Johannes Stahr
Johannes Stahr, St. Lorenzen AT
Patent application number | Description | Published |
---|---|---|
20110067908 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD AND USE AND PRINTED CIRCUIT BOARD - The invention relates to a method for fixing a component ( | 03-24-2011 |
20140000941 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD OR A PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT, AND PRINTED CIRCUIT BOARD OR PRINTED CIRCUIT BOARD INTERMEDIATE PRODUCT | 01-02-2014 |
20140216795 | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( | 08-07-2014 |
20140376196 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD - The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board. | 12-25-2014 |
Johannes Stahr, Bruck AT
Patent application number | Description | Published |
---|---|---|
20090101398 | Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component - In a method for fixing an electronic component ( | 04-23-2009 |
20100009178 | NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR - The invention relates to a nonstick material for use during removal of a part ( | 01-14-2010 |
20100025086 | METHOD FOR PRODUCING A FLEXI-RIGID PRINTED CIRCUIT BOARD AND FLEXI-RIGID PRINTED CIRCUIT BOARD - The invention relates to a method for producing a flexi-rigid printed circuit board, at least one rigid zone ( | 02-04-2010 |
20100059262 | METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE - The invention relates to a method for removing a part of a substantially planar material layer ( | 03-11-2010 |
20110069448 | METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD - This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component ( | 03-24-2011 |
20130149506 | NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR - The invention relates to a nonstick material for use during removal of a part ( | 06-13-2013 |
20140307403 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD - This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component ( | 10-16-2014 |
Johannes Stahr, Bruck An Der Mur AT
Patent application number | Description | Published |
---|---|---|
20090229867 | METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD ELEMENT AS WELL AS A PRINTED CIRCUIT BOARD ELEMENT - A circuit board element and production thereof are disclosed, whereby a noble metal is applied to a structured conductor layer on a circuit board substrate, comprising said conductor layer. The conductor layer is roughened on the surface, preferably after the structuring thereof and the noble metal applied as a layer, essentially on all of the structured roughened conductor layer, whereupon the noble metal layer surface is given a corresponding roughness. | 09-17-2009 |
20110051384 | PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT - A printed circuit board element ( | 03-03-2011 |
Johannes Stahr, St. Lorenzen/murztal AT
Patent application number | Description | Published |
---|---|---|
20110272177 | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( | 11-10-2011 |
20120275124 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD - In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one device or one conductive component, wherein printed circuit board regions ( | 11-01-2012 |
Johannes Stahr, St.lorenzen AT
Patent application number | Description | Published |
---|---|---|
20130008703 | METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD COMPRISING AN ELECTRONIC COMPONENT INTEGRATED THEREIN - In a method for integrating a component ( | 01-10-2013 |