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| 20110026721 | BONE CONDUCTION DEVICE FITTING - Methods and systems for fitting a bone conduction device are provided herein. These methods and systems comprise determining a gain to be used by the bone conduction device in providing signals at a particular frequency. In determining the gain, a fitting system may provide a test sound that is modulated between a first signal provided to a speaker and a second audible signal provided to a bone conduction device. The first and second audible signal may comprise properties such that when the two signals are added together they produce a constant amplitude output. In an embodiment, each of the first and second audible signals may comprise substantially identical frequency characteristics and signal amplitudes, such as, for example, equal amplitude sinusoids centered on the particular frequency for the measurement. When each of these two audible signals are provided to a recipient of the bone conduction device, the recipient may perceive a variance in the intensity of the sounds when the intensity of the two sounds generated by the two audible signals do not give rise to the same psychophysical loudness. If the recipient perceives this variance, the gain of the bone conduction device may be adjusted to increase or decrease the loudness of the sound provided via the bone conduction device to reduce or eliminate the variance. | 02-03-2011 |
| 20110026748 | BONE CONDUCTION DEVICE FOR A SINGLE SIDED DEAF RECIPIENT - Methods and systems are provided for determining whether signals to be applied by a bone conduction device would be masked by signals arriving at the good ear of a single sided deaf patient. The bone conduction device then applies stimulation for frequency components of the sound received by the bone conduction device that would not be masked by sound received by the patient's good ear. In applying the stimulation, the bone conduction device may apply a gain to compensate for the head shadow effect. This gain may be determined by inverting at least a portion of a curve for the head shadow effect. | 02-03-2011 |
| 20110029031 | BIMODAL HEARING PROSTHESIS - A bimodal hearing prosthesis for rehabilitating the hearing of a recipient. The hearing prosthesis comprises: a sound processing unit configured to process a received sound signal; and an implantable bimodal stimulation system, comprising: a mechanical stimulation arrangement configured to generate waves of fluid motion in a recipient's inner ear fluid based on the processed sound signal; an electrode assembly configured to deliver electrical stimulation signals generated based on the processed sound signal to a recipient's cochlea. | 02-03-2011 |
| 20110034755 | IMPLANTABLE UNIVERSAL DOCKING STATION FOR PROSTHETIC HEARING DEVICES - A system for implantation in a recipient comprising: first and second functional implantable components configured to interoperate in order to stimulate the recipient's ear, and an implantable docking station having a plurality of interfaces, the interfaces comprising: a first interface configured to at least one of detachably mechanically and electrically connect to the first component, and at least a second interface configured to at least one of detachably mechanically and electrically connect to the second component, wherein one of the plurality of interfaces is configured to at least one of detachably mechanically and electrically connect to a third component, and wherein the third component is configured to perform an analogous function as one of the first and second components. | 02-10-2011 |
| 20110112462 | PHARMACEUTICAL AGENT DELIVERY IN A STIMULATING MEDICAL DEVICE - A stimulating medical device comprising a stimulating assembly implantable proximate to nerve cells of a recipient having at least one agent delivery port and a plurality of electrical contacts; an electrical stimulation controller configured to generate electrical stimulation signals for application to a first population of the nerve cells via one or more of the plurality of electrical contacts; a pharmaceutical agent source configured to provide a pharmaceutical agent to the at least one delivery port for application to a second population of the nerve cells; and a pharmaceutical agent controller configured to control one or more of the pharmaceutical agent source and the at least one delivery port to cause selective application of the pharmaceutical agent to the second population of nerve cells. | 05-12-2011 |
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| 20080274619 | CMP compositions containing a soluble peroxometalate complex and methods of use thereof - The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises (a) a catalytic oxidant comprising a water-soluble peroxometalate complex, an oxidizable precursor of a peroxometalate complex, or a combination thereof, (b) a particulate abrasive; and (c) an aqueous carrier. The peroxometalate complex and the precursor thereof each have a reduced form that is oxidizable by hydrogen peroxide to regenerate the peroxometalate complex during chemical-mechanical polishing. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided. | 11-06-2008 |
| 20090035942 | Ruthenium CMP compositions and methods - The present invention provides a chemical-mechanical polishing (CMP) composition for polishing a ruthenium-containing substrate in the presence of an oxidizing agent such as hydrogen peroxide without forming a toxic level of ruthenium tetroxide during the polishing process. The composition comprises a particulate abrasive (e.g., silica, alumina, and/or titania) suspended in an aqueous carrier containing a ruthenium-coordinating oxidized nitrogen ligand (N—O ligand), such as a nitroxide (e.g., 4-hydroxy-TEMPO). In the presence of the oxidizing agent, the N—O ligand prevents the deposition of ruthenium species having an oxidation state of IV or higher on the surface of the substrate, and concomitantly forms a soluble Ru(II) N—O coordination complex with oxidized ruthenium formed during CMP of the substrate. CMP methods for polishing ruthenium-containing surfaces with the CMP composition are also provided. | 02-05-2009 |
| 20090056231 | Copper CMP composition containing ionic polyelectrolyte and method - The CMP compositions of the invention comprise not more than about 1 percent by weight of a particulate abrasive, a polyelectrolyte, which preferably has a weight average molecular weight of at least about 10,000 grams-per-mole (g/mol), a copper-complexing agent, and an aqueous carrier therefor. The polyelectrolyte can be an anionic polymer (e.g., an acrylate polymer or copolymer) or a cationic polymer (e.g., poly(2-[(methacryloyloxy)ethyl] trimethyl-ammonium halide). When an anionic polyelectrolyte is utilized, the copper-complexing agent preferably comprises an amino polycarboxylate compound (e.g., iminodiacetic acid or a salt thereof). When a cationic polyelectrolyte is utilized, the copper-complexing agent preferably comprises an amino acid (e.g., glycine). Preferably, the particulate abrasive comprises metal oxide such as titanium dioxide or silicon dioxide. Methods of polishing copper-containing substrates with the compositions are also disclosed. | 03-05-2009 |
| 20090075566 | LOW PH BARRIER SLURRY BASED ON TITANIUM DIOXIDE - The invention provides a method of chemically-mechanically polishing a substrate. A substrate is contacted with a polishing pad and a polishing composition comprising an abrasive consisting of (A) particles consisting of titanium dioxide having a rutile structure and (B) particles consisting of titanium dioxide having an anatase structure, wherein an x-ray diffraction pattern of the particles has a ratio of X/Y of about 0.5 or more, wherein X is an intensity of a peak in an x-ray diffraction curve representing a d-spacing of about 3.24 Å, and Y is an intensity of a peak in an x-ray diffraction curve representing a d-spacing of about 3.51 Å, and water. The polishing component is moved relative to the substrate, and at least a portion of the substrate is abraded to polish the substrate. | 03-19-2009 |
| 20090090696 | SLURRIES FOR POLISHING OXIDE AND NITRIDE WITH HIGH REMOVAL RATES - The invention provides a chemical-mechanical polishing composition comprising (a) an abrasive selected from the group consisting of alumina, ceria, titania, and zirconia, (b) a cationic copolymer comprising (A) a cationic monomer comprising a quaternary amino group and (B) a nonionic monomer, and (c) water. The invention also provides a method of polishing a substrate using the aforementioned polishing composition. | 04-09-2009 |
| 20090134122 | Copper-passivating CMP compositions and methods - The present invention provides chemical-mechanical polishing (CMP) methods and compositions for polishing copper-containing substrates. The methods of the present invention entail abrading a surface of a copper-containing substrate with a CMP composition of the invention, preferably in the presence of an oxidizing agent (e.g., hydrogen peroxide). The CMP compositions of the invention comprise a particulate abrasive, a copper-complexing agent, a copper-passivating agent bearing an acidic OH group and an additional oxygen substituent in a 1,6 relationship to the acidic OH group, and an aqueous carrier. A preferred composition of the invention comprises about 0.01 to about 1 percent by weight of the particulate abrasive, about 0.1 to about 1 percent by weight of the copper-complexing agent, about 10 to about 1000 ppm of the copper-passivating agent. | 05-28-2009 |
