Patent application number | Description | Published |
20090073398 | MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure relates to a microlithographic projection exposure apparatus and a microlithographic projection exposure apparatus, as well as related components, methods and articles made by the methods. The microlithographic projection exposure apparatus includes an illumination system and a projection objective. The illumination system can illuminate a mask arranged in an object plane of the projection objective. The mask can have structures which are to be imaged. The method can include illuminating a pupil plane of the illumination system with light. The method can also include modifying, in a plane of the projection objective, the phase, amplitude and/or polarization of the light passing through that plane. The modification can be effected for at least two diffraction orders in mutually different ways. A mask-induced loss in image contrast obtained in the imaging of the structures can be reduced compared to a method without the modification. | 03-19-2009 |
20100134768 | PROJECTION EXPOSURE SYSTEM FOR MICROLITHOGRAPHY - The disclosure relates to a projection exposure system for microlithography, which includes at least one optical system that has at least one optical element with at least two aspherical surfaces essentially arranged rigidly relative to each other. | 06-03-2010 |
20100177321 | OPTICAL ELEMENT AND METHOD OF CALIBRATING A MEASURING APPARATUS COMPRISING A WAVE SHAPING STRUCTURE - Optical element having an optical surface, which optical surface is adapted to a non-spherical target shape, such that a long wave variation of the actual shape of the optical surface with respect to the target shape is limited to a maximum value of 0.2 nm, wherein the long wave variation includes only oscillations having a spatial wavelength equal to or larger than a minimum spatial wavelength of 10 mm. | 07-15-2010 |
20100201959 | PROJECTION OBJECTIVE FOR MICROLITHOGRAPHY - A projection objective for microlithography includes at least one optical assembly with optical elements which are disposed between an object plane and an image plane. The optical assembly includes at least one optical terminal element, which is disposed close to the image plane. A first immersion liquid is disposed on the image oriented surface of the optical terminal element. A second immersion liquid is disposed on the object oriented surface of the optical terminal element. The object oriented surface includes a first surface section for the imaging light to enter into the terminal element, and the image oriented surface includes a second surface portion for the imaging light to exit from the terminal element. | 08-12-2010 |
20120092637 | MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - The disclosure relates to a microlithographic projection exposure apparatus and a microlithographic projection exposure apparatus, as well as related components, methods and articles made by the methods. The microlithographic projection exposure apparatus includes an illumination system and a projection objective. The illumination system can illuminate a mask arranged in an object plane of the projection objective. The mask can have structures which are to be imaged. The method can include illuminating a pupil plane of the illumination system with light. The method can also include modifying, in a plane of the projection objective, the phase, amplitude and/or polarization of the light passing through that plane. The modification can be effected for at least two diffraction orders in mutually different ways. A mask-induced loss in image contrast obtained in the imaging of the structures can be reduced compared to a method without the modification. | 04-19-2012 |
20120160007 | METHOD AND CALIBRATION MASK FOR CALIBRATING A POSITION MEASURING APPARATUS - A method for calibrating an apparatus for the position measurement of measurement structures on a lithography mask comprises the following steps: qualifying a calibration mask comprising diffractive structures arranged thereon by determining positions of the diffractive structures with respect to one another by means of interferometric measurement, determining positions of measurement structures arranged on the calibration mask with respect to one another by means of the apparatus, and calibrating the apparatus by means of the positions determined for the measurement structures and also the positions determined for the diffractive structures. | 06-28-2012 |
20120224186 | METHOD FOR PRODUCING A MIRROR HAVING AT LEAST TWO MIRROR SURFACES, MIRROR OF A PROJECTION EXPOSURE APPARATUS FOR MICROLITHOGRAPHY, AND PROJECTION EXPOSURE APPARATUS - A mirror (M) of a projection exposure apparatus for microlithography configured for structured exposure of a light-sensitive material and a method for producing a mirror (M). The mirror (M) has a substrate body (B), a first mirror surface (S) and a second mirror surface (S′). The first mirror surface (S) is formed on a first side (VS) of the substrate body (B). The second mirror surface (S′) is formed on a second side (RS) of the substrate body (B), the second side being different from the first side of the substrate body (B). The mirror (M) may be embodied, in particular, such that the substrate body (B) is produced from a glass ceramic material. | 09-06-2012 |
20130077074 | MICROLITHOGRAPHIC PROJECTION EXPOSURE APPARATUS - A microlithographic projection exposure apparatus includes a projection light source. The apparatus also includes a heating light source for generating heating light which is at least partly absorbed by an optical element. An illumination optical unit directs the heating light onto the optical element such that the heating light has a predefined intensity distribution on an optical surface of the optical element. The illumination optical unit includes a deflection element which is a diffractive optical element or a refractive freeform element. The deflection element simultaneously directs the heating light impinging thereon in different directions. | 03-28-2013 |
20130182264 | Projection Exposure Tool for Microlithography and Method for Microlithographic Exposure - A projection exposure tool for microlithography for exposing a substrate is disclosed. The tool includes a projection objective. The tool also includes an optical measuring apparatus for determining a surface topography of the substrate before the substrate is exposed. The measuring apparatus has a measuring beam path which extends outside of the projection objective. The measuring apparatus is a wavefront measuring apparatus configured to determine topography measurement values simultaneously at a number of points on the substrate surface. | 07-18-2013 |
20130252146 | Projection Exposure Tool for Microlithography and Method for Microlithographic Imaging - A projection exposure tool for microlithography for imaging mask structures of an image-providing substrate onto a substrate to be structured includes a measuring apparatus configured to determine a relative position of measurement structures disposed on a surface of one of the substrates in relation to one another in at least one lateral direction with respect to the substrate surface and to thereby simultaneously measure a number of measurement structures disposed laterally offset in relation to one another. | 09-26-2013 |
20150042975 | PROJECTION EXPOSURE TOOL FOR MICROLITHOGRAPHY AND METHOD FOR MICROLITHOGRAPHIC IMAGING - A projection exposure tool for microlithography for imaging mask structures of an image-providing substrate onto a substrate to be structured includes a measuring apparatus configured to determine a relative position of measurement structures disposed on a surface of one of the substrates in relation to one another in at least one lateral direction with respect to the substrate surface and to thereby simultaneously measure a number of measurement structures disposed laterally offset in relation to one another. | 02-12-2015 |