Patent application number | Description | Published |
20100327424 | Multi-chip package and method of providing die-to-die interconnects in same - A multi-chip package includes a substrate ( | 12-30-2010 |
20110147055 | Glass core substrate for integrated circuit devices and methods of making the same - Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed. | 06-23-2011 |
20120038379 | PROBES FORMED FROM SEMICONDUCTOR REGION VIAS - Embodiments of the invention describe forming a set of probes using semiconductor regions each including a plurality of vias. A first set of probe segments may be formed from a first set of vias on a first semiconductor region. A second set of probe segments may be formed from a second set of vias on a second semiconductor region and bonded to the first set of probe segments. At least one spring comprising a dielectric material may be formed to couple the first set of probe segments, while a set of metal tips disposed on the second set of probe segments. | 02-16-2012 |
20120074581 | DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER SUBSTRATES INCLUDING EMBEDDED-DICE, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless substrate with a through-silicon via (TSV) embedded die that is integral to the coreless substrate. The apparatus includes a subsequent die that is coupled to the TSV die and that is disposed above the coreless substrate. | 03-29-2012 |
20120192413 | GLASS CORE SUBSTRATE FOR INTEGRATED CIRCUIT DEVICES AND METHODS OF MAKING THE SAME - Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed. | 08-02-2012 |
20120261838 | MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME - A multi-chip package includes a substrate ( | 10-18-2012 |
20130249109 | INTERPOSER FOR HERMETIC SEALING OF SENSOR CHIPS AND FOR THEIR INTEGRATION WITH INTEGRATED CIRCUIT CHIPS - Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermitically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed. | 09-26-2013 |
20140003009 | GLASS CLAD MICROELECTRONIC SUBSTRATE | 01-02-2014 |
20140085846 | MICROELECTRONIC STRUCTURES HAVING LAMINATED OR EMBEDDED GLASS ROUTING STRUCTURES FOR HIGH DENSITY PACKAGING - Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a trace routing structure, wherein the glass routing structure is incorporated with the trace routing substrate, either in a laminated or embedded configuration. Also disclosed are embodiments of a microelectronic package including at least one microelectronic device disposed proximate to the glass routing structure of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects. Further, disclosed are embodiments of a microelectronic structure including at least one microelectronic device embedded within a microelectronic encapsulant having a glass routing structure attached to the microelectronic encapsulant and a trace routing structure formed on the glass routing structure. | 03-27-2014 |
20140091440 | SYSTEM IN PACKAGE WITH EMBEDDED RF DIE IN CORELESS SUBSTRATE - Electronic assemblies and their manufacture are described. One assembly includes a coreless substrate comprising a plurality of dielectric layers and electrically conductive pathways, the coreless substrate including a first side and a second side opposite the first side. The assembly includes a first die embedded in the coreless substrate, the first die comprising an RF die, the first die positioned in a dielectric layer that extends to the first side of the coreless substrate. The assembly includes a second die positioned on first side, the second die positioned on the first die. In another aspect, a molding material may be positioned on the die side, wherein the first die and the second die are covered by the molding material. In another aspect, an electrical shielding layer may be positioned over the first side. Other embodiments are described and claimed. | 04-03-2014 |
20140165723 | INDUCTIVE INERTIAL SENSOR ARCHITECTURE & FABRICATION IN PACKAGING BUILD-UP LAYERS - This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices. | 06-19-2014 |
20140169801 | SEMICONDUCTOR PACKAGE WITH OPTICAL PORT - Described herein are technologies related to a semiconductor package that is installed in a portable device for data communications. More particularly, the semiconductor package that contains a memory, a digital logic chip, and an optical port in a single module or mold is described. | 06-19-2014 |
20140171751 | ELECTRONIC BIO MONITORING PATCH - Described herein are technologies related to a wireless electronic vital sign monitoring of a person. More particularly, detecting vital signs and processing of the detected vital signs using a bio monitoring patch. | 06-19-2014 |
20140176417 | WEARABLE PROJECTOR FOR PORTABLE DISPLAY - Described herein are technologies related to a wearable projector to project images, information, multimedia, etc. in a portable display. More particularly, the wearable projector includes a system on chip (SOC) microprocessor that is configured to project the images, information, multimedia, etc. to different types of portable display such as, flexible transparent plastic, glass, paper, and the like. | 06-26-2014 |
20140178003 | CLOAKING SYSTEM WITH WAVEGUIDES - Described herein are technologies related to passive or active cloaking devices. More particularly, the passive or active cloaking devices utilize input/output grating couplers and waveguides to create an impression of invisibility on an object that is covered by the passive or active cloaking devices. | 06-26-2014 |
20140203175 | OPTICAL I/O SYSTEM USING PLANAR LIGHT-WAVE INTEGRATED CIRCUIT - Photonic components are placed on the processor package to bring the optical signal close to the processor die. The processor package includes a substrate to which the processor die is coupled, and which allows the processor die to connect to a printed circuit board. The processor package also includes transceiver logic, electrical-optical conversion circuits, and an optical coupler. The electrical-optical conversion circuits can include laser(s), modulator(s), and photodetector(s) to transmit and receive and optical signal. The coupler interfaces to a fiber that extends off the processor package. Multiple fibers can be brought to the processor package allowing for a scalable high-speed, high-bandwidth interconnection to the processor. | 07-24-2014 |
20140246770 | COPPER NANOROD-BASED THERMAL INTERFACE MATERIAL (TIM) - A copper nanorod thermal interface material (TIM) is described. The copper nanorod TIM includes a plurality of copper nanorods having a first end thermally coupled with a first surface, and a second end extending toward a second surface. A plurality of copper nanorod branches are formed on the second end. The copper nanorod branches are metallurgically bonded to a second surface. The first surface may be the back side of a die. The second surface may be a heat spread or a second die. The TIM may include a matrix material surrounding the copper nanorods. In an embodiment, the copper nanorods are formed in clusters. | 09-04-2014 |
20140295621 | DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER SUBSTRATES INCLUDING EMBEDDED-DICE, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless substrate with a through-silicon via (TSV) embedded die that is integral to the coreless substrate. The apparatus includes a subsequent die that is coupled to the TSV die and that is disposed above the coreless substrate. | 10-02-2014 |
20140327149 | DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER SUBSTRATES INCLUDING EMBEDDED-DICE, AND PROCESSES OF FORMING SAME - An apparatus includes a coreless substrate with a through-silicon via (TSV) embedded die that is integral to the coreless substrate. The apparatus includes a subsequent die that is coupled to the TSV die and that is disposed above the coreless substrate. | 11-06-2014 |