| Patent application number | Description | Published |
|---|
| 20090068482 | POLYIMIDE RESIN, POLYIMIDE FILM, AND POLYIMIDE LAMINATE - A polyimide resin composed of a repeating unit represented by the following formula (1): | 03-12-2009 |
| 20090160089 | Process for Producing Polyimide Film - The invention is directed to a process for producing polyimide film, including stretching, at 150° C. to 380° C. and a stretch ratio of 1.2 to 4.0, an unstretched polyimide film which is formed from a polyimide having a repeating unit represented by formula (1): | 06-25-2009 |
| 20090269597 | POLYIMIDE RESIN - A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. | 10-29-2009 |
| 20090291259 | POLYIMIDE RESIN - A polyimide resin which is satisfactory in solvent solubility and heat resistance, has a low coefficient of water absorption and is excellent in adhesive properties and a method for manufacturing the same, a film containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. | 11-26-2009 |
| 20090305046 | Thermocurable Polyimide Resin Composition - A thermosetting polyimide resin composition which, when used in an adhesive layer of a metal-clad laminate, is able to be manufactured by only the solvent removal without requiring an imidation step reaching 300° C. or higher and is thermosetting, a cured material of which is excellent in adhesive properties, low in coefficient of water absorption and satisfactory in heat resistance is provided. | 12-10-2009 |
| 20090306306 | THERMOSETTING POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF - Disclosed is a highly heat-resistant thermosetting polyimide resin composition having long pot life, which enables to obtain a cured product having flexibility and adhesiveness. The thermosetting polyimide resin composition can be obtained through the following steps (1)-(3). Step (1): A step wherein a polyimide (A) is synthesized by a thermal reaction by blending a tetracarboxylic acid component, which is composed of a tetracarboxylic acid dianhydride represented by the formula (1) and one or more compounds selected from tetracarboxylic acids represented by the formula (2) and derivatives of such tetracarboxylic acids, with an aliphatic diamine represented by the formula (3) in such a ratio that the mole number of the tetracarboxylic acid component is higher than the mole number of the aliphatic diamine. Step (2): A step wherein a polyimide (B) is synthesized by a thermal reaction by blending the polyimide (A) obtained in the step (1) with an aromatic diamine represented by the formula (4). Step (3): A step wherein the polyimide (B) obtained in the step (2) is blended and mixed with a bismaleimide compound represented by the formula (5). | 12-10-2009 |
| 20100029893 | TWO-PART THERMOCURABLE POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF - It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. | 02-04-2010 |
| 20100187719 | PROCESS AND APPARATUS FOR PRODUCTION OF COLORLESS TRANSPARENT RESIN FILM - A method for producing a colorless transparent resin film by a solution flow casting method containing: flow-casting an organic solvent solution of a polyamic acid or a polyimide on a support; and drying, the method containing at least the following step (1), step (2) and step (3) in this order, and an apparatus therefor:
| 07-29-2010 |
