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Jongkook
Jongkook Kim, Hwaseong-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20100038765 | Semiconductor package and method for manufacturing the same - Provided is a semiconductor package and a method for fabricating the semiconductor package. The semiconductor package may include a first package having a first semiconductor chip mounted on a first substrate and a second package having a second semiconductor chip mounted on a second substrate, the second substrate being bent to cover a side of the first package to contact the first substrate such that the first and second packages are connected electrically. | 02-18-2010 |
| 20110057297 | SEMICONDUCTOR CHIPS HAVING GUARD RINGS AND METHODS OF FABRICATING THE SAME - Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer. | 03-10-2011 |
Jongkook Lee, Seongnam-Si KR
| Patent application number | Description | Published |
|---|---|---|
| 20080208962 | Real time automatic update system and method for disaster damage investigation using wireless communication and web-gis - Disclosed are a real time automatic update system and method for disaster damage investigation using wireless communication and a web-GIS (Geographic Information System), which are able to prevent disaster recurrence by effectively acquiring various data associated with a disaster area in disaster investigation, quickly establish a disaster register and enable easy searching by loading corresponding data on the web. The system includes a field equipment kit which is comprised of various kinds of equipments for capturing the location of a damaged area, damage cause information, damage images and moving images, and voice information and transmitting them to a server; a damage investigation information receiving server which receives data that is created in the field equipment kit and transmitted therefrom through wireless communication, analyzes/stores disaster data, and classifies/processes the disaster data; a web server which receives data classified suitably for a homepage, a disaster register, a web-GIS, etc. and establishes a disaster register DB and a web DB; a web-GIS server which updates and stores geographical information and geographical property information linked with the web server; and a client terminal which connects to the web server and the web-GIS server to generate a retrieval signal of disaster information and displays the information on the screen. | 08-28-2008 |
Jongkook Park, Nashua, NH US
| Patent application number | Description | Published |
|---|---|---|
| 20080242056 | SYSTEM AND METHOD FOR CUTTING USING A VARIABLE ASTIGMATIC FOCAL BEAM SPOT - A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage. | 10-02-2008 |
| 20100301027 | SYSTEM AND METHOD FOR CUTTING USING A VARIABLE ASTIGMATIC FOCAL BEAM SPOT - A variable astigmatic focal beam spot is formed using lasers with an anamorphic beam delivery system. The variable astigmatic focal beam spot can be used for cutting applications, for example, to scribe semiconductor wafers such as light emitting diode (LED) wafers. The exemplary anamorphic beam delivery system comprises a series of optical components, which deliberately introduce astigmatism to produce focal points separated into two principal meridians, i.e. vertical and horizontal. The astigmatic focal points result in an asymmetric, yet sharply focused, beam spot that consists of sharpened leading and trailing edges. Adjusting the astigmatic focal points changes the aspect ratio of the compressed focal beam spot, allowing adjustment of energy density at the target without affecting laser output power. Scribing wafers with properly optimized energy and power density increases scribing speeds while minimizing excessive heating and collateral material damage. | 12-02-2010 |