| Patent application number | Description | Published |
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| 20100140618 | Sensor and method for the manufacture thereof - A sensor includes at least one micro-patterned diode pixel that has a diode implemented in, on, or under a diaphragm, and the diaphragm in turn being implemented above a cavity. The diode is contacted via supply leads that are implemented at least in part in, on, or under the diaphragm, and the diode is implemented in a polycrystalline semiconductor layer. The diode is implemented by way of two low-doped diode regions or at least one low-doped diode region. At least parts of the supply leads are implemented by way of highly doped supply lead regions of the shared polycrystalline semiconductor layer. | 06-10-2010 |
| 20100300204 | ACCELERATION SENSOR - A micromechanical acceleration sensor includes a substrate with a substrate surface arranged in one plane, a first counter-electrode arranged on the substrate surface, a second counter-electrode arranged on the substrate surface, and a rocking mass arranged above the first counter-electrode and the second counter-electrode. The rocking mass is in this case connected to the substrate via a torsion spring which permits tilting of the rocking mass about an axis of rotation. Further provided are a first compensation counter-electrode arranged on the substrate surface and a second compensation counter-electrode arranged on the substrate surface. In addition, a first compensation electrode is arranged above the first compensation counter-electrode and a second compensation electrode is arranged above the second compensation counter-electrode. | 12-02-2010 |
| 20100327883 | INDUCTIVE DELTA C EVALUATION FOR PRESSURE SENSORS - A measuring device has a sensor unit and an evaluation unit which is electrically isolated from the sensor unit by a partition wall. The sensor unit includes a first capacitive sensor which is electrically connected to a first coil to form a first oscillating circuit, and a reference capacitor which is electrically connected to a second coil to form a second oscillating circuit. The evaluation unit includes a third coil which is inductively coupled to the first coil and the second coil, and the evaluation unit is designed to determine and output a beat frequency of a beat signal which is inductively injected into the third coil by the first oscillating circuit and the second oscillating circuit. | 12-30-2010 |
| 20110048131 | MICROMECHANICAL COMPONENT - A micromechanical component which has a substrate, a seismic mass, which is deflectably situated on the substrate, and a stop structure for limiting a deflection of the seismic mass in a direction away from the substrate. The stop structure is situated on the substrate and has a limiting section for limiting the deflection of the seismic mass, which is in a plane with the seismic mass. Furthermore, a method for manufacturing a micromechanical component is described. | 03-03-2011 |
| 20110048137 | Pressure sensor - A simple to implement contacting variant makes it possible to create a reliable electrical connection between the sensor element and the evaluation electronics of a pressure sensor, including at least one media-resistant sensor element, evaluation electronics in the form of at least one additional component connected electrically to the sensor element, and a multipart housing, the sensor element being situated in a first housing area having at least one pressure connection, and the evaluation electronics being situated in a second sealed housing area which is separated from the first housing area by a separating wall. The electrical connection between the sensor element and the evaluation electronics is implemented in the form of media-resistant bonding wires which are guided from the first into the second housing area through the bonded joint area between the separating wall and an additional housing part. | 03-03-2011 |
| 20110068419 | MICROMECHANICAL SYSTEM - A micromechanical system includes a substrate, a first conductive layer situated above the substrate and a second conductive layer situated above the first conductive layer. The first conductive layer and the second conductive layer are conductively interconnected by a connecting element. The connecting element has a conductive edge surrounding a nonconductive region. | 03-24-2011 |
| 20110127674 | LAYER STRUCTURE FOR ELECTRICAL CONTACTING OF SEMICONDUCTOR COMPONENTS - A layer structure for the electrical contacting of a semiconductor component having integrated circuit elements and integrated connecting lines for the circuit elements, which is suitable in particular for use in a chemically aggressive environment and at high temperatures, i.e., in so-called “harsh environments,” and is simple to implement. This layer structure includes at least one noble metal layer, in which at least one bonding island is formed, the noble metal layer being electrically insulated from the substrate of the semiconductor component by at least one dielectric layer, and having at least one ohmic contact between the noble metal layer and an integrated connecting line. The noble metal layer is applied directly on the ohmic contact layer. | 06-02-2011 |
| Patent application number | Description | Published |
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| 20080262617 | INTERSPINOUS SPACER - A spacer for maintaining separation between adjacent spinous processes having a first and second end support, a connecting member, and a central member positioned between the first and second end supports. The spacer is adjustable between a collapsed configuration and an expanded configuration such that when the connection member is pulled to bring the first and second end supports closer together, the central member expands into the expanded configuration to contact and support adjacent spinous processes. | 10-23-2008 |
| 20090216274 | EXPANDABLE INTERSPINOUS PROCESS SPACER WITH LATERAL SUPPORT AND METHOD FOR IMPLANTATION - An interspinous process spacer and method of implanting same is provided for maintaining separation between adjacent spinous processes of adjacent vertebrae. The spacer has two lateral portions and a medial portion therebetween, the medial portion adapted to reside between the adjacent superior and inferior spinous processes in the deployed configuration to maintain separation therebetween. The lateral portions each comprise a superior lateral portion and an inferior lateral portion adapted to reside on the lateral side of the respective superior and inferior spinous process in the deployed configuration to maintain positioning of the interspinous process spacer between the two adjacent vertebrae. The lateral portions each comprise an expandable lateral member that is expandable from an insertion configuration to the deployed configuration, and at least one of the lateral portions includes within it a lateral support member configured to be deformable for the insertion configuration and expanded in the deployed configuration. The method includes introducing the spacer through a tubular delivery device to the region between the spinous processes and positioning therein, followed by retraction of the delivery device and expansion of the expandable lateral members and lateral support members. | 08-27-2009 |
| 20110009904 | INTERSPINOUS SPACER - A spacer for maintaining separation between adjacent spinous processes having a first and second end support, a connecting member, and a central member positioned between the first and second end supports. The spacer is adjustable between a collapsed configuration and an expanded configuration such that when the connection member is pulled to bring the first and second end supports closer together, the central member expands into the expanded configuration to contact and support adjacent spinous processes. | 01-13-2011 |
