Patent application number | Description | Published |
20090013290 | Method and System for Electromigration Analysis on Signal Wiring - The invention relates to an electromigration analysis method and a system for analyzing one or more nets in a digital integrated circuit design that are at risk of electromigration. The method comprises the steps of providing at least one interconnect between a driver cell and at least one load cell; applying same extracted netlist data for noise and/or timing analysis and for electromigration analysis; modeling the driver cell by a train of trapezoidal voltage pulses transmitted from the driver cell to the one or more load cells through the at least one interconnect; extracting at least a slew rate of a driver voltage signal (U | 01-08-2009 |
20100037198 | PORT ASSIGNMENT IN HIERARCHICAL DESIGNS BY ABSTRACTING MACRO LOGIC - A method to reduce the problem complexity maintains a relatively high quality port assignment by abstracting local connections in the macro when performing the port assignment. This is done for netlength, congestion as well as timing. The internal netlist of the macro is abstracted in such a way that the optimization of the external interconnect can be done in an efficient manner. Three levels of abstractions are described. A first level optimizes the top level interconnect, a second level optimizes the top level and macro interconnects, while a third level optimizes the top level timing. | 02-11-2010 |
20110072407 | Automatic Positioning of Gate Array Circuits in an Integrated Circuit Design - An automated method and apparatus for positioning gate array circuits in an integrated circuit design. An initial integrated circuit design includes logic cells and gate array fill circuits positioned thereon. The gate array fill circuits are positioned in available space between the adjacent logic cells so as to fill the available space with the maximum gate array fill circuits. A gate array logic element to be positioned in the integrated circuit design, such as may be required by an engineering change to the circuit design, is automatically positioned between adjacent logic cells so as to allow for full utilization of any space remaining between the adjacent logic cells by gate array fill circuits. | 03-24-2011 |
20110113395 | Method, Electronic Design Automation Tool, Computer Program Product, and Data Processing Program for Creating a Layout for Design Representation of an Electronic Circuit and Corresponding Port for an Electronic Circuit - A method for creating a layout for design representation of an electronic circuit with at least one port. The method includes segmenting the at least one port in the design representation into different regions, classifying the different regions of the at least one port according to timing and/or electronic and/or layout characteristics, assigning a priority for each classified region of the at least one port according to rules based on the timing and/or electronic and/or layout characteristics, and routing the design representation by accessing at least one of the classified regions of the port according to an order of the assigned priorities. | 05-12-2011 |
20110113398 | Method and System for Providing Secondary Power Pins in Integrated Circuit Design - An integrated circuit (IC) design with multiple metal layers containing cells requiring secondary power supply. After placing the cells and stripes of a primary power/ground grid in metal layers of the IC design, specific cells are provided with secondary power stripes in a first metal layer. The secondary power stripes are designed in such a way that each secondary power/ground stripe exhibits a full overlap with a stripe of a corresponding primary power/ground grid in a different metal layer. Subsequently, signals from the IC design are routed, and power vias between the primary power/ground grid stripes and the secondary power/ground stripes are generated. | 05-12-2011 |
20110154283 | Shaping Ports in Integrated Circuit Design - A mechanism is provided for performing a detailed routing of a net joining ports in an integrated circuit. Extended port regions are created for the ports of the net of the integrated circuit, the extended port regions being shaped in such a way as to guarantee routing access to the ports. A wire corresponding to the net is then placed and the extended port regions of the ports are trimmed, thus identifying essential port regions required for connecting the wire to the ports and dispensable port regions not required for connecting the wire to the ports. The wiring resources are then updated by releasing the dispensable port regions so that the dispensable port regions no longer constitute parts of the ports. | 06-23-2011 |
20120060139 | Using Port Obscurity Factors to Improve Routing - An integrated circuit characterized by a netlist may be routed using a routing priority list that may be created using port obscurity factors. A port obscurity factor may indicate how difficult it may be to route to that port and may be calculated as being inversely proportional to the number of routing tracks that may be connectable to that port. Routing priorities for the nets of the netlist may then be created using the port obscurity factors of the ports in the net. Routing may then be done in the order determined by the routing priority list and the generated layout information stored in a computer useable medium. In some cases, routing may be performed using multiple routing passes where a new routing priority list may be calculated for each routing pass. | 03-08-2012 |
20120123725 | PERFORMING RELIABILITY ANALYSIS OF SIGNAL WIRES - A computer-implemented system, method, and storage device simulate a periodic voltage waveform in a network model of the integrated circuit design. The method then determines resultant current values in each segment of nets of the integrated circuit design resulting from the periodic voltage waveform and performs a Fourier transform of the periodic voltage waveform to generate a frequency domain representation of the periodic voltage waveform. The frequency domain representation comprises multiple Fourier terms, each of the Fourier terms is a frequency that is a multiple of the base frequency. Next, the method performs an AC analysis of the resultant voltage at each frequency of the multiple Fourier terms. The AC analysis provides an electrical current value for each of the frequencies of the Fourier terms for each of the nets. This allows the method to compute a root mean square current through each of the nets based on the AC analysis. Then, the method determines whether the root mean square current for any of the segments of the nets exceeds a current limit, and reports any segment of the nets for which the root mean square current exceeds the current limit. | 05-17-2012 |
20130074025 | POST TIMING LAYOUT MODIFICATION FOR PERFORMANCE - A mechanism is provided for post timing layout modification for performance. The mechanism selectively applies layout modification based on timing analysis at the path level. The mechanism applies stress only to transistors that are in a setup critical path without applying stress to transistors in hold critical paths. The mechanism may use a method to apply stress to improve performance of a transistor in a setup critical path, as long as the stress does not also improve performance of a neighboring transistor in a hold critical path. In some instances, the mechanism may apply stress to improve performance of a transistor in a setup critical path while simultaneously degrading performance of a transistor in a hold critical path. | 03-21-2013 |
20130138978 | Charge Recycling Between Power Domains of Integrated Circuits - A mechanism is provided for efficiently recycling a charge from a power domain that is discharging. A side of a discharging power domain normally coupled to a voltage supply is disconnected from the voltage supply. The side of the precharging power domain normally coupled to the voltage supply is currently disconnected from the voltage supply. The side of the discharging power domain normally coupled to the voltage supply is connected to a side of the precharging power domain normally coupled to the voltage supply. A side of the discharging power domain normally coupled to the ground is disconnected from ground. The side of the discharging power domain normally coupled to ground is connected to the voltage supply, thereby precharging the precharging power domain with the charge from the discharging power domain that would normally he lost due to leakage. | 05-30-2013 |
20140082386 | Charge Recycling Between Power Domains of Integrated Circuits - A mechanism is provided for efficiently recycling a charge from a power domain that is discharging. A side of a discharging power domain normally coupled to a voltage supply is disconnected from the voltage supply. The side of the precharging power domain normally coupled to the voltage supply is currently disconnected from the voltage supply. The side of the discharging power domain normally coupled to the voltage supply is connected to a side of the precharging power domain normally coupled to the voltage supply. A side of the discharging power domain normally coupled to the ground is disconnected from ground. The side of the discharging power domain normally coupled to ground is connected to the voltage supply, thereby precharging the precharging power domain with the charge from the discharging power domain that would normally be lost due to leakage. | 03-20-2014 |
20160070840 | INTEGRATED CIRCUIT DESIGN CHANGES USING THROUGH-SILICON VIAS - A method for adding an electrical interconnection within a three-dimensional integrated circuit (3-D IC) is disclosed. The method may include creating, within a design file of a 3-D IC that specifies a layout for a first chip of the 3-D IC, design data corresponding to a set of through-silicon via (TSV) reservation areas. The method may also include receiving an engineering change order (ECO) and releasing, in response to the ECO, at least one TSV reservation area for reuse. The method may also include adding, by re-using at least one TSV reservation area, an electrical interconnection within the design file of the first chip of the 3-D IC. | 03-10-2016 |
20160071783 | THROUGH-SILICON VIA ACCESS DEVICE FOR INTEGRATED CIRCUITS - A through-silicon via access device (TSVAD) for establishing an electrical connection to a through-silicon via (TSV) located in a planar stack of semiconductor chips is disclosed. The TSVAD may include a switching circuit, having a conductive pad terminal, a TSV terminal, an input terminal coupled to a sending logic circuit, an output terminal coupled to a receiving logic circuit, and logic devices to, in response to control signals, couple the TSV terminal to the conductive pad terminal, in one configuration, and couple the TSV terminal to another terminal in another configuration. The TSVAD may also include a control circuit to generate control signals to cause an input selection circuit to drive a signal from the sending logic circuit onto the input terminal, and to cause an output selection circuit to drive a logic signal from the output terminal to the receiving logic circuit. | 03-10-2016 |