Patent application number | Description | Published |
20090110408 | Laser Optical Transmission System with Dual Modulation - An optical transmitter for generating a modulated optical signal for transmission over dispersive fiber optic links in which a first information-containing radio frequency signal input is applied to a modulation circuit for directly modulating a semiconductor laser with the signal input. The output of the laser is applied to a phase modulator to which a second information-containing radio frequency signal is applied. | 04-30-2009 |
20090232503 | OPTICAL TRANSCEIVER WITH OPTICAL MULTIPLEXER ON A FLEXIBLE SUBSTRATE - An optical transceiver for converting and coupling an information-containing electrical signal with an optical fiber including an optical fiber coiled over at least a portion of its length; a support element disposed in the transceiver module; a substrate for securing said coiled optical fiber to said support element to enable said coiled fiber to bend from a first direction to a second opposite direction inside said transceiver module; and an optical multiplexer secured to said substrate for receiving first and second optical fibers and multiplexing respective optical signals on said first and second optical fibers into a multi-wavelength beam onto a third optical fiber. | 09-17-2009 |
20110085572 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER - A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 04-14-2011 |
20110085577 | METHOD AND SYSTEM OF HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION - A hybrid integrated optical device includes a substrate comprising a silicon layer and a compound semiconductor device bonded to the silicon layer. The device also includes a bonding region disposed between the silicon layer and the compound semiconductor device. The bonding region includes a metal-semiconductor bond at a first portion of the bonding region. The metal-semiconductor bond includes a first pad bonded to the silicon layer, a bonding metal bonded to the first pad, and a second pad bonded to the bonding metal and the compound semiconductor device. The bonding region also includes an interface assisted bond at a second portion of the bonding region. The interface assisted bond includes an interface layer positioned between the silicon layer and the compound semiconductor device, wherein the interface assisted bond provides an ohmic contact between the silicon layer and the compound semiconductor device. | 04-14-2011 |
20110267676 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF AN OPTO-ELECTRONIC INTEGRATED CIRCUIT - An opto-electronic integrated circuit (OEIC) includes an SOI substrate, a set of composite optical transmitters, a set of composite optical receivers, and control electronics disposed in the substrate and electrically coupled to the set of composite optical transmitters and receivers. Each of the composite optical transmitters includes a gain medium including a compound semiconductor material and an optical modulator. Each of the composite optical receivers includes a waveguide disposed in the SOI substrate, an optical detector bonded to the SOI substrate, and a bonding region disposed between the SOI substrate and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region and a direct semiconductor-semiconductor bond at a second portion of the bonding region. The OEIC also includes control electronics disposed in the SOI substrate and electrically coupled to the set of composite optical transmitters and the set of composite optical receivers. | 11-03-2011 |
20120057079 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER FOR A CABLE TV TRANSMITTER - A cable television transmitter includes a substrate including a silicon material, control electronics disposed in the substrate, and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The cable television transmitter also includes an optical modulator optically coupled to the gain medium and electrically coupled to the control electronics, a waveguide disposed in the substrate and optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The cable television transmitter further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 03-08-2012 |
20120057609 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER AND A MACH ZEHNDER MODULATOR - A tunable pulsed laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable pulsed laser also includes a waveguide disposed in the substrate and optically coupled to the gain medium, an optical modulator optically coupled to the gain medium, a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, and a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate. The tunable pulsed laser further includes an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide and an output mirror. | 03-08-2012 |
20120057610 | METHOD AND SYSTEM FOR HYBRID INTEGRATION OF A TUNABLE LASER AND A PHASE MODULATOR - A tunable laser includes a substrate comprising a silicon material and a gain medium coupled to the substrate. The gain medium includes a compound semiconductor material. The tunable laser also includes an optical modulator optically coupled to the gain medium, a phase modulator optically coupled to the optical modulator, and a waveguide disposed in the substrate and optically coupled to the gain medium. The tunable laser further includes a first wavelength selective element characterized by a first reflectance spectrum and disposed in the substrate, a second wavelength selective element characterized by a second reflectance spectrum and disposed in the substrate, an optical coupler disposed in the substrate and joining the first wavelength selective element, the second wavelength selective element, and the waveguide, and an output mirror. | 03-08-2012 |
20120057816 | METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING OF WAVEGUIDE RECEIVERS - A composite integrated optical device includes a substrate including a silicon layer and a waveguide disposed in the silicon layer. The composite integrated optical device also includes an optical detector bonded to the silicon layer and a bonding region disposed between the silicon layer and the optical detector. The bonding region includes a metal-assisted bond at a first portion of the bonding region. The metal-assisted bond includes an interface layer positioned between the silicon layer and the optical detector. The bonding region also includes a direct semiconductor-semiconductor bond at a second portion of the bonding region. | 03-08-2012 |
20120149148 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the SOI substrate and the assembly substrate, joining the SOI substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 06-14-2012 |
20120264256 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 10-18-2012 |
20130142474 | SYSTEMS AND METHODS FOR PHOTONIC POLARIZATION BEAM SPLITTERS - An integrated photonic polarization beam splitter includes an optical coupler having an input port, a first output port, and a second output port. The optical coupler is operable to couple a portion of an input light beam at the input port into the first output port and another portion of the input light beam into the second output port. The integrated photonic polarization beam splitter also includes a first waveguide having a first linear polarizer embedded therein and coupled to the first output port of the optical coupler and a second waveguide having a second linear polarizer embedded therein and coupled to the second output port of the optical coupler. | 06-06-2013 |
20130142475 | SYSTEMS AND METHODS FOR PHOTONIC POLARIZATION ROTATORS - A waveguide polarization rotator includes a substrate having a surface and a waveguide coupled to the surface of the substrate and operable to support a light beam along a direction of beam propagation. The waveguide includes a slab having a support surface and a second surface opposing the support surface and a rib protruding from the second surface of the slab in a direction substantially normal to the surface of the substrate and extending along the direction of beam propagation. The rib includes a first portion extending to a first height above the second surface of the slab and a second portion adjacent to the first portion and extending to a second height above the second surface of the slab. The second height is less than the first height. | 06-06-2013 |
20130142476 | SYSTEMS AND METHODS FOR PHOTONIC POLARIZATION-SEPARATING APPARATUSES FOR OPTICAL NETWORK APPLICATIONS - An integrated photonic polarization-separating apparatus includes a first waveguide polarization beam splitter (PBS) having a first port, a second port, a third port, and a fourth port and a first polarization rotator optically coupled to the first port of the first waveguide PBS. The apparatus also includes a first Faraday rotator optically coupled to the first polarization rotator and a second polarization rotator optically coupled to the second port of the first waveguide PBS. The apparatus further includes a second Faraday rotator optically coupled to the second polarization rotator and a second waveguide PBS having a first port, a second port, a third port, and a fourth port. The third port is optically coupled to the first Faraday rotator and the fourth port is optically coupled to the second Faraday rotator. | 06-06-2013 |
20130210214 | VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure. | 08-15-2013 |
20130302920 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 11-14-2013 |
20140050241 | Semiconductor Device And Method For Producing Light And Laser Emission - A method for producing light emission, including the following steps: providing a transistor structure that includes a semiconductor base region disposed between a semiconductor emitter region and a semiconductor collector region; providing a cascade region between the base region and the collector region, the cascade region having a plurality of sequences of quantum size regions, the quantum size regions of the sequences varying, in the direction toward the collector region, from a relatively higher energy state to a relatively lower energy state; providing emitter, base and collector electrodes respectively coupled with the emitter, base, and collector regions; and applying electrical signals with respect to the emitter, base, and collector electrodes to cause and control light emission from the cascade region. | 02-20-2014 |
20140179036 | METHOD AND SYSTEM FOR HETEROGENEOUS SUBSTRATE BONDING FOR PHOTONIC INTEGRATION - A method of fabricating a composite integrated optical device includes providing a substrate comprising a silicon layer, forming a waveguide in the silicon layer, and forming a layer comprising a metal material coupled to the silicon layer. The method also includes providing an optical detector, forming a metal-assisted bond between the metal material and a first portion of the optical detector, forming a direct semiconductor-semiconductor bond between the waveguide, and a second portion of the optical detector. | 06-26-2014 |
20140342500 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING - A method of fabricating a composite semiconductor structure includes providing a substrate including a plurality of devices and providing a compound semiconductor substrate including a plurality of photonic devices. The method also includes dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method further includes providing an assembly substrate, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, aligning the substrate and the assembly substrate, joining the substrate and the assembly substrate to form a composite substrate structure, and removing at least a portion of the assembly substrate from the composite substrate structure. | 11-20-2014 |