Patent application number | Description | Published |
20080266799 | Methods and Apparatuses for Cold Plate Stability - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The actuation load is configured to mechanically actuate the cold plate to a module. | 10-30-2008 |
20080308260 | COLD PLATE STABILITY - A cold plate assembly includes a cold plate with at least two plumbing ports. The cold plate assembly further includes a spring plate assembly, which applies an actuation load to the cold plate. The spring plate assembly includes a spring plate and a spring pin moveable in a slot of the spring plate assembly to maintain the actuation load. The actuation load is configured to mechanically actuate the cold plate to a module. | 12-18-2008 |
20090034198 | APPARATUS AND METHOD FOR ATTACHING HEATSINKS - An apparatus for attaching a heatsink to an electronic module mounted on a circuit card assembly includes a load frame; a load arm having a first end being pivotally coupled to one end of the load frame and a second end configured to receive at least a portion of a load screw therethrough; a spring plate disposed at an opposite end of the one end of the load frame, and configured to threadedly receive the load screw, opposite ends of the spring plate being retained while an intermediate portion threadedly receiving the at least a portion of the load screw is allowed to bow upwards toward a bottom of the opposite end of the load arm; and a heatsink disposed on the module. An intermediate portion of the load arm aligned with a center region of the module biases the heatsink toward the module when the load screw is threadedly engaged with the spring plate. | 02-05-2009 |
20110008994 | IMPLEMENTING ENHANCED CONNECTOR GUIDE BLOCK STRUCTURES FOR ROBUST SMT ASSEMBLY - A method and enhanced connector guide block structures implement robust connector assembly including robust Surface Mount Technology (SMT) connector assembly. A connector guide block includes a printed wiring board (PWB) mating face including at least one mounting screw hole provided within a mounting portion for receiving a mounting screw. The connector guide block is assembled with a printed wiring board (PWB) by inserting a respective non-bonding screw through an aligned opening in the PWB into guide block mounting hole and a gap is defined from an upper surface of the PWB below the guide block mounting portion. The gap is filled with an electrically nonconductive underfill material and cured. Another connector guide block structure includes an upper connector guide block portion and a lower connector guide block portion with a gap between the guide block portions filled with a selected electrically nonconductive underfill material and cured. | 01-13-2011 |
20110085313 | Motherboard Assembly for Interconnecting and Distributing Signals and Power - A system, method, and motherboard assembly are described for interconnecting and distributing signals and power between co-planar boards that function as a single motherboard. The motherboard assembly includes a multilayered first printed circuit board having opposed parallel first and second surfaces, each having at least one land grid array (LGA) disposed thereon. The assembly further includes at least one wiring layer (Y) designed to only electrically interconnect components on or within the first PCB, and at least one wiring layer (X) designed to only electrically connect the components on the first PCB to a multilayered second PCB. The multilayered second PCB has opposed parallel first and second surfaces, the first surface having at least one LGA disposed thereon. It further includes at least one wiring layer (V) designed to only electrically interconnect components on or within the second PCB, and at least one layer (X) designed to only electrically interconnect the components on the second PCB with the components on the first PCB. A first LGA interposer couples to the LGA disposed on the first surface of the first PCB, and electrically connects at least one component to the first PCB. A second LGA interposer is sandwiched between and couples to the LGA disposed on the second surface of the first PCB and to the LGA disposed on the first surface of the second PCB. It electrically connects the first PCB to components on the second PCB. | 04-14-2011 |
20120147563 | IMPLEMENTING LOADING AND HEAT REMOVAL FOR HUB MODULE ASSEMBLY - A method and apparatus are provided for implementing loading and heat removal for a hub module assembly. The hub module assembly includes a hub chip and a plurality of optical modules attached by land grid array (LGA) assembly disposed on a top surface metallurgy (TSM) LGA residing on a hub ceramic substrate. The ceramic substrate is connected to a circuit board through a bottom surface metallurgy (BSM) LGA assembly. A base alignment ring includes a plurality of alignment features for engaging the circuit board and locating an LGA interposer of the BSM LGA assembly. Each of a pair of top alignment rings includes cooperating alignment features for engaging and locating a respective LGA interposer of respective LGA sites of the TSM LGA assembly. The two LGA interposers of the TSM LGA assembly align, retain, and make the electrical connection between the optical modules and the hub chip. | 06-14-2012 |
20130055192 | Motherboard Assembly for Interconnecting and Distributing Signals and Power - Mechanisms for interconnecting and distributing signals and power between PCBs are provided. A first PCB having land grid arrays (LGAs) and a first wiring layer designed for interconnect components on the first PCB, and a second wiring layer for connecting the components to a second PCB, are provided. The second PCB has opposed parallel first and second surfaces, the first surface having a LGA. A wiring layer designed to interconnect components on the second PCB, and a layer for interconnecting the components on the second PCB with the components on the first PCB, are provided. A first interposer couples to a LGA of a first surface of the first PCB and connects a component to the first PCB. A second interposer is sandwiched between and couples to a LGA of a second surface of the first PCB and to the LGA of the first surface of the second PCB. | 02-28-2013 |
20140127915 | IMPLEMENTING CONNECTION OF TWO LARGE ELECTRONIC BOARDS UTILIZING LGA INTERCONNECT - A method and apparatus are provided for implementing electrical connection of two large circuit cards through multiple discrete land grid array (LGA) sites. Each of the circuit cards includes a plurality of LGA sites. A first circuit card includes a plurality of LGA interposers locally aligned at the respective LGA sites of the first circuit card. A board-to-board connection hardware assembly connecting a second circuit card to the first circuit card includes a elongated carrier defining a cavity receiving a plurality of load springs coupled to an associated bearing block for loading and maintaining flatness of the LGA sites. | 05-08-2014 |
20140268575 | IMPLEMENTING HEAT SINK LOADING HAVING MULTIPOINT LOADING WITH ACTUATION OUTBOARD OF HEATSINK FOOTPRINT - A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load spring passing through the heat sink, the load spring having a latch arm at a first end and a load screw at a second end actuating the load spring, the load spring when actuated is configured to bear against the raised points to equalize pressure distribution over one or more semiconductor chips on the electronic module. | 09-18-2014 |