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Jinbo, JP

Kazunori Jinbo, Fukushima JP

Patent application numberDescriptionPublished
20090045129Oil strainer - An oil strainer in which pressure loss by a turbulent flow in a case (b 10) is reduced as much as possible. The oil strainer has the case (02-19-2009

Masahiko Jinbo, Sakai City JP

Patent application numberDescriptionPublished
20090008198MULTI-POSITION BRAKE LEVER SYSTEM WITH A CONVERTER THAT CONVERTS A CABLE ACTUATOR TO A HYDRAULIC ACTUATOR - A hydraulic assembly for a hydraulic disc brake system that includes a housing defining a cylinder, a piston received in and moveable within the cylinder, a first lever operatively associated with one of the piston or the cylinder, and a second lever operatively associated with the other of the piston or the cylinder. Moving the first lever pushes one of the piston or the cylinder in a first direction, and moving the second lever pulls the other of the cylinder or the piston in a second direction. In a preferred embodiment, the piston has a non-actuated position and a fully actuated position, and the piston is biased towards the non-actuated position, and wherein the cylinder has a non-actuated and a fully-actuated position, and the cylinder is biased towards the non-actuated position.01-08-2009

Masahiro Jinbo, Akirono-Shi JP

Patent application numberDescriptionPublished
20100088056JIG, METHOD AND DATA GENERATING APPARATUS FOR CALIBRATING SPECTACLE FRAME SHAPE MEASURING APPARATUS, SPECTACLE FRAME SHAPE MEASURING APPARATUS AND SPECTACLE FRAME SHAPE MEASURING CALIBRATING SYSTEM - To provide a calibration jig which can perform three-dimensional calibration of measurement errors in a spectacle frame shape measuring apparatus.04-08-2010

Masahiro Jinbo, Tokyo JP

Patent application numberDescriptionPublished
20100012028Optical Lens Coating Apparatus - A light irradiation device (01-21-2010
20110146093LENS SHAPE MEASUREMENT DEVICE - An arithmetic control circuit (06-23-2011

Patent applications by Masahiro Jinbo, Tokyo JP

Naohisa Jinbo, Tokyo JP

Patent application numberDescriptionPublished
20100179274RUBBER COMPOSITION AND TIRE USING THE SAME - This invention provides a rubber composition having excellent workability, fracture characteristics and wear resistance and low heat buildup, which comprises not less than 20 parts by mass of a reinforcing filler (B) and 5 to 60 parts by mass of a modified aromatic vinyl compound-conjugated diene compound copolymer (C) having at least one functional group, an aromatic vinyl compound content of 5 to 80% by mass, a vinyl bond content in a conjugated diene compound portion of 10 to 80% by mass and a weight average molecular weight as measured through a gel permeation chromatography and converted to polystyrene of 5,000 to 500,000 based on 100 parts by mass of a rubber component (A) containing not less than 10% by mass of a modified conjugated diene-based polymer having at least one functional group.07-15-2010

Naoto Jinbo, Kanagawa JP

Patent application numberDescriptionPublished
20090277735ROTATION DAMPER - A rotary damper is provided so that air incorporated into a housing during assembly is, not excessively compressed, whereby a generation of a peculiar sound due to the air incorporated into the housing can be prevented even though the rotor rotates in both directions, and so that the air is stopped and captured in a fixed place whereby influence on the generated torque can be reduced, and irregularity of the torque can be reduced progressively.11-12-2009
20100253101DAMPER AND DOOR HANDLE WITH THIS DAMPER - In a case that a gap is provided between a circular plate portion 10-07-2010

Naoyuki Jinbo, Ogaki-Shi JP

Patent application numberDescriptionPublished
20110058348SEMICONDUCTOR DEVICE - A semiconductor device includes a first substrate having a power-source line, an IC device mounted on the first substrate and having a power-source line, a second substrate mounted on the IC device and having a base material, a power-source layer formed inside or on a surface of the base material, an insulation layer formed on the power-source layer, and a pad formed on the insulation layer, and a via conductor connecting the power-source layer and the pad. A first route connects the power-source line of the first substrate and the power-source line of the IC device. A second route connects the power-source line of the first substrate and the power-source layer of the second substrate. A third route connects the power-source layer of the second substrate and the power-source line of the IC device.03-10-2011

Takehito Jinbo, Susono-Shi JP

Patent application numberDescriptionPublished
20090294280Multilayer Film Forming Method and Multilayer Film Forming Apparatus - A multilayer film formation method enables the formation of a multilayer including a complex oxide layer and having the desired shape of an element without performing an etching process. The method positions a first mask (12-03-2009
20100038234Method for Forming Multilayer Film and Apparatus for Forming Multilayer Film - A multilayer thin film formation method and a multilayer thin film formation apparatus that improve dielectric characteristics and piezoelectric characteristics of a thin film formed from a lead-based perovskite complex oxide. The multilayer thin film formation method includes formation of a lower electrode layer (02-18-2010

Toshikatsu Jinbo, Kawasaki JP

Patent application numberDescriptionPublished
20090058453SEMICONDUCTOR DEVICE - A semiconductor device with technology for externally deciding if the stress test was performed or not. A semiconductor device includes a stress test circuit and a stress test decision circuit. The stress test circuit outputs control signals for executing the stress test to the stress test decision circuit and the object for testing. The stress test decision circuit then outputs the decision results if the stress test was performed, based on the control signals.03-05-2009

Toshikatsu Jinbo, Kanagawa JP

Patent application numberDescriptionPublished
20100085088Semiconductor device and method of supplying internal power to semiconductor device - Provided is a semiconductor device including a step-down circuit group including multiple step-down circuits that step down an external power supply voltage to a predetermined voltage; multiple functional circuits that require a reset operation upon power-on; and a power-on reset circuit that outputs a reset command to the multiple functional circuits, when an internal power supply voltage supplied from the step-down circuit group exceeds a voltage level necessary for an initialization operation. The multiple step-down circuits of the step-down circuit group are classified into a startup operating step-down circuit group that performs a step-down operation from power-on to supply the internal power supply voltage, and a startup non-operating step-down circuit group that stops operation upon power-on to interrupt supply of the internal power supply voltage. The startup non-operating step-down circuit group includes the multiple step-down circuits sequentially selected from one having a shortest wiring distance from the power-on reset circuit.04-08-2010
20110025279POWER SUPPLY CIRCUIT AND SEMICONDUCTOR DEVICE - A power supply circuit comprises: a first voltage booster circuit that receives a first clock signal having a fixed frequency, and supplies a voltage to a prescribed circuit; and a second voltage booster circuit that receives a second clock signal having a frequency corresponding to an operating frequency of the prescribed circuit, and supplies a voltage to the prescribed circuit.02-03-2011
20110050186VOLTAGE REDUCING CIRCUIT - A voltage reducing circuit includes an internal power supply section configured to reduce an external power supply voltage supplied from an external power supply to an internal power supply voltage which is lower than the external power supply voltage based on a reference voltage. A first current control section is configured to control a current flowing through the internal power supply section when the internal power supply voltage is lower than a setting voltage. A second current control section is configured to control the current flowing through the internal power supply section when the internal power supply voltage exceeds the setting voltage.03-03-2011

Patent applications by Toshikatsu Jinbo, Kanagawa JP

Yoshihiro Jinbo, Niigata JP

Patent application numberDescriptionPublished
20110085266PERPENDICULAR MAGNETIC RECORDING HEAD - A perpendicular magnetic recording head is provided, which has a head structure that narrows the erase band width in shingled write recording. A perpendicular magnetic recording head has a main pole that generates a recording magnetic field, a trailing shield positioned on the trailing side of the main pole, and a side shield positioned in the cross-track direction of the main pole. In the structure, a gap length (MP−SS distance) between the side shield and the main pole and a gap length (MP−TS distance) between the trailing shield and the main pole satisfy a relationship, (MP−TS distance)×0.5<(MP−SS distance)<(MP−TS distance)×1.5.04-14-2011