Inventors list |
Assignees list |
Classification tree browser |
Top 100 Inventors |
Top 100 Assignees |
John Yan
John Yan, Los Gatos, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20080234309 | MACROCYCLIC LACTONE COMPOUNDS AND METHODS FOR THEIR USE - The present invention provides a pharmaceutical composition comprising a pharmaceutically acceptable excipient and a compound of the formula: | 09-25-2008 |
| 20100086579 | MACROCYCLIC LACTONE COMPOUNDS AND METHODS FOR THEIR USE - The present invention provides a device for intracorporeal use including an implant or a temporary device and at least one source of a compound myolimus, or a derivative thereof. The present invention also provides a method of inhibiting cell proliferation by local administration of a therapeutically effective amount of a compound myolimus, or a derivative thereof. Further included in the present invention is a method of treating an ophthalmic condition or disease by administering a therapeutically effective amount of a compound myolimus, or a derivative thereof. | 04-08-2010 |
| 20110097364 | MACROCYCLIC LACTONE COMPOUNDS AND METHODS FOR THEIR USE - The present invention provides a pharmaceutical composition comprising a pharmaceutically acceptable excipient and a compound of the formula: | 04-28-2011 |
John Yan, Union City, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20100164124 | METHOD AND APPARATUS FOR MULTI-CHIP PACKAGING - A method and apparatus are provided for multi-chip packaging. A multi-chip package ( | 07-01-2010 |
John Yan, Libertyville, IL US
| Patent application number | Description | Published |
|---|---|---|
| 20090276392 | DYNAMIC SEQUENCING DISPLAY PROTOCOLS FOR MEDICAL IMAGING DATA - Certain embodiments of the present invention provide a method for configuring a medical imaging system, the method comprising: permitting a user to interact with a display protocol, said display protocol further comprising a plurality of rules; allowing said user to select a target rule from said plurality of rules; and facilitating said user to configure a condition for said target rule, wherein said display protocol is capable of a first execution when said condition is satisfied, and wherein the display protocol is capable of a second execution when said condition is not satisfied. In accordance with an embodiment, said condition further comprises at least one of: an entry condition and an exit condition. | 11-05-2009 |
| 20100063842 | SYSTEM AND METHODS FOR INDICATING AN IMAGE LOCATION IN AN IMAGE STACK - System and methods for indicating an image location in an image stack are disclosed. An example method includes generating an index of indications of medical image locations in a medical image stack including a first indication of a first medical image location in a medical image stack and a second indication of a second medical image location in the medical image stack, displaying in a user interface the first medical image and the first indication of the first medial image location within the medical image stack, receiving a scroll input and scroll through the index displaying indications of medical image locations in the image stack until the second indication of the second medical image is displayed, receiving a selection of the second indication of the second medical image, and displaying in the user interface the second medical image and the second indication of the second medical image location within the medical image stack. | 03-11-2010 |
John Yan, Fremont, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090289101 | METHOD FOR BALL GRID ARRAY (BGA) SOLDER ATTACH FOR SURFACE MOUNT - A method is provided for solder reflow which includes the steps of providing a receptacle having receptacle pads formed on an upper surface and placing a component on the receptacle, the component having a ball grid array of solder balls attached thereto. The component is placed on the receptacle in a manner which aligns the solder balls with the receptacle pads on the receptacle. The method further includes the steps of placing a weight having a predetermined size and a predetermined mass on top of the component to form a stack of the receptacle, the component and the weight, and reflowing the stack to attach the component to the receptacle by exposing the stack to high temperature to reflow the solder balls. | 11-26-2009 |