| Patent application number | Description | Published |
|---|
| 20090174990 | System For Coupling Interfacing Parts - An electronic device is disclosed. The electronic device includes a first subassembly having a first housing component. The first housing component has an opening. The electronic device also includes a second subassembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is also movable relative to the second subassembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening. | 07-09-2009 |
| 20100119634 | CARBON COMPOSITE MOLD DESIGN - A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection. | 05-13-2010 |
| 20100240259 | AUDIO JACK WITH POGO PINS FOR CONDUCTIVE CONTACTS - An audio jack can allow electrical connections between an audio plug and an electronic device. The audio jack can include a series of pogo pins operative to extend into an audio jack cavity to provide conductive contacts for an audio plug placed within the audio jack. When an audio plug is inserted in the audio jack, the deflectable tips of each pogo pin can deflect and contact audio plug contact portions or regions. The end of the pogo pins opposite the deflectable tips can be coupled to an appropriate electronic device component, such as a printed circuit board, flex circuit, cable, or any other suitable component to provide a conductive path for signals between the audio plug and the electronic device. | 09-23-2010 |
| 20100254111 | SYSTEM FOR COUPLING INTERFACING PARTS - An electronic device is disclosed. The electronic device includes a first sub assembly having a first housing component. The first housing component has an opening. The electronic device also includes a second sub assembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is accessible through the opening. The at least one internal component is also movable relative to the second sub assembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening. | 10-07-2010 |
| 20110038120 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-17-2011 |
