Patent application number | Description | Published |
20100096754 | Semiconductor package, semiconductor module, and method for fabricating the semiconductor package - Provided is a semiconductor package, a semiconductor module and a method for fabricating the semiconductor package. The method provides a substrate including a bonding pad. The method forms a dielectric layer for exposing the bonding pad on the substrate. The method forms a redistribution line which is electrically connected to the bonding pad, on the dielectric layer. The method forms an external terminal which is electrically connected to the bonding pad without using a solder mask which limits a position of the external terminal, on the redistribution line. | 04-22-2010 |
20100115763 | CIRCUIT MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING A SEMICONDUCTOR CIRCUIT - A module apparatus includes a first unit and a second unit adjacent to the first unit. The first unit includes a chip transfer unit mounting semiconductor chips on a printed circuit board and a heat unit applying heat on a solder ball of the semiconductor chip. The second unit includes a tester testing an electrical connection state between the printed circuit board and the semiconductor chip, a bad board storage storing the printed circuit board on which a semiconductor chip determined as bad in the tester is mounted, and a board moving member moving the printed circuit board stored in the bad board storage into the first unit. | 05-13-2010 |
20100117213 | COIL AND SEMICONDUCTOR APPARATUS HAVING THE SAME - An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward. | 05-13-2010 |
20100181293 | Reflow apparatus, Reflow method, and package apparatus - Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil. | 07-22-2010 |
20120043125 | CIRCUIT BOARDS, METHODS OF FORMING THE SAME AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Provided is a method of forming a circuit board including an adhesion portion. The method may include forming a mask pattern including an opening on a board; performing a surface treatment process at a bottom of the opening; combining a linker with the surface on which a surface treatment process is performed; and forming a metal pattern combined with the linker in the opening. | 02-23-2012 |
20120104625 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip having a bonding pad, a metal line electrically connected to the semiconductor chip and having a terminal contacting an external terminal, an insulation layer covering the metal line and having an opening that defines the terminal, and a molding layer molding the semiconductor chip, wherein the molding layer includes a recess pattern exposing the bonding pad and extending from the bonding pad to the terminal, and the metal line is embedded in the recess pattern to contact the bonding pad. | 05-03-2012 |
20130267066 | Semiconductor Packages and Methods of Fabricating the Same - Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a semiconductor chip having a bonding pad, a metal line electrically connected to the semiconductor chip and having a terminal contacting an external terminal, an insulation layer covering the metal line and having an opening that defines the terminal, and a molding layer molding the semiconductor chip, wherein the molding layer includes a recess pattern exposing the bonding pad and extending from the bonding pad to the terminal, and the metal line is embedded in the recess pattern to contact the bonding pad. | 10-10-2013 |