Patent application number | Description | Published |
20090174990 | System For Coupling Interfacing Parts - An electronic device is disclosed. The electronic device includes a first subassembly having a first housing component. The first housing component has an opening. The electronic device also includes a second subassembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is also movable relative to the second subassembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening. | 07-09-2009 |
20100119634 | CARBON COMPOSITE MOLD DESIGN - A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection. | 05-13-2010 |
20100240259 | AUDIO JACK WITH POGO PINS FOR CONDUCTIVE CONTACTS - An audio jack can allow electrical connections between an audio plug and an electronic device. The audio jack can include a series of pogo pins operative to extend into an audio jack cavity to provide conductive contacts for an audio plug placed within the audio jack. When an audio plug is inserted in the audio jack, the deflectable tips of each pogo pin can deflect and contact audio plug contact portions or regions. The end of the pogo pins opposite the deflectable tips can be coupled to an appropriate electronic device component, such as a printed circuit board, flex circuit, cable, or any other suitable component to provide a conductive path for signals between the audio plug and the electronic device. | 09-23-2010 |
20100254111 | SYSTEM FOR COUPLING INTERFACING PARTS - An electronic device is disclosed. The electronic device includes a first sub assembly having a first housing component. The first housing component has an opening. The electronic device also includes a second sub assembly having a second housing component. The second housing component cooperates with the first housing component to enclose components of an electronic device. The at least one internal component is accessible through the opening. The at least one internal component is also movable relative to the second sub assembly so as to properly align with the opening. The at least one internal component is additionally magnetically attracted towards the first housing component near the opening. | 10-07-2010 |
20110038120 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-17-2011 |
20120057297 | HEAT DISSIPATION IN COMPUTING DEVICE - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 03-08-2012 |
20120302670 | CARBON COMPOSITE MOLD DESIGN - A mold assembly or system includes a moldbase that holds mold inserts and has embedded fluid lines to facilitate cooling during part formation. Mold inserts combine to form mold cavities that receive carbon fiber and resin components to form a carbon composite based part. A permanent release coating along a mold component surface that contacts the carbon fiber and resin components facilitates the release of the finished part from the mold component. Guide pins and guide pin receiving holes facilitate accurate alignment of mold components. Ejector pins within respective ejector pin shafts help eject a finished part from a respective mold component. An ejector pin shaft cover transfers force from an ejector pin to eject a finished part and also prevents substantial passage of resin into the ejector pin shaft. A fluid actuated ejection system provides fluid based mechanical forces to the ejector pins to facilitate finished part ejection. | 11-29-2012 |
20130040470 | MAGNETIC INSERT AND RECEPTACLE FOR CONNECTOR SYSTEM - A magnetic connector system having a durable and reliable construction and a reduced height while maintaining sufficient holding strength. A connector insert may utilize a crimping piece to crimp a braiding of a cable. The crimping piece may be fixed to an attraction plate and a board in the insert for mechanical reliability. Retention clips may be used to fix a shell to the attraction plate. A connector receptacle may employ a magnetically conductive label to improve holding strength. | 02-14-2013 |
20130095690 | SPRING-LOADED CONTACTS - Spring-loaded contacts having an improved reliability. One example may provide spring-loaded contacts having a reduced likelihood of entanglement between a spring and a plunger. For example, a piston may be placed between a plunger and a spring. The piston may have a head portion that is wider than the diameter of the spring and located between the spring and the plunger to isolate the spring and the plunger. In these and other examples, an additional object, such as a sphere, may be placed between the plunger and spring. In another example, two additional objects, such as two spheres, may be placed between a plunger and piston. | 04-18-2013 |
20130316549 | ELECTROMAGNETIC CONNECTOR FOR ELECTRONIC DEVICE - An electrical plug and receptacle relying on magnetic force from an electromagnet to maintain contact are disclosed. The plug and receptacle can be used as part of a power adapter for connecting an electronic device, such as a laptop computer, to a power supply. The plug includes electrical contacts, which are preferably biased toward corresponding contacts on the receptacle. The plug and receptacle each have a magnetic element. The magnetic element on one of the plug or receptacle can be a magnet or ferromagnetic material. The magnetic element on the other of the plug or receptacle is an electromagnet. When the plug and receptacle are brought into proximity, the magnetic attraction between the electromagnet magnet and its complement, whether another magnet or a ferromagnetic material, maintains the contacts in an electrically conductive relationship. | 11-28-2013 |
20130330983 | SPRING-LOADED CONTACTS HAVING SLOPED BACKSIDE WITH RETENTION GUIDE - A spring-loaded contact may include a barrel to form a housing for the spring-loaded contact, a plunger at least partially enclosed by the barrel, a spring enclosed by the barrel, and a sphere between the plunger and the spring. A back of the plunger may be formed at an angle and to include a retention guide, the retention guide partly over the sphere such that the sphere may be in contact with the back of the plunger and the retention guide. | 12-12-2013 |
Patent application number | Description | Published |
20090040698 | COMPUTER COMPONENT PROTECTION - A computing device is disclosed. The computing device includes a shock mount assembly that is configured to provide impact absorption to sensitive components such as a display and an optical disk drive. The computing device also includes an enclosureless optical disk drive that is housed by an enclosure and other structures of the computing device. The computing device further includes a heat transfer system that removes heat from a heat producing element of the computing device. The heat transfer system is configured to thermally couple the heat producing element to a structural member of the computing device so as to sink heat through the structural member, which generally has a large surface area for dissipating the heat. | 02-12-2009 |
20090110872 | Composite Laminate Having An Improved Cosmetic Surface And Method Of Making Same - A composite laminate includes a plurality of sheets of prepreg stacked one over another, and a scrim layer provided on an exterior surface of the sheets of prepreg. Each prepreg sheet is formed of fibers preimpregnated with resin. The scrim layer and the sheets of prepreg form a composite laminate whereby the scrim layer constitutes an outer, exposed surface of the composite laminate. The scrim layer may be a nonwoven carbon or glass fiber scrim that has absorbed resin from the sheets of prepreg. A method of making a composite laminate includes placing into a mold a scrim and a plurality of sheets of prepreg, with the scrim extending between an exterior surface of the sheets of prepreg and an inner surface of the mold; forming a composite laminate whereby the scrim is adhered to the sheets of prepreg; and removing the composite laminate from the mold. An outer layer of the composite laminate includes the scrim. | 04-30-2009 |
20110210476 | Composite Laminate Having An Improved Cosmetic Surface And Method Of Making Same - A composite laminate includes a plurality of sheets of prepreg stacked one over another, and a scrim layer provided on an exterior surface of the sheets of prepreg. Each prepreg sheet is formed of fibers preimpregnated with resin. The scrim layer and the sheets of prepreg form a composite laminate whereby the scrim layer constitutes an outer, exposed surface of the composite laminate. The scrim layer may be a nonwoven carbon or glass fiber scrim that has absorbed resin from the sheets of prepreg. A method of making a composite laminate includes placing into a mold a scrim and a plurality of sheets of prepreg, with the scrim extending between an exterior surface of the sheets of prepreg and an inner surface of the mold; forming a composite laminate whereby the scrim is adhered to the sheets of prepreg; and removing the composite laminate from the mold. An outer layer of the composite laminate includes the scrim. | 09-01-2011 |