| Patent application number | Description | Published |
|---|
| 20080292780 | Method of inspecting a substrate and method of preparing a substrate for lithography - A method of inspecting a substrate with first and second layers thereon is disclosed. The method includes directing a beam of electromagnetic radiation at an acute angle towards an edge of the layers, detecting scattered and/or reflected electromagnetic radiation, and establishing, from results of the detecting, whether an edge of the second layer overlaps an edge of the first layer. | 11-27-2008 |
| 20090100391 | Overlay Measurement on Double Patterning Substrate - A method of measuring overlay between a first structure and a second structure on a substrate is provided. The structures include equidistant elements, such as parallel lines, wherein the equidistant elements of the first and second structure alternate. A design width CD | 04-16-2009 |
| 20090148796 | Lithographic Method - A method for providing a pattern on a substrate is disclosed. The method includes providing a first pattern in a first layer of photoresist and a first layer of bottom anti-reflective coating material on the substrate, etching the first pattern into the substrate, providing a second layer of photoresist and a second layer of bottom anti-reflective coating material on the substrate, providing a second pattern in the second layers of photoresist and bottom anti-reflective coating material, and etching the second pattern into the substrate, the first and second patterns on the substrate together defining the pattern. | 06-11-2009 |
| 20100165312 | Method of Determining a Characteristic - A plurality of targets including a second population superimposed on a first population are formed. In the first target the second population has an asymmetry with respect to the first population. In the second target the second population has a different asymmetry with respect to the first population. Reflected radiation is detected from both the targets and used to determine different characteristics of the underlying populations. | 07-01-2010 |
| 20100227280 | Method of Measuring a Characteristic - During a multiple patterning process every n | 09-09-2010 |
| 20100328636 | Producing a Marker Pattern and Measurement of an Exposure-Related Property of an Exposure Apparatus - In order to determine whether an exposure apparatus is projecting patterns correctly, a marker pattern is used on a mask for printing a specific marker structure onto a substrate. This marker is then measured by an inspection apparatus to determine whether there are errors in exposure-related properties such as focus and dose. The projection of the marker pattern is modified so as to accentuate the production of side lobe-induced features of the marker structure relative to the production of side lobe-inducted features of the product structure. The form of the marker structure is more responsive to exposure variation than the form of the product structure to exposure variation. The marker pattern includes both primary features and secondary features that augment the side lobe arising from the primary feature to print side lobe-induced features on either side of a primary marker structure. Alternatively, the marker pattern is modified by having a different attenuation factor with respect to the product pattern. Alternatively, the marker pattern is modified by providing a marker dose different from the product dose. | 12-30-2010 |
| 20110141450 | Method and Apparatus for Overlay Measurement - A method of measurement of at-resolution overlay offset may be implemented in a scatterometer. At least three targets are provided on a wafer, each target comprising a first marker grating and a second interleaved marker grating and each target having a different overlay bias between its first and second marker. The first and second markers are provided by subsequent lithography steps in a double patterning lithographic process. The targets are measured with a scatterometer and for each target a measured CD of at least one of the markers is determined using reconstruction. The CD of the first marker may be fixed in the reconstruction. The measured CDs and at least one of the overlay biases is used to determine an overlay result corresponding to a minimum measured CD. The overlay result may be determined by fitting a function such as a parabola to the measured CDs and the overlay biases and determining the overlay at the minimum of the fitted function. | 06-16-2011 |
