| Patent application number | Description | Published |
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| 20110100458 | Multi-layer thin film for encapsulation and method thereof - A multi-layer thin film for encapsulation and the method thereof are provided. The multi-layer thin film for encapsulation includes a protective layer composed of aluminum oxide, a single or double barrier layer composed of silicon nitride (SiN | 05-05-2011 |
| 20110108116 | P-type NiO conducting film for organic solar cell, a method for preparation of NiO conducting film, and an organic solar cell with enhanced light-to-electric energy conversion using the same - A p-type NiO conducting film for an organic solar cell, a preparation method thereof, and an organic solar cell using the same and having enhanced power conversion efficiency, are provided, wherein the NiO conducting film is fabricated by vacuum sputtering in which nickel or nickel oxide is used as a target material, and argon, oxygen or the mixed gas of the argon and the oxygen is supplied. The p-type NiO conducting film may be easily prepared by vacuum sputtering, and since a n-type conducting film is prepared by simply coating sol-phase precursor solution, the NiO conducting film and the organic solar cells having the NiO conducting film in the order of the NiO conducting film, a photoactive layer, and a n-type conducting film, have enhanced electric energy conversion. As a result, the provided disclosure is useful particularly when applied in organic solar cells and organic light emitting devices. | 05-12-2011 |
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| 20090038837 | Multilayered printed circuit board and manufacturing method thereof - A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board. | 02-12-2009 |
| 20090073670 | Multilayered printed circuit board and fabricating method thereof - A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability. | 03-19-2009 |
| 20090084494 | Substrate manufacturing method - A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate. | 04-02-2009 |
| 20090169837 | Package substrate and manufacturing method thereof - A package substrate and a method of manufacturing the package substrate are disclosed. The method of manufacturing the package substrate may include stacking a second metal layer in which at least one hole is formed over a first metal layer, stacking a barrier layer over the first metal layer exposed in the hole and over the second metal layer, forming at least one bump by filling the hole with a conductive metal, stacking an insulation layer over the bump and forming a circuit pattern over the insulation layer, and removing the first metal layer, the second metal layer, and the barrier layer. | 07-02-2009 |
| 20090236125 | Multi-layer board and manufacturing method thereof - A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times. | 09-24-2009 |
