Patent application number | Description | Published |
20130010400 | SINTERING OF HIGH TEMPERATURE CONDUCTIVE AND RESISTIVE PASTES ONTO TEMPERATURE SENSITIVE AND ATMOSPHERIC SENSITIVE MATERIALS - An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic. | 01-10-2013 |
20130016488 | STACKED LEADED ARRAY - A stacked leaded array is provided wherein the stacked leaded array allows for increased packing density of electronic components. The stacked leaded array has a multiplicity of electronic components in a stacked array. Each electronic component comprises a first termination and a second termination. A multiplicity of first leads are provided wherein each first lead is in electrical contact with at least one first termination. Second leads are in electrical contact with second terminations. | 01-17-2013 |
20130284501 | COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT - An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame. | 10-31-2013 |
20130314845 | Method of Improving Electromechanical Integrity of Cathode Coating to Cathode Termination Interfaces in Solid Electrolytic Capacitors - A solid electrolytic capacitor is described which comprises an anode, a dielectric on the anode and a cathode on the dielectric. A conductive coating is on the cathode wherein the conductive layer comprises an exterior surface of a first high melting point metal. An adjacent layer is provided comprising a second high melting point metal, wherein the first high melting point metal and the second high melting point metal are metallurgically bonded with a low melting point metal. | 11-28-2013 |
20140002952 | Leadless Multi-Layered Ceramic Capacitor Stacks | 01-02-2014 |
20140139971 | Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials - An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic. | 05-22-2014 |
20140160624 | Multi-Layered Ceramic Capacitor with Soft Leaded Module - An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp. | 06-12-2014 |
20140177132 | Electronic Component Termination and Assembly by Means of Transient Liquid Phase Sintering Metalurgical Bonds - An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode. | 06-26-2014 |