| Patent application number | Description | Published |
|---|
| 20090001612 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION - An integrated circuit package system comprising: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure. | 01-01-2009 |
| 20090072375 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE - An integrated circuit package system with multi-chip module is provided including: providing an upper substrate having an upper chip thereon; positioning a lower chip under the upper chip, the lower chip having bottom interconnects thereon; encapsulating the upper chip and the lower chip with a chip encapsulant on the upper substrate with the bottom interconnects exposed; mounting the lower chip over a lower substrate with a gap between the chip encapsulant and the lower substrate; and filling the gap with a package encapsulant or chip attach adhesive. | 03-19-2009 |
| 20090108428 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A CONDUCTOR-FREE RECESS - A mountable integrated circuit package system includes: providing a carrier; mounting a first integrated circuit device over the carrier; mounting a substrate over the first integrated circuit device with the substrate having a conductor-free recess; connecting a first electrical interconnect under the conductor-free recess electrically connecting the carrier and the first integrated circuit device; and forming a package encapsulation over the carrier, the first integrated circuit device, the first electrical interconnect, the conductor-free recess, and partially exposing the substrate. | 04-30-2009 |
| 20090166834 | MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER - A mountable integrated circuit package system includes: forming a base integrated circuit package system includes: providing a first substrate, and forming a package encapsulation having a cavity over the first substrate with the first substrate partially exposed within the cavity; and mounting an interposer including a central aperture over the package encapsulation and the first substrate with the central aperture over the cavity. | 07-02-2009 |
| 20090283889 | INTEGRATED CIRCUIT PACKAGE SYSTEM - An integrated circuit package system includes: providing a heat spreader; attaching an upper substrate to the heat spreader, the upper substrate having an upper through-opening provided therein; attaching a top semiconductor die to the heat spreader through the upper through-opening, the top semiconductor die having a top die interconnect to the upper substrate; attaching a base substrate to the upper substrate, the base substrate having a base through-opening provided therein larger than the upper through-opening; and attaching an external interconnect connected to the base substrate. | 11-19-2009 |
| 20110057308 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming a conductive pillar, having substantially parallel vertical sides, in direct contact with the substrate; mounting an integrated circuit to the substrate beside the conductive pillar; and encapsulating the integrated circuit with an encapsulation having a top surface formed for the conductive pillar to extend beyond. | 03-10-2011 |
| 20110062602 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; connecting a base component directly to the base substrate; mounting a stack component over the base component; attaching a flattened exposed interconnect directly on the stack component; and applying an encapsulant over the stack component with a portion of the flattened exposed interconnect exposed. | 03-17-2011 |
| 20110115098 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: connecting an integrated circuit die with a bottom connection structure; placing an adhesive encapsulation over the integrated circuit die and the bottom connection structure with the bottom connection structure exposed; and placing a top connection structure over the adhesive encapsulation at an opposing side to the bottom connection structure. | 05-19-2011 |
