Joh, KR
Cheol Ho Joh, Seoul KR
Patent application number | Description | Published |
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20090096075 | STACKED SEMICONDUCTOR PACKAGE THAT PREVENTS DAMAGE TO SEMICONDUCTOR CHIP WHEN WIRE-BONDING AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a substrate having first and second contact pads. A first stacked package group is disposed on the substrate, and the first stacked package group includes first semiconductor chips stacked in a stair form to expose first edge bonding pads. First conductive wires are used to electrically couple the first edge bonding pads and the first contact pads. An adhesive member is disposed on the uppermost first semiconductor chip, and a second stacked package group is disposed on the adhesive member. The second stacked package group includes second semiconductor chips that are stacked in a stair form to expose second edge bonding pads. When the second stacked package group is disposed on the adhesive member, the bottommost second semiconductor chips is aligned with the uppermost first semiconductor chip. Second conductive wires are used to electrically couple the second edge bonding pads and the second contact pads. | 04-16-2009 |
20090140426 | FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized. | 06-04-2009 |
20100092718 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive member is disposed at the first region. The second adhesive member is disposed at the third region. | 04-15-2010 |
20110189928 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive is member is disposed at the first region. The second adhesive member is disposed at the third region. | 08-04-2011 |
20110272798 | CHIP UNIT AND STACK PACKAGE HAVING THE SAME - A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other. | 11-10-2011 |
20110272820 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads. | 11-10-2011 |
20120018879 | STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern. | 01-26-2012 |
20130256887 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads. | 10-03-2013 |
20140057369 | METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECHNIQUE - Methods of forming an interconnection line pattern using a screen printing technique. The method includes preparing a substrate having unevenness, aligning a stencil mask on the substrate, and printing a paste including materials for forming the interconnection line pattern on a convex portion of the unevenness formed on the substrate. | 02-27-2014 |
20150270252 | STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern. | 09-24-2015 |
Cheol Ho Joh, Icheon-Si Gyeonggi-Do KR
Patent application number | Description | Published |
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20140175638 | SEMICONDUCTOR PACKAGES INCLUDING SEMICONDUCTOR CHIPS HAVING PROTRUSIONS AND METHODS OF FABRICATING THE SAME - The semiconductor package includes an upper semiconductor chip stacked on a package substrate and a support layer or a lower semiconductor chip disposed between the upper semiconductor chip and the package substrate. The upper semiconductor chip includes a protrusion downwardly extending from an edge thereof. The protrusion of the upper semiconductor chip is combined with a sidewall of the support layer or the lower semiconductor chip. Related methods are also provided. | 06-26-2014 |
20150279758 | SEMICONDUCTOR PACKAGE ON WHICH SEMICONDUCTOR CHIP IS MOUNTED ON SUBSTRATE WITH WINDOW - The semiconductor package includes: a substrate having a window and first and second bond fingers arranged over a first surface along a periphery of the window; a first semiconductor chip disposed within the window and having a plurality of first bonding pads arranged over edges of an upper surface; a plurality of first connection members electrically coupling the first bonding pads with the first bonding fingers; a second semiconductor chip disposed over the first semiconductor chip and the first surface of the substrate and a plurality of second bonding pads in the edges of the lower surface; a plurality of second connection members electrically coupling the second bonding pads with the second bonding fingers of the substrate adjacent to the second bonding pads; and an encapsulation member formed over the first surface of the substrate to cover side surfaces of the second semiconductor chip. | 10-01-2015 |
Cheol Ho Joh, Icheon-Si KR
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20140170812 | METHOD AND APPARATUS FOR MANUFACTURING CHIP PACKAGE - There are proposed a method and apparatus for manufacturing a chip package in which bonding wires are coupled with contact pads in which an overhang holder holds and fixes portions of a surface adjacent to portions where the contact pads are located. | 06-19-2014 |
Han-Ik Joh, Jeollabuk-Do KR
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20140120030 | CARBON MATERIALS BASED ON ORGANIC NANOFILM USING THERMAL EVAPORATION AND METHOD FOR PREPARING THE SAME - Provided is a method for preparing a carbon material based on an organic nanofilm using thermal evaporation, including: depositing a liquid polymer or polymer solution containing a polymer and a solvent onto a substrate, thereby forming an organic nanofilm; stabilizing the organic nanofilm so that the carbon atoms in the organic nanofilm have a cyclic arrangement; and carbonizing the stabilized organic nanofilm, thereby forming a carbon material, wherein the organic nanofilm is formed from the liquid polymer or polymer solution through a thermal evaporation process. The method provides a carbon material with a thickness, sheet resistance and surface roughness suitable for various applications and allows control thereof. In addition, the method uses a relatively inexpensive starting material, pitch, thereby reducing the overall production cost, and avoids a need for a complicated additional patterning operation, so that the carbon material is applied directly to electronic devices. | 05-01-2014 |
Han-Ik Joh, Seoul KR
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20090208793 | HYBRID TYPE POWER SUPPLYING APPARATUS - Disclosed is a hybrid-type power supplying apparatus which may use a fuel cell device as a main power supplier for a robot and a rechargeable battery as an auxiliary power supplier for the robot. In the hybrid-type power supplying apparatus, when the power consumption of the robot exceeds the selected amount of power generation of the fuel cell device, the loads of the rechargeable battery and the fuel cell stack can be managed in such a manner that power is supplied from the rechargeable battery to the robot as an auxiliary power for the robot supplementing the main power for the robot. | 08-20-2009 |
20100021794 | METHOD OF FABRICATING CARBON MATERIAL, CARBON MATERIAL PREPARED BY THE METHOD, CELL MATERIAL AND APPARATUS USING THE SAME - Disclosed is a method for fabricating a carbon material, by which carbon fibers or carbon tubes, particularly branched carbon fibers or carbon tubes, are obtained via a so-called self-growing process without using external carbon sources. The carbon material obtained by the method has a large specific surface area and further includes a metal catalyst, and thus may be used in cell materials for a fuel cell or secondary battery, hydrogen storage devices, capacitors, solar cells, display panel or the like. | 01-28-2010 |
Hanjin Joh, Seoul KR
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20120264474 | COMMUNICATION METHOD AND WIRELESS DEVICE - A method for automatically providing wireless Access Point (AP) includes determining whether to operate a first wireless device in an AP mode, receiving a switch request message from a second wireless device, switching the first wireless device to the AP mode, and starting a switch timer. A first wireless device to provide a wireless AP includes a transceiver to receive a switch request message from the second wireless device, and a processor to determine whether to operate the first wireless device in the AP mode in response to the switch request message and to switch the first wireless device to the AP mode. | 10-18-2012 |
Hosung Joh, Seongnam-Si KR
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20150099548 | ADDRESS BOOK INFORMATION SERVICE SYSTEM, AND METHOD AND DEVICE FOR ADDRESS BOOK INFORMATION SERVICE THEREIN - Provided are an address book information service system, and a method and a device for an address book information service therein, whereby: a terminal device in the address book information service system sets groups in an address book according to category information and transmits group information on the set groups and preset user information to a service device; the service device searches new address book information corresponding to the group information on the basis of the location of a user by using the group information and the user information and transmits the searched new address book information to the terminal device; and the terminal device automatically registers the received new address book information in the address book, thereby enabling the user to easily look up new address book information. | 04-09-2015 |
Jae Min Joh, Yongin KR
Jae Min Joh, Anyang-Si KR
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20100332226 | MOBILE TERMINAL AND CONTROLLING METHOD THEREOF - A mobile terminal and controlling method thereof are disclosed, by which a specific content and another content associated with the specific content can be quickly searched using a user's voice. The present invention includes inputting a voice for a search for a specific content provided to the mobile terminal via a microphone, analyzing a meaning of the inputted voice, searching a memory for at least one content to which a voice name having a meaning associated with the analyzed voice is tagged, and displaying the searched at least one content. | 12-30-2010 |
Jae-Min Joh, Gunpo KR
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20090299730 | MOBILE TERMINAL AND METHOD FOR CORRECTING TEXT THEREOF - A method for selecting text created in a mobile terminal by word and correcting it or changing it to another word, and a mobile terminal implementing the same are disclosed. The mobile terminal includes: a display unit to display one or more words of text, and to display tags for each of the one or more words; an input unit to select at least one of the tagged one or more words as selected one word; and a controller to display candidate words having a similar pronunciation to that of the word selected via the input unit, select one of the candidate words as selected one candidate word, and change the selected one word from the text to the selected one candidate word. | 12-03-2009 |
20150126252 | MOBILE TERMINAL AND MENU CONTROL METHOD THEREOF - A mobile terminal including a wireless communication unit configured to provide wireless communication, a display, and a controller configured to, activate a mode for voice recognition in response to a touch input to a soft button displayed on the display or to a hard button on the mobile terminal, receive a first voice input associated with a phone call relating operation of the mobile terminal, display an indicator on the display indicating the voice input is being recognized by the mobile terminal, analyze the context of a voice command in the voice input, execute the call relating operation only if there is a single contact in a phonebook that matches the voice command in the first voice input, if there is no single contact that matches the voice command of the received voice input, display a plurality of candidates that is analyzed based on the voice command, receive a second input according to a plurality of candidates, and execute the call relating operation based on the second input. | 05-07-2015 |
Jae-Min Joh, Gyeonggi-Do KR
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20090253463 | MOBILE TERMINAL AND MENU CONTROL METHOD THEREOF - A mobile terminal including an input unit configured to receive an input to activate a voice recognition function on the mobile terminal and a memory configured to store multiple domains related to menus and operations of the mobile terminal. It further includes a controller configured to access a specific domain among the multiple domains included in the memory based on the received input to activate the voice recognition function, to recognize user speech based on a language model and an acoustic model of the accessed domain, and to determine at least one menu and operation of the mobile terminal based on the accessed specific domain and the recognized user speech. | 10-08-2009 |
Jae Won Joh, Gyeonggi KR
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20120066780 | HUMANIZED NSG MOUSE, METHOD OF PRODUCING THE SAME AND USE THEREOF - A mouse model in which human fetal thymus and human fetal bone fragments are transplanted into NSG mice, a method of producing the same, and a use thereof. | 03-15-2012 |
Jungwoo Joh, Daejeon KR
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20130097624 | SYSTEM FOR RECOMMENDING FAVORITE CHANNEL/PROGRAM BASED ON TV WATCHING PATTERN AND METHOD THEREOF - Disclosed are a system for recommending a favorite channel/program based on a television (TV) watching pattern and a method thereof. The present invention provides a system and a method for recommending a favorite channel/program by learning a television (TV) watching pattern using a Bayesian network, by extracting recommended candidate favorite channel/programs by applying an entropy theory to the learned Bayesian network, and by applying a fuzzy logic operation to the extracted candidate favorite channel/programs. | 04-18-2013 |
Ki-Hun Joh, Geoje-Si KR
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20110027604 | EXPANDABLE METAL MEMBRANE WITH ORTHOGONALLY ISOTROPIC BEHAVIOR - In a metal membrane for a low-temperature-fluid storage tank wherein longitudinal and transverse corrugations are formed and both corrugations intersect each other, a bidirectional expandable member connected to each corrugation is formed in the intersection of the corrugations so that the bidirectional expandable member is longitudinally and transversely expandable. The bidirectional expandable member is protruded and is shaped like a pyramid, a dome or a cross. Each metal membrane is welded into a unit panel and the edge of each metal membrane is welded with the common edge of another adjacent metal membrane. | 02-03-2011 |
20110056954 | INSULATION PANEL FOR CORNER AREA OF LNG CARGO CONTAINMENT SYSTEM - A corner panel of an LNG cargo that includes a main body, which forms a corner area of the cargo, and a stress diverging part, which reduces the convergence of stress of the main body by being integrated with an internal face of the main body and being formed with curvature, and a secondary barrier formed in a curved shape. | 03-10-2011 |
20110056955 | INSULATION STRUCTURE OF LNG CARRIER CARGO TANK AND METHOD FOR CONSTRUCTING THE SAME - An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure includes a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil. | 03-10-2011 |
20110076092 | APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF - A fixing apparatus of a cargo insulation panel includes a fixing plate adhered to one face of an insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets fixed by stud bolts arranged on the hull, and a plurality of couplers configured to couple the fixing brackets to the fixing plate. | 03-31-2011 |
20120211621 | APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF - An apparatus for a cargo insulation panel and an insulation panel using the fixing apparatus are provided. By providing a fixing apparatus of a cargo insulation panel and an insulation panel using the fixing apparatus, which include a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate, the present invention can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally, and solve the problem of damage by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel. | 08-23-2012 |
20120305524 | INSULATION STRUCTURE OF LNG CARRIER CARGO TANK AND METHOD FOR CONSTRUCTING THE SAME - An insulation structure of a cargo tank in an LNG carrier and a method of constructing the insulation structure include a first metal foil attached and installed in between the top insulation panel and the bottom insulation panel, a second metal foil attached to and installed on the first metal foil that is positioned on an upper side of a gap formed between the bottom insulation panels, and a top bridge panel attached to and installed on an upper side of the second metal foil. | 12-06-2012 |
20130121758 | APPARATUS FOR FIXING AN INSULATION PANEL OF A CARGO AND INSULATION PANEL THEREOF - A fixing apparatus for fixing a cargo insulation panel to a hull is provided. The fixing apparatus includes a fixing plate adhered to one face of the insulation panel, a plurality of fixing brackets protruded to the outside of the fixing plate, protruded portions of the fixing brackets being fixed by stud bolts arranged on the hull, and coupling means being configured to couple the fixing brackets to the fixing plate. The fixing apparatus can improve the continuity of the insulation panel, enhance the adhesiveness and airtightness with a member such as supple triplex, easily adjust adjacent insulation panels vertically or laterally. The fixing apparatus also solves the problem of damage caused by interference or the inconvenience of transportation by allowing the fixing bracket to be inserted during the transportation of the insulation panel. | 05-16-2013 |
20150033769 | PUMP TOWER INSTALLATION STRUCTURE OF LIQUEFIED NATURAL GAS STORAGE TANK AND MANUFACTURING METHOD THEREOF - Disclosed herein are a pump tower installation structure of a liquefied natural gas (LNG) storage tank and a manufacturing method thereof. The pump tower installation structure of the LNG storage tank includes an adaptor disposed at a predetermined area of an opening portion formed at an inner hull disposed on an upper side of the LNG storage tank, and a cover having through-holes corresponding to pipes of the pump tower installed at the storage tank, and disposed at a remaining area of the opening portion to be connected with the adaptor. | 02-05-2015 |
20150114970 | REINFORCING MEMBER FOR CORRUGATED MEMBRANE OF LNG CARGO TANK, MEMBRANE ASSEMBLY HAVING THE REINFORCING MEMBER AND METHOD FOR CONTRUCTING THE SAME - The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer. | 04-30-2015 |
Ki-Hun Joh, Gyeongsangnam-Do KR
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20100089072 | FUEL SUPPLY APPARATUS OF LIQUEFIED GAS CARRIER AND FUEL SUPPLY METHOD THEREOF - A fuel supply apparatus of a liquefied gas carrier includes: a compressor for compressing gas fuel into a high pressure; a compressed gas storage tank being filled with the compressed high-pressure gas fuel, for storing the gas fuel; and a decompressor for decompressing the high-pressure gas fuel drawn from the compressed gas storage tank into a pressure suitable to be used in a propulsion system, to supply fuel to the propulsion system. The gas fuel is at least one of a natural boiled-off gas which is naturally evaporated in the cargo tank, a forced boiled-off gas which is artificially evaporated, and a gas additionally supplied for the use of fuel. Further, the compressor is a multistage high-pressure compressor and the decompressor is a multistage decompressor. | 04-15-2010 |
20110186580 | REINFORCING MEMBER FOR CORRUGATED MEMBRANE OF LNG CARGO TANK, MEMBRANE ASSEMBLY HAVING THE REINFORCING MEMBER AND METHOD FOR CONSTRUCTING THE SAME - The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer. | 08-04-2011 |
Seong Kweon Joh, Seoul KR
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20120216598 | SYSTEM FOR MEASURING ABSOLUTE QUANTITY OF EACH COMPONENT OF GAS USING QMS - The present invention relates to a system for measuring an absolute quantity of each component of a gas using a QMS, more particularly to a system for measuring an absolute quantity of each component of a gas using a QMS, which is capable of performing not only a qualitative analysis but also a quantitative analysis in an accurate manner, using just a trace amount of gas introduced through a pinhole. According to the present invention, the productivity of products can be improved, and production management can be performed in an efficient manner, thereby improving industrial competitiveness. | 08-30-2012 |
Seung-Je Joh, Seoul KR
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20120170083 | Image reading apparatus and controlling method thereof - An image reading apparatus which supports a both-side scan mode and a controlling method thereof. The image reading apparatus includes: an automatic paper transfer unit which automatically transfers a papers; a first scanning unit which comprises a first light source and scans a first side of the paper; a second scanning unit which comprises a second light source and scans a second side of the paper; and a controller which controls the first and second light sources to be alternately lit on a plurality of times within a cycle of a preset signal when the paper is transferred to the automatic paper transfer unit. | 07-05-2012 |
20130128322 | IMAGE SCANNING APPARATUS AND CONTROL METHOD THEREOF - An image scanning apparatus and method are provided. The image scanning apparatus scans an image of a document and converts the scanned image into digital data, and includes light sources that emit light. The apparatus includes a light guide unit that diffuses the light emitted by the light sources and a sensor unit that senses image data from the document by recognizing light reflected from the document by being diffused by the light guide unit. The apparatus includes a control unit that controls the turning on of the light sources. The control unit alternately turns on or off the light sources such that at least one of the light sources is turned on when at least one other light source is turned off. | 05-23-2013 |
20130342879 | IMAGE FORMING APPARATUS AND METHOD OF CONTROLLING THE SAME - An image forming apparatus and a method of controlling the same are provided. The image forming apparatus includes a document feeder to feed an original document, a time delay integration image sensor to scan the original document and read image data, and a controller to activate a time delay integration function of the time delay integration image sensor when a direction for feed of the original document corresponds to a sub-scanning direction of the time delay integration image sensor, and to deactivate the time delay integration function of the time delay integration image sensor when the direction for feed of the original document does not correspond to the sub-scanning direction of the time delay integration image sensor, during reading of the original document. | 12-26-2013 |
Seung-Je Joh, Suwon-Si KR
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20090002776 | IMAGE SCANNING APPARATUS AND METHOD THEREOF - An image scanning apparatus includes a light source unit having a plurality of lamps. A converter supplies power to the plurality of lamps and adjusts the power according to a desired light intensity of each the plurality of lamps. A controller controls the converter such that at least one of the lamps is overdriven for a predetermined amount of time when lamp warm-up is initiated. Thus, the length of time required to wait until an operational light intensity is reduced. | 01-01-2009 |
Won-Lee Joh, Gyeongsangbuk-Do KR
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20080276479 | Hair Dryer - Disclosed is a hair dryer capable of improving convenience in handling, changing a temperature range of a blown air variously, and generating anions in the blown air. The hair dryer includes a manipulating panel ( | 11-13-2008 |
Woon Bong Joh, Suwon KR
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20110042466 | RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD OF MANUFACTURING THE SAME - There is provided a radio frequency identification (RFID) tag. The RFID tag includes a base formed of an insulating material, a circuit chip adhered to one surface of the base and including a pad for an electrical connection, and an antenna formed by jetting a conductive material onto the one surface of the base and electrically connected to the pad. | 02-24-2011 |
20110043363 | RADIO FREQUENCY IDENTIFICATION TAG, AND METHOD AND MOLD FOR MANUFACTURING THE SAME - A radio frequency identification (RFID) tag includes a circuit chip including a pad for an electrical connection on one surface thereof, a molding part receiving the circuit chip therein while exposing the pad to the outside, and an antenna formed on an outer surface of the molding part, having a predetermined pattern shape and electrically connected to the pad. | 02-24-2011 |
Young-Suk Joh, Incheon City KR
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20100116321 | APPARATUS FOR COLLECTING SUNLIGHT - An apparatus for collecting sunlight includes a primary focus reflector, a secondary parallelization reflector, and a connection mechanism. The primary focus reflector has an inner rounded surface, an outer plane formed on an edge of the inner rounded surface, and a through-hole formed at a center of the inner rounded surface. The primary focus reflector collects sunlight on a focus in front of the inner rounded surface. The secondary parallelization reflector is disposed near the focus in front of the primary focus reflector and reflects the sunlight, having been reflected by the primary focus reflector towards the through-hole as parallel light. The connection mechanism connects the secondary parallelization reflector to the primary focus reflector to be secured near the focus. The apparatus further includes a power generation module disposed behind the reflectors. The apparatus has improved light collection and power generation efficiency. | 05-13-2010 |