| Patent application number | Description | Published |
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| 20090107685 | Wellhead Completion Assembly Capable of Versatile Arrangements - A wellhead completion assembly has a head connected to surface casing. A rotatable flange or the like can be used to connect various components to a threaded end of the head. A casing hanger installs in the head, and the hanger's upper end extends beyond the head's top edge. This exposed end has an external threaded connection to connect to various wellhead components using a rotatable flange or the like. For example, a locking ring can threadably connect to the head's threaded end to support the hanger in the head. Then, a rotatable flange can threadably connect to the hanger's exposed end so that another component, such as a completion spool or gate valve, can nippled up directly to the hanger. When the hanger is fluted, a pack-off assembly can allow testing off inner and outer sealing integrity via a test port accessible through an opening in the locking ring. | 04-30-2009 |
| 20100288483 | Wellhead Completion Assembly Capable of Versatile Arrangements - A wellhead completion assembly has a head connected to surface casing. A rotatable flange or the like can be used to connect various components to a threaded end of the head. A casing hanger installs in the head, and the hanger's upper end extends beyond the head's top edge. This exposed end has an external threaded connection to connect to various wellhead components using a rotatable flange or the like. For example, a locking ring can threadably connect to the head's threaded end to support the hanger in the head. Then, a rotatable flange can threadably connect to the hanger's exposed end so that another component, such as a completion spool or gate valve, can nippled up directly to the hanger. When the hanger is fluted, a pack-off assembly can allow testing off inner and outer sealing integrity via a test port accessible through an opening in the locking ring. | 11-18-2010 |
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| 20080224358 | Nano-Molding Process - A nano-molding process including an imprint process that replicates features sizes less than 7 nanometers. The nano-molding process produces a line edge roughness of the replicated features that is less than 2 nanometers. The nano-molding process including the steps of: a) forming a first substrate having nano-scale features formed thereon, b) casting at least one polymer against the substrate, c) curing the at least one polymer forming a mold, d) removing the mold from the first substrate, e) providing a second substrate having a molding material applied thereon, f) pressing the mold against the second substrate allowing the molding material to conform to a shape of the mold, g) curing the molding material, and h) removing the mold from the second substrate having the cured molding material revealing a replica of the first substrate. | 09-18-2008 |
| 20090212310 | SOFT LITHOGRAPHIC MOLDING OF SURFACE RELIEF OUTPUT COUPLERS FOR ORGANIC LIGHT EMITTING DIODES - The present invention provides a method and apparatus for surface relief output coupling in organic light emitting diodes is provided. The method includes forming a pattern in a surface of an elastomer ( | 08-27-2009 |
| 20100028614 | METHOD OF FORMING NANOSCALE FEATURES USING SOFT LITHOGRAPHY - The present invention provides a method of forming a molecular membrane using soft lithography. The method includes forming a pattern having at least one nanoscale feature in a moldable polymer composition and deploying at least a portion of the pattern adjacent a first substrate. | 02-04-2010 |
| 20100283069 | Optical systems fabricated by printing-based assembly - The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchability. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates. | 11-11-2010 |
| 20110170225 | High Resolution Printing of Charge - Provided are methods of printing a pattern of charge on a substrate surface, such as by electrohydrodynamic (e-jet) printing. The methods relate to providing a nozzle containing a printable fluid, providing a substrate having a substrate surface and generating from the nozzle an ejected printable fluid containing net charge. The ejected printable fluid containing net charge is directed to the substrate surface, wherein the net charge does not substantially degrade and the net charge retained on the substrate surface. Also provided are functional devices made by any of the disclosed methods. | 07-14-2011 |
| 20110266561 | Optical Systems Fabricated by Printing-Based Assembly - The present invention provides optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity. Optical systems of the present invention include, however, devices and device arrays provided on conventional rigid or semi-rigid substrates, in addition to devices and device arrays provided on flexible, shapeable and/or stretchable substrates. | 11-03-2011 |
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| 20090052111 | HIGH VOLTAGE CAPACITORS - A capacitor includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers and first and second external terminals attached to the ceramic capacitor body. The internal active electrodes within the ceramic capacitor body are configured in an alternating manner. Internal electrode shields within the ceramic capacitor body are used to assist in providing resistance to arc-over. The shields may include a top internal electrode shield and an opposite bottom internal electrode shield wherein the top internal electrode shield and the opposite bottom internal electrode shield are on opposite sides of the plurality of internal active electrodes and each internal electrode shield extends inwardly to or beyond a corresponding external terminal to thereby provide shielding. Side shields are used. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size. To further increase voltage breakdown, a coating on the ceramic capacitor may be used. | 02-26-2009 |
| 20090052112 | HIGH VOLTAGE CAPACITORS - A capacitor includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers and first and second external terminals attached to the ceramic capacitor body. The internal active electrodes within the ceramic capacitor body are configured in an alternating manner. Internal electrode shields within the ceramic capacitor body are used to assist in providing resistance to arc-over. The shields can include a top internal electrode shield and an opposite bottom internal electrode shield wherein the top internal electrode shield and the opposite bottom internal electrode shield are on opposite sides of the plurality of internal active electrodes and each internal electrode shield extends inwardly to or beyond a corresponding external terminal to thereby provide shielding. Side shields are used. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size. | 02-26-2009 |
| 20100033894 | HIGH VOLTAGE CAPACITORS - A multilayer ceramic capacitor component includes a ceramic capacitor body having opposite ends and comprised of a plurality of electrode layers and dielectric layers, first and second external terminals attached to the ceramic capacitor body. The plurality of electrode layers include a plurality of alternating layers of active electrodes extending inwardly from alternating ends of the ceramic capacitor body. The capacitor may include a plurality of side shields disposed within the plurality of alternating layers of active electrodes to provide shielding with the alternating layers of active electrodes having a pattern to increase overlap area to provide higher capacitance without decreasing separation between the alternative layers of active electrodes. The capacitor may have a voltage breakdown of 3500 volts DC or more in air. The capacitor may have a coating. The capacitor provides improved resistance to arc-over, high voltage breakdown in air, and allows for small case size. | 02-11-2010 |
