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Joo Han

Joo Han Kim, Incheon KR

Patent application numberDescriptionPublished
20100115877SASH FOR WINDOWS AND DOORS WITH ATTACHABLE AND DETACHABLE RAILS - There is provided a window and door frame for doors and windows built in a wall of a building. The window and door frame includes an extruded frame member. One face of the frame member is formed along a length direction thereof with a rail insertion groove. The window and door frame further includes a rail structure adapted to be combined with the rail insertion groove. The rail insertion groove is formed with engagement grooves, while the rail structure is formed with engagement projections. The rail structure is easily combined to and removed from the frame member by means of engagement between the engagement projections and the engagement grooves. Since the rail structure is attachable and detachable, a heavier door can be conveniently installed and the window and door frame can be easily cleaned up. Further, only a damaged rail structure can be replaced.05-13-2010

Joo Han Kim, Seoul KR

Patent application numberDescriptionPublished
20090315427Slotless motor - A stator coil of a slotless motor is disclosed in which the stator coil is formed in such a manner that respective both distal ends of two unit coil bodies, each unit coil body arranged to face each other, are respectively coupled to form a plurality of circular coil bodies, each circular coil body having a different inner diameter, and a circular coil body having a smaller inner diameter is sequentially inserted into an inner side of a circular coil body having a larger inner diameter, whereby a horizontal width of the plurality of unit coil bodies of U, V and W phases is equal there among to cause the strength of the magnetic field of U, V and W phases to be equal, and to allow the stator to be accurately manufactured, thereby catering to a designer's intention and markedly simplifying the assembly processes.12-24-2009

Joo Han Lee, Seoul KR

Patent application numberDescriptionPublished
20100015898Conditioner for Chemical Mechanical Planarization Pad - The present invention provides a conditioner for CMP pad required for global planarization of wafer to achieve high integration of a semiconductor element. The conditioner for CMP pad includes a metal substrate having abrasive particles fixed thereto, a plurality of abrasive particles fixed to the metal substrate, and a layer of metal binder fixing the abrasive particles to the metal substrate. The abrasive particles include at least one pattern. The pattern includes at least one row of abrasive particles and the abrasive particles include bigger abrasive particles and smaller abrasive particles. In addition, a diameter difference between smaller and bigger abrasive particles is 10 to 40%. The present invention ensures uniform dressing of conditioner, superior dressing efficiency and superior performance reproducibility.01-21-2010

Joo Han Lee, Seongnam-Si KR

Patent application numberDescriptionPublished
20110250826PAD CONDITIONER HAVING REDUCED FRICTION AND METHOD OF MANUFACTURING THE SAME - This invention relates to a conditioner for a chemical mechanical planarization pad, which is necessary for global planarization of a wafer in order to increase the degree of integration of a semiconductor device, and more particularly to a pad conditioner having a structure able to reduce friction with a pad so as to solve the problems caused by a lot of friction being generated upon conditioning, and to a method of manufacturing the same.10-13-2011