Jonathan A. Noquil, Bethlehem US
Jonathan A. Noquil, Bethlehem, PA US
Patent application number | Description | Published |
---|---|---|
20120248521 | Power Converter Having Integrated Capacitor - A power supply module ( | 10-04-2012 |
20120256239 | Ultra-Thin Power Transistor and Synchronous Buck Converter Having Customized Footprint - A packaged power transistor device ( | 10-11-2012 |
20130049077 | High Performance Power Transistor Having Ultra-Thin Package - A field-effect transistor package includes a leadframe with a first linear thickness ( | 02-28-2013 |
20130075893 | Synchronous Buck Converter Having Coplanar Array of Contact Bumps of Equal Volume - A packaged power supply module ( | 03-28-2013 |
20130077250 | DC-DC Converter Vertically Integrated with Load Inductor Structured as Heat Sink - A power supply converter ( | 03-28-2013 |
20140063744 | Vertically Stacked Power FETS and Synchronous Buck Converter Having Low On-Resistance - A power FET ( | 03-06-2014 |
20140245598 | FABRICATING A POWER SUPPLY CONVERTER WITH LOAD INDUCTOR STRUCTURED AS HEAT SINK - A method for fabricating a power supply converter comprises a load inductor wrapped by a metal sleeve structured to transform the inductor into a heat sink positioned to deposit layers of solder paste on a sleeve surface and on the inductor leads. A metal carrier having a portion of a first thickness and portions of a greater second thickness is placed on the solder layers of the inductor. The carrier portion of first thickness is aligned with the inductor sleeve. The carrier portions of second thickness are aligned with the inductor leads. A sync and a control FET are placed side-by-side on solder layers deposited on the carrier portion of first thickness opposite the inductor sleeve. Reflowing is preformed and the solder layers are solidified. The FETs, the carrier and the inductor become integrated and the un-soldered surfaces of the FETs and the carrier portions of second thickness become coplanar. | 09-04-2014 |
20140247562 | DC-DC CONVERTER VERTICALLY INTEGRATED WITH LOAD INDUCTOR STRUCTURED AS HEAT SINK - An apparatus includes a heat-generating component and a thermally inert component positioned in close proximity to the heat-generating component. A housing for the thermally inert component is in touch with the heat-generating component and is structured to transform the thermally inert component into a heat sink for the heat-generating component | 09-04-2014 |