Patent application number | Description | Published |
20080250785 | Micromechanical device with gold alloy contacts and method of manufacture - A MEMS switch device is made using a gold alloy as the switch contact material. The increased mechanical hardness of the alloy compared to the pure gold prevents the contacts of the switch from welding together. A scrubbing action which occurs when the switch closes may allow the contact surfaces to come to rest where their surfaces are complementary, thus resulting in higher contact area and low contact resistance, despite the higher sheet resistance of the gold alloy material relative to the pure gold material. | 10-16-2008 |
20080277258 | MEMS plate switch and method of manufacture - Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. | 11-13-2008 |
20080278268 | Dual substrate MEMS plate switch and method of manufacture - Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. | 11-13-2008 |
20090023244 | Etching/bonding chamber for encapsulated devices and method of use - A method for activating a getter at low temperature for encapsulation in a device cavity containing a microdevice comprises etching a passivation layer off the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma etching process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then etches the passivation layer from the getter material, which is directly thereafter sealed within the device cavity of the microdevice, all within the etching/bonding chamber. | 01-22-2009 |
20090181488 | MEMS thermal actuator and method of manufacture - A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap. | 07-16-2009 |
20110024923 | Wafer level hermetic bond using metal alloy with keeper layer - Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate. At least one of the substrates may include a raised feature formed under at least one of the metal layers. One of the metal layer may have a diffusion barrier layer and a “keeper” layer formed thereover, wherein the keeper layers keeps the metal confined to a particular area. By using such a “keeper” layer, the substrate components may be heated to clean their surfaces, without activating or spending the bonding mechanism. | 02-03-2011 |
20110130721 | Configurable power supply using MEMS switch - Systems and methods for forming a configurable power supply uses a plurality of dual substrate MEMS switches to couple a plurality of power cells to provide a selectable, or variable, output voltage. The same circuit may output two different voltages to power two different circuits of the device, or may distribute the load evenly amongst the cells. Thus, the configurable power supply may extend the lifetime and improve the reliability of the device, or decrease its weight, size and cost. | 06-02-2011 |
20110155548 | Dual substrate MEMS plate switch and method of manufacture - Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have at least one shunt bar located at a nodal line of a vibrational mode of the deformable plate, so that the shunt bar remains relatively stationary when the plate is vibrating in that vibrational mode. A hermetic seal may be made around the device with a larger, secondary enclosure. Electrical access to the deformable plate may be accomplished by an electrical path which is independent of the seal. The electrical path may include a via through the first substrate or the second substrate, or a flash deposited on an external region of the switch. | 06-30-2011 |
20110250092 | Inlaid optical material and method of manufacture - An optical material is inlaid into a supporting substrate, with the top surface of the optical material flush with the top surface of the substrate, wherein the optical element is used to shape a beam of light travelling substantially parallel to the top surface of the substrate, but with the central axis of the beam below the top surface of the substrate. The optical elements serve to shape the beam of light for delivery to or from a microfabricated structure within the device. | 10-13-2011 |
20110295229 | In-plane electromagnetic mems pump - A micromechanical pumping system is formed on a substrate surface. The pumping system uses a pumping element which pumps a fluid through valves which move in a plane substantially parallel to the substrate surface. An electromagnetic actuating mechanism may also be fabricated on the surface of the substrate. Magnetic flux produced by a coil around a permeable core may be coupled to a permeable member affixed to a pumping element. The permeable member and pumping element may be configured to move in a plane parallel to the substrate. The electromagnetic actuating mechanism gives the pumping system a large throw and substantial force, such that the fluid pumped by the pumping system may be pumped through a transdermal cannula to deliver a therapeutic substance to the tissue underlying the skin of a patient. | 12-01-2011 |
20120080762 | Plating process and apparatus for through wafer features - A method for forming through features in a substrate uses a seed layer deposited over a first substrate, and a second substrate bonded to the seed layer. The features may be formed in the first substrate, by plating a conductive filler material onto the seed layer. The first substrate and the second substrate may then be bonded to a third substrate, and the second substrate is removed, leaving through features and first substrate adhered to the third substrate. The through features may provide at least one of electrical access and motion to a plurality of devices formed on the third substrate, or may impart movement to a moveable feature on the first substrate, wherein the third substrate supports the first substrate after removal of the second substrate. | 04-05-2012 |
20120132522 | Deposition/bonding chamber for encapsulated microdevices and method of use - A method for depositing a getter for encapsulation in a device cavity containing a microdevice comprises depositing the getter material while the device wafer and lid wafer are enclosed in a bonding chamber. A plasma sputtering process may be used, wherein by applying a large negative voltage to the lid wafer, a plasma is formed in the low pressure environment within the bonding chamber. The plasma then sputters the getter material from a getter target, and this getter material is directly thereafter sealed within the device cavity of the microdevice, all within the deposition/bonding chamber. | 05-31-2012 |
20120164718 | Removable/disposable apparatus for MEMS particle sorting device - A micromechanical particle sorting system uses a removable/disposable apparatus which may include a compressible device, a filter apparatus and a cell sorter chip assembly. The chip assembly may include a tubing strain relief manifold and a microfabricated cell sorting chip. The chip assembly may be detachable from the filter apparatus in order to mount the MEMS particle sorting chip adjacent to a force-generating apparatus which resides with the particle sorting system. A disturbance device installed in the particle sorting system may interact with a transducer on the removable/disposable apparatus to reduce clogging of the flow through the system. Using this removable/disposable apparatus, when the sample is changed, the entire apparatus can be thrown away with minimal expense and system down time. | 06-28-2012 |
20120190104 | MEMS Particle sorting actuator and method of manufacturing - A MEMS-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion. The movable structure is actuated by a separate force-generating apparatus, which is entirely separate from the movable structure formed on its substrate. This allows the movable structure to be entirely submerged in the sample fluid. | 07-26-2012 |
20120190105 | Cartridge for MEMS particle sorting system - A disposable cartridge is described which is compatible with a MEMS particle sorting device. The disposable cartridge may include passageways which connect fluid reservoirs in the cartridge with corresponding microfluidic passageways on the MEMS chip. A flexible gasket may prevent leakages and allow the fluid to cross the gasket barrier through a plurality of holes in the gasket. Vents and septums may also be included to allow air to escape and fluids to be inserted by hypodermic needle. A MEMS-based particle sorting system using the disposable cartridge is also described. | 07-26-2012 |
20120255373 | Multistage cartridge for MEMS particle storing system - A disposable cartridge is described which is equipped with a plurality of microfabricated particle sorting structures. The disposable cartridge may include passageways which connect fluid reservoirs in the cartridge with corresponding microfluidic passageways on the particle sorting structure. A flexible gasket may prevent leakages and allow the fluid to cross the gasket barrier through a plurality of holes in the gasket, allowing fluid to be transferred from the reservoirs to the microfabricated particle sorting structures. The plurality of particle sorting structures may be arranged in the disposable cartridge in order to perform multiple separation operations, such as a sequential or parallel sorting operation. | 10-11-2012 |
20120319303 | Wafer level hermetic bond using metal alloy with keeper layer - Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is formed by an alloy of two metal layers, one deposited on a first substrate and the other deposited on the second substrate. At least one of the substrates may include a raised feature formed under at least one of the metal layers. The two metals may for an alloy of a predefined stoichiometry in at least two locations on either side of the midpoint of the raised feature. This alloy may have advantageous features in terms of density, mechanical, electrical or physical properties that may improve the hermeticity of the seal, for example. | 12-20-2012 |
20140034555 | Particle manipulation system with cytometric capability - A MEMS-based particle manipulation system which uses a particle manipulation stage and a plurality of laser interrogation regions. The laser interrogation regions may be used to assess the effectiveness or accuracy of the particle manipulation stage. In one exemplary embodiment, the particle manipulation stage is a microfabricated, flap-type fluid valve, which sorts a target particle from non-target particles in a fluid stream. The laser interrogation stages are disposed in the microfabricated fluid channels at the input and output of the flap-type sorting valve. The laser interrogation regions may be used to assess the effectiveness or accuracy of the sorting, and to control or adjust sort parameters during the sorting process. | 02-06-2014 |
20140097129 | PARTICLE MANIPULATION SYSTEM WITH CYTOMETRIC CONFIRMATION - A MEMS-based particle manipulation system which uses a particle manipulation stage and a plurality of laser interrogation regions. The laser interrogation regions may be used to assess the effectiveness or accuracy of the particle manipulation stage. In one exemplary embodiment, the particle manipulation stage is a microfabricated valve, which sorts a target particle from non-target particles in a fluid stream. The laser interrogation stages are disposed in the microfabricated fluid channels at the input and output of the valve. By reversing the flow from output to input, the same laser interrogation region may be used to perform the cytometry. The cytometry may be performed throughout the sorting process to optimize or control the sorting, or may be performed afterward to allow a multi-pass, sequential sort to be performed on the same sample. | 04-10-2014 |
20150031120 | MEMS PARTICLE SORTING ACTUATOR AND METHOD OF MANUFACTURE - A MEMS-based system and a method are described for separating a target particle from the remainder of a fluid stream. The system makes use of a unique, microfabricated movable structure formed on a substrate, which moves in a rotary fashion about one or more fixed points, which are all located on one side of the axis of motion. The movable structure is actuated by a separate force-generating apparatus, which is entirely separate from the movable structure formed on its substrate. This allows the movable structure to be entirely submerged in the sample fluid. | 01-29-2015 |