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Johannes Stahr
Johannes Stahr, St. Lorenzen AT
| Patent application number | Description | Published |
|---|---|---|
| 20110067908 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD AND USE AND PRINTED CIRCUIT BOARD - The invention relates to a method for fixing a component ( | 03-24-2011 |
Johannes Stahr, Bruck AT
| Patent application number | Description | Published |
|---|---|---|
| 20090101398 | Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component - In a method for fixing an electronic component ( | 04-23-2009 |
| 20100009178 | NONSTICK MATERIAL, METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE AND USE THEREFOR - The invention relates to a nonstick material for use during removal of a part ( | 01-14-2010 |
| 20100025086 | METHOD FOR PRODUCING A FLEXI-RIGID PRINTED CIRCUIT BOARD AND FLEXI-RIGID PRINTED CIRCUIT BOARD - The invention relates to a method for producing a flexi-rigid printed circuit board, at least one rigid zone ( | 02-04-2010 |
| 20100059262 | METHOD FOR REMOVING A PART OF A PLANAR MATERIAL LAYER AND MULTILAYER STRUCTURE - The invention relates to a method for removing a part of a substantially planar material layer ( | 03-11-2010 |
| 20110069448 | METHOD FOR INTEGRATING AT LEAST ONE ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD - This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component ( | 03-24-2011 |
Johannes Stahr, Bruck An Der Mur AT
| Patent application number | Description | Published |
|---|---|---|
| 20090229867 | METHOD FOR MANUFACTURING A PRINTED CIRCUIT BOARD ELEMENT AS WELL AS A PRINTED CIRCUIT BOARD ELEMENT - A circuit board element and production thereof are disclosed, whereby a noble metal is applied to a structured conductor layer on a circuit board substrate, comprising said conductor layer. The conductor layer is roughened on the surface, preferably after the structuring thereof and the noble metal applied as a layer, essentially on all of the structured roughened conductor layer, whereupon the noble metal layer surface is given a corresponding roughness. | 09-17-2009 |
| 20110051384 | PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT - A printed circuit board element ( | 03-03-2011 |
Johannes Stahr, St. Lorenzen/murztal AT
| Patent application number | Description | Published |
|---|---|---|
| 20110272177 | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( | 11-10-2011 |