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| 20080237585 | Flat panel display device and method of fabricating the same - A flat panel display device including a first region having an organic light emitting diode and a thin film transistor and a second region having a capacitor is disclosed. The capacitor comprises first, second, and third electrodes, where the area of a third capacitor electrode is reduced, thereby ensuring a distance between a first power voltage line and the third capacitor electrode. The total area of the capacitor is compensated by increasing the area of the first capacitor electrode. Thus, the area of the third capacitor electrode is reduced while the total capacitance of the capacitor is maintained, thereby preventing a dark spot caused by a short circuit between the first power voltage line and the third capacitor electrode. | 10-02-2008 |
| 20080246034 | THIN FILM TRANSISTOR FOR FLAT PANEL DISPLAY AND METHOD OF FABRICATING THE SAME - A thin film transistor for a flat panel display, and more particularly to a thin film transistor for a flat panel display having a protrusion in a part of a gate electrode includes a substrate on which an insulating layer is deposited, a semiconductor layer, which is a layer having predetermined width and length on the insulating layer, provided with doping regions in a letter U shape and a channel region between the doping regions; a gate insulating layer formed on the semiconductor layer; a gate electrode formed on the gate insulating layer to traverse the doping region; and a protrusion, which is a part of the gate electrode, formed on the gate insulating layer to be opposed to the channel region. | 10-09-2008 |
| 20100059257 | METHOD OF NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD - Disclosed are a method of electroless nickel-gold plating an object and a printed circuit board. The method in accordance with an embodiment of the present invention includes: forming a first nickel plated layer on a surface of the object; forming a second nickel plated layer on the first nickel plated layer; and forming a gold plated layer on the second nickel plated layer. | 03-11-2010 |
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| 20110042678 | Pad area, organic light emitting diode display device having the same, and method of fabricating the same - An organic light emitting diode (OLED) display device having a pixel area and a pad area. The pad area includes a silicon layer pattern arranged on the substrate, an insulating layer arranged on the silicon layer pattern, an interconnection layer arranged on the insulating layer, and a protective layer surrounding an edge of the interconnection layer and having an opening exposing the interconnection layer. Since a surface area of the interconnection layer is increased due to a roughness of the underlying polycrystalline silicon layer pattern in the pad area, resulting in increased contact area and reduced contact resistance between parts configured to operate a flat panel display device and the interconnection layer is increased. | 02-24-2011 |
| 20110186847 | ORGANIC LIGHT EMITTING DIODE DISPLAY AND FABRICATING METHOD OF THE SAME - An organic light emitting diode display and a fabricating method of the same are disclosed. In one embodiment, the display includes i) a substrate having a thin film transistor region and a pixel region, ii) a semiconductor layer formed in the thin film transistor region, iii) a gate insulating layer formed on the substrate and the semiconductor layer and vi) a lower electrode formed on the gate insulating layer, wherein the lower electrode is formed in the pixel region. The display further includes i) a gate electrode formed on the gate insulating layer, wherein the gate electrode is formed substantially directly above the semiconductor layer, ii) an interlayer insulating layer formed on the gate insulating layer, the lower electrode and the gate electrode and iii) source and drain electrodes formed on the interlayer insulating layer and electrically connected with the semiconductor layer. Each of the lower electrode and the gate electrode is formed of a first conductive layer and a second conductive layer formed on the first conductive layer. The second conductive layer and the source/drain electrodes are formed of the same material. | 08-04-2011 |
| 20110291091 | Organic Light Emitting Display - In an organic light emitting display, a conductive layer is formed on the bottom surface of a substrate, and the conductive layer is used as a wiring line for supplying a power source, and as the electrode of a capacitor. Therefore, it is possible to easily secure the aperture ratio of a pixel, to easily solve the problem of IR drops by controlling the area or thickness of the conductive layer, and to easily secure the electrostatic capacity of the capacitor. In particular, in the case of a front surface light emitting structure, since a capacitor of a metal/insulating layer/metal (MIM) structure may be formed in a light emitting region, enough aperture ratio and electrostatic capacity may be secured. Therefore, a high resolution organic light emitting display may be easily realized, and enough aperture ratio and electrostatic capacity are secured so as to realize high picture quality. | 12-01-2011 |
| 20120007057 | ORGANIC LIGHT-EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display device including a substrate; at least one thin-film transistor (TFT) formed on the substrate; a planarizing layer covering the TFT; a pixel electrode, which is formed on the planarizing layer and is connected to the TFT; a protective layer surrounding an edge of the pixel electrode; a pixel defining layer (PDL), which has an overhang (OH) structure protruding more than the top surface of the protective layer, covers the protective layer and the edge of the pixel electrode, and exposes a portion of the pixel electrode surrounded by the protective layer; a counter electrode facing the pixel electrode; and an intermediate layer, which is interposed between the pixel electrode and the counter electrode and includes a light-emitting layer and at least one organic layer, where the thickness of the intermediate layer is greater than the thickness of the protective layer. | 01-12-2012 |
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| 20080286187 | MESOPOROUS SILICA PARTICLES AND PREPARATION METHOD THEREOF - Disclosed are mesoporous silica particles and a preparation method thereof, particularly, a method of preparing mesoporous silica particles, including mixing a silica precursor, an alkylamine-based surfactant, and a phosphoric acid-based cosurfactant, thus preparing a mixture solution (a mother liquor); adding or not adding the mixture solution with an acid solution, and conducting stirring, thus providing mesoporous silica particles; and thermally treating the mesoporous silica particles. These mesoporous silica particles are prepared using a phosphoric acid-based cosurfactant for stabilizing the surface of the particles to prevent the aggregation thereof, thereby uniformly distributing the particles. Through a hydrothermal reaction, the mesoporous silica particles have various pore sizes, a large surface area, and a high pore volume, and thus are widely used in catalysts, adsorbents, low dielectrics, and separation and purification processes, and are useful as templates for the preparation of novel porous materials, including porous carbon. | 11-20-2008 |
| 20100239062 | COOLANT WITH DISPERSED NEUTRON POISON MICRO-PARTICLES, USED IN SCWR EMERGENCY CORE COOLING SYSTEM - Disclosed is a coolant with dispersed neutron poison micro-particles, used in a supercritical water-cooled reactor (SCWR) emergency core cooling system. Since the neutron poison micro-particles are uniformly dispersed in the coolant of the emergency core cooling system for a long period time, their fluidity is not lowered even though the polarity of water is changed in a supercritical state. Therefore, the neutron poison micro-particles absorb neutrons produced from nuclear fission in a nuclear reactor core. Accordingly, the neutron poison micro-particles can be appropriately used as a means for controlling neutrons and stopping a nuclear reactor in the SCWR emergency core cooling system. | 09-23-2010 |
