent semiconductor chip. The interface circuit includes an input connected to the first pair of terminals to receive a differential signal providing first information, and includes an output to provide an output signal including the first information in a single-ended signal format to at least one of the plurality of stacks of through substrate vias. | 03-08-2012 |
20120099389 | MEMORY CIRCUITS, SYSTEMS, AND MODULES FOR PERFORMING DRAM REFRESH OPERATIONS AND METHODS OF OPERATING THE SAME - A memory module can include a plurality of dynamic memory devices that each can include a dynamic memory cell array with respective regions therein, where the plurality of dynamic memory devices can be configured to operate the respective regions responsive to a command. A DRAM management unit can be on the module and coupled to the plurality of dynamic memory devices, and can include a memory device operational parameter storage circuit that is configured to store memory device operational parameters for the respective regions to affect operation of the respective regions responsive to the command. | 04-26-2012 |
20120280731 | PHASE-LOCKED-LOOP CIRCUIT INCLUDING DIGITALLY-CONTROLLED OSCILLATOR - A phase-locked-loop (PLL) circuit is provided. The PLL circuit includes a phase/frequency detector, a digital filter, a digital low pass filter (LPF), a digitally controlled oscillator (DCO), and a frequency divider. The digital LPF performs a low-pass-filtering on least significant bits of first digital data in a digital mode and generates filtered second digital data. The DCO performs a digital-to-analog conversion on the second digital data and most significant bits of the first digital data to generate a first signal, generates an oscillation control signal based on the first signal, and generates an output clock signal oscillating in response to the oscillation control signal. | 11-08-2012 |
20120300555 | INTEGRATED CIRCUIT MEMORY DEVICE - A semiconductor memory device includes a plurality of memory regions formed on one chip, each of the memory regions having a plurality of volatile memory cells that are formed with a density or capacity of 2̂K bits, where K is an integer greater than or equal to 0, and a plurality of input/output (I/O) terminals for inputting and outputting data of the volatile memory cells, and at least one peripheral region that controls a write operation for writing data into the memory regions and a read operation for reading data from the memory regions based on a command and an address input from outside. Thus, a total or entire density of the memory regions corresponds to a non-standard (or ‘interim’) density so that the semiconductor memory device may have an interim density. | 11-29-2012 |
20120300568 | Method of Refreshing a Memory Device, Refresh Address Generator and Memory Device - A refresh address is generated with a refresh period for refreshing a memory device with refresh leveraging. A respective refresh is performed on a weak cell having a first address when the refresh address is a second address instead of on a first strong cell having the second address. A respective refresh is performed on one of the first strong cell or a second strong cell having a third address when the refresh address is the third address. Address information is stored for only one of the first, second, and third addresses such that memory capacity may be reduced. In alternative aspects, a respective refresh is performed on one of a weak cell, a first strong cell, or a second strong cell depending on a flag when the refresh address is any of at least one predetermined address to result in refresh leveraging. | 11-29-2012 |
20120303870 | MEMORY CHIP, MEMORY SYSTEM, AND METHOD OF ACCESSING THE MEMORY CHIP - A memory chip, a memory system, and a method of accessing the memory chip. The memory chip includes a substrate, a first storage unit, and a second storage unit. The first storage unit includes a plurality of first memory cells may have a first storage capacity of 2 | 11-29-2012 |
20130016574 | SEMICONDUCTOR MEMORY DEVICE HAVING IMPROVED REFRESH CHARACTERISTICS - A semiconductor memory device having improved refresh characteristics includes a memory array including a plurality of memory cells; a test unit configured to test refresh characteristics of the memory array and generate a first fail address signal; a storage unit configured to store the first fail address signal; and a refresh unit configured to perform a refresh operation on the memory array, wherein the refresh unit is configured to receive the first fail address signal from the storage unit, perform the refresh operation on a first memory cell that does not correspond to the first fail address signal according to a first period, and perform the refresh operation on a second memory cell that corresponds to the first fail address signal according to a second period that is shorter than the first period. | 01-17-2013 |
20130055048 | BAD PAGE MANAGEMENT IN MEMORY DEVICE OR SYSTEM - A memory device comprises a memory cell array and a bad page map. The memory cell array comprises a plurality of memory cells arranged in pages and columns, wherein the memory cell array is divided into a first memory block and a second memory block each corresponding to an array of the memory cells. The bad page map stores bad page location information indicating whether each of the pages of the first memory block is good or bad. A fail page address of the first memory block is replaced by a pass page address of the second memory block according to the bad page location information. | 02-28-2013 |
20130058145 | MEMORY SYSTEM - A semiconductor device includes a first memory region including a plurality of memory cells; a test unit configured to test the first memory region, and detect a weak bit from among the plurality of memory cells; and a second memory region configured to store a weak bit address (WBA) of the first memory region, and data intended to be stored in the weak bit, wherein the first memory region and the second memory region include different types of memory cells. | 03-07-2013 |
20130170274 | SEMICONDUCTOR MEMORY DEVICE STORING MEMORY CHARACTERISTIC INFORMATION, MEMORY MODULE AND MEMORY SYSTEM HAVING THE SAME, AND OPERATING METHOD THEREOF - A semiconductor memory device includes a cell array including a plurality of regions accessed by first addresses, where the plurality of regions including at least two groups of regions having respectively different memory characteristics. The device further includes a nonvolatile array for nonvolatile storage of group information indicative of which of the least two groups each of the plurality of regions belongs. | 07-04-2013 |
20140019833 | MEMORY SYSTEM AND METHOD - A memory system includes a memory controller and a memory device. The memory device exchanges data through a first channel with the memory controller, exchanges a first cyclic redundancy check (CRC) code associated with the data through a second channel with the memory controller, and receives a command/address packet including a second CRC code associated with a command/address from the memory controller through a third channel. | 01-16-2014 |