Patent application number | Description | Published |
20080299061 | Skin Whitening Cosmetic Composition, Pack Containing the Same, and Preparation Method Thereof - A skin whitening cosmetic composition having excellent whitening effects without causing any side effects, which includes a carbonized pine cone, as well as a pack containing the same. The skin whitening cosmetic composition includes natural substances, unlike prior commercially available products, and has excellent whitening effects without causing any side effect since it is safe to the skin. When the whitening cosmetic composition is used as it is or as a pack together with a substrate, such as a nonwoven fabric, it will provide a functional pack that can impart whitening effects in addition to effects, such as skin moisturization and skin firming. | 12-04-2008 |
20080311229 | Functional Food Composition For Treating Allergy, Natural Tea Using the Same and the Manufacturing Method Thereof - A functional food composition for treating allergy, comprising | 12-18-2008 |
20090098223 | NATURAL PLANT EXTRACT COMPOSITION FOR PREVENTION AND RECOVERY OF HYPERLIPIDEMIA AND STROKE, NATURAL TEA CONTAINING THE SAME AS ACTIVE INGREDIENT AND METHOD FOR PREPARING THE NATURAL TEA - A natural plant extract composition for the recovery and prevention of hyperlipidemia and stroke, a natural tea comprising the same as an active ingredient, and a method for preparing the natural tea. The natural plant extract composition contains a | 04-16-2009 |
20100015256 | HAIR GROWTH STIMULANT AND PREPARATION METHOD THEREOF - A hair growth stimulant is provided. The hair growth stimulant uses carbonized chestnut burrs that exhibit excellent stimulatory effects on hair restoration and hair growth effects without causing side effect and toxicity. The hair growth stimulant exhibits excellent stimulatory effects on hair restoration without causing any side effect and toxicity in humans and stimulates hair roots to greatly contribute to hair growth. Therefore, the hair growth stimulant is effective in preventing hair loss and grayness. In addition, the hair growth stimulant is formulated into a cream or ointment preparation, which is highly effective in promoting the restoration of hair, to considerably shorten the time required for the treatment of hair loss. Furthermore, the hair growth stimulant uses vegetable ingredients only, thus causing no side effect in humans. Moreover, the hair growth stimulant is softly applicable to the scalp, thus offering convenience in use. | 01-21-2010 |
20100112097 | PHARMACEUTICAL COMPOSITION FOR PREVENTING AND TREATING CANCER AND HEALTH FOOD CONTAINING THE SAME FOR PREVENTING AND TREATING CANCER - A pharmaceutical composition for treating and preventing cancer, and health food for ameliorating and preventing cancer containing the pharmaceutical composition are provided. The pharmaceutical composition includes | 05-06-2010 |
20120225140 | COMPOSITION FOR COUNTERACTING SMOKING TOXICITY - The present invention relates to a composition for counteracting the toxicity of smoking. More particularly, the present invention relates to a composition including an extract from a whole tomato plant | 09-06-2012 |
20120225146 | COMPOSITION FOR ALLEVIATING FATTY LIVER - The present invention relates to a composition for improving fatty liver, including at least one selected from the group consisting of a whole tomato plant extract, a | 09-06-2012 |
20120251567 | LIVER FUNCTION ENHANCING COMPOSITION - The present invention relates to a composition for the improvement of hepatic functions. More particularly, the present invention relates to a composition including an extract from Albizia julibrissin Durazz as an active ingredient. | 10-04-2012 |
20130334683 | ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURING THE SAME - An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip. | 12-19-2013 |
20130334685 | EMBEDDED PACKAGES AND METHODS OF MANUFACTURING THE SAME - An embedded package that may be realized by surrounding a semiconductor chip (or a semiconductor die) in a package substrate. A semiconductor chip of an embedded package may be electrically connected to external connection terminals through interconnection wires instead of bumps, and the interconnection wires may be formed using a wire bonding process. A high reliability embedded package results. | 12-19-2013 |
20140015115 | SEMICONDUCTOR CHIPS HAVING IMPROVED SOLIDITY, SEMICONDUCTOR PACKAGES INCLUDING THE SAME AND METHODS OF FABRICATING THE SAME - Semiconductor chips are provided. The semiconductor chip includes a semiconductor chip body having an arch-shaped groove in a backside thereof and a non-conductive material pattern filling the arch-shaped groove. Related methods are also provided. | 01-16-2014 |
20140367851 | EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME - Embedded packages are provided. The embedded package includes a chip attached to a first surface of a core layer, a plurality of bumps on a surface of the chip opposite to the core layer, and a first insulation layer surrounding the core layer, the chip and the plurality of bumps. The first insulation layer has a trench disposed in a portion of the first insulation layer to expose the plurality of bumps. | 12-18-2014 |
20150056755 | ELECTRONIC DEVICE PACKAGES HAVING BUMPS AND METHODS OF MANUFACTURING THE SAME - An electronic device package includes a bump having a post disposed on a contact portion of a semiconductor chip and an enlarged portion laterally protruded from an upper portion of the post; an interconnection portion having a locking portion that substantially surrounds the enlarged portion and an upper sidewall of the post; and a dielectric layer substantially surrounding the bump and the locking portion to separate the interconnection portion from the semiconductor chip. | 02-26-2015 |