Patent application number | Description | Published |
20080266829 | SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES - A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via. | 10-30-2008 |
20080315371 | METHODS AND APPARATUS FOR EMI SHIELDING IN MULTI-CHIP MODULES - Methods and structures provide a shielded multi-layer package for use with multi-chip modules and the like. A substrate ( | 12-25-2008 |
20080315376 | Conformal EMI shielding with enhanced reliability - An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a molded package panel to a process carrier ( | 12-25-2008 |
20090057849 | INTERCONNECT IN A MULTI-ELEMENT PACKAGE - A packaged semiconductor device includes an interconnect layer over a first side of a polymer layer, a semiconductor device surrounded on at least three sides by the polymer layer and coupled to the interconnect layer, a first conductive element over a second side of the polymer layer, wherein the second side is opposite the first side, and a connector block within the polymer layer. The connector block has at least one electrical path extending from a first surface of the connector block to a second surface of the connector block. The at least one electrical path electrically couples the interconnect layer to the first conductive element. A method of forming the packaged semiconductor device is also described. | 03-05-2009 |
20090072357 | Integrated shielding process for precision high density module packaging - An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules ( | 03-19-2009 |
20090075428 | ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE - Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure. | 03-19-2009 |
20090243629 | METHOD AND APPARATUS FOR MINI MODULE EMI SHIELDING EVALUATION - A method for mini module EMI shielding effectiveness evaluation comprises providing a test vehicle including at least one test platform. The test platform includes at least one mini emitter, a mini receiver with a reference shield, and a mini receiver with a shield under test. EMI shielding effectiveness transmission signals are applied to the at least one mini emitter. Signals received by the mini receiver with a shield under test and the mini receiver with the reference shield are evaluated. The mini emitter, mini receiver with the reference shield, and mini receiver with the shield under test comprise components fabricated concurrently and under fabrication conditions used for fabrication of the test platform of the test vehicle. As used herein, a mini emitter and mini receiver may be interchanged according to the requirements of a given EMI shielding effectiveness evaluation. | 10-01-2009 |
20100006988 | Integrated Conformal Shielding Method and Process Using Redistributed Chip Packaging - An integrated conformal electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed on a plurality of encapsulated modules by attaching a plurality of modules ( | 01-14-2010 |
20100044840 | SHIELDED MULTI-LAYER PACKAGE STRUCTURES - Embodiments include shielded multi-layer packages for use with multi-chip modules and the like. A substrate ( | 02-25-2010 |
20100078760 | INTEGRATED CIRCUIT MODULE WITH INTEGRATED PASSIVE DEVICE - A disclosed integrated circuit (IC) module includes an IC panel and multi level circuit structure, referred to as an IPD structure, overlying an upper surface of the IC panel. The IC panel includes an electrically conductive embedded ground plane (EGP), an integrated circuit (IC) die, and an encapsulating material. The EGP is a substantially planar structure that includes or defines a plurality of cavities. The EGP may include or define an IC cavity and an IPD cavity. The IC die may be positioned within the IC cavity such that a perimeter of the IC cavity surrounds the IC die. The IPD structure may define or include a passive device such as an inductor. The passive device may be positioned or located overlying the void in the EGP. | 04-01-2010 |
20100127396 | INTEGRATED CIRCUIT MODULE AND METHOD OF PACKAGING SAME - An integrated circuit (IC) module ( | 05-27-2010 |
20100148333 | PACKAGING MILLIMETER WAVE MODULES - A module, which in one embodiment may be a packaged millimeter waver module, includes a semiconductor lid portion; a packaging portion attached to the lid portion, wherein the packaging portion comprises a plurality of vias, a carrier portion, wherein a first semiconductor die is attached to the carrier portion, the packaging portion is attached to the carrier portion so that the packaging portion is over the carrier portion and the semiconductor die is within an opening in the packaging portion, and the lid portion and the carrier portion form an first air gap around the first semiconductor device. | 06-17-2010 |
20100224969 | ELECTRONIC DEVICE AND METHOD OF PACKAGING AN ELECTRONIC DEVICE - An electronic device and a method of packaging an electronic device are disclosed. In one embodiment, the electronic device can include a first die. The electronic device can also include a dielectric layer defining a first opening. The first die can be disposed within the first opening. Further, the electronic device can include an encapsulating material disposed adjacent to the first die. The encapsulating material can have a different composition as compared to the dielectric layer. In a particular embodiment, the electronic device can also include an electrically conductive carrier contacting the dielectric layer and the encapsulating material. | 09-09-2010 |
20100267207 | INTEGRATED CIRCUIT MODULE AND METHOD OF PACKAGING SAME - An integrated circuit (IC) module ( | 10-21-2010 |
20100276766 | SHIELDING FOR A MICRO ELECTRO-MECHANICAL DEVICE AND METHOD THEREFOR - A device comprises a conductive substrate, a micro electromechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure. | 11-04-2010 |
20110003435 | ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE - Electromagnetic shielding for an integrated circuit packaged device. The method includes forming shielding structures by forming openings in an encapsulated structure. The openings are filled with conductive material that surrounds at least one die. The encapsulated structure may include a plurality of integrated circuit die. A layered redistribution structure is formed on one side of the encapsulated structure. | 01-06-2011 |
20110027984 | PROCESS OF FORMING AN ELECTRONIC DEVICE INCLUDING A CONDUCTIVE STUD OVER A BONDING PAD REGION - An electronic device can include an interconnect level including a bonding pad region. An insulating layer can overlie the interconnect level and include an opening over the bonding pad region. In one embodiment, a conductive stud can lie within the opening and can be substantially encapsulated. In another embodiment, the electronic device can include a barrier layer lying along a side and a bottom of the opening and a conductive stud lying within the opening. The conductive stud can substantially fill the opening. A majority of the conductive stud can lie within the opening. In still another embodiment, a process for forming an electronic device can include forming a conductive stud within the opening wherein from a top view, the conductive stud lies substantially completely within the opening. The process can also include forming a second barrier layer overlying the conductive stud. | 02-03-2011 |
20110075394 | SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES - A shielding structure is provided for shielding a signal path extending between a first layer and a second layer in an electronic device at a transition region with a transition that extends in a first direction and a second direction orthogonal to the first direction. The shielding structure includes a shielding structure portion, which includes a first shielding via in proximity to a first area of the signal path at the transition; a second shielding via in proximity to a second area of the signal path at the transition; and an area metallization electrically coupled to the first shielding via. | 03-31-2011 |
20110180917 | MICROELECTRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METHOD FOR FORMING THE SAME - A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate ( | 07-28-2011 |
20110181488 | ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND RELATED MANUFACTURING METHOD - An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module. | 07-28-2011 |
20110208467 | CALIBRATION STANDARDS AND METHODS OF THEIR FABRICATION AND USE - An embodiment of a calibration standard includes a substrate, a set of conductive structures fabricated on the substrate, and a conductive end structure fabricated on the substrate. The set of conductive structures include an inner conductive structure, a first outer conductive structure positioned to one side of the inner conductive structure, and a second outer conductive structure positioned to an opposite side of the inner conductive structure. The inner and outer conductive structures are aligned in parallel with each other along offset principal axes of the inner and outer conductive structures. The conductive end structure is electrically connected between an end of the first outer conductive structure and an end of the second outer conductive structure, and the conductive end structure is spatially separated from an end of the inner conductive structure at the surface of the substrate. | 08-25-2011 |
20110230014 | METHOD OF PROVIDING AN ELECTRONIC DEVICE INCLUDING DIES, A DIELECTRIC LAYER, AND AN ENCAPSULATING LAYER - A method of packaging an electronic device includes providing a patterned dielectric layer with an area sized to receive a first die, and another area sized to receive a second die, placing the first and second dies within the first and second areas, encapsulating the dies with an encapsulating material that has a different composition from the dielectric layer, forming a first signal line between the dies, forming a second signal line to the first die, and forming an additional signal line to the first die. The dielectric layer is disposed between the first signal line and the encapsulating material, the electronic device transmits a signal in an approximate range of 1 GHz to 100 GHz along the second signal line, and a signal that does not exceed approximately 900 MHz along the additional signal line. | 09-22-2011 |
20120223325 | MICROELECRONIC ASSEMBLY WITH AN EMBEDDED WAVEGUIDE ADAPTER AND METHOD FOR FORMING THE SAME - A microelectronic assembly and a method for forming a microelectronic assembly are provided. A semiconductor substrate is provided. The semiconductor substrate has first and second opposing sides and first and second portions. A tuning depression is formed on the second opposing side and the second portion of the semiconductor substrate. A radio frequency conductor is formed on the first opposing side of the first semiconductor substrate. The radio frequency conductor has a first end on the first portion of the first semiconductor substrate and a second end on the second portion of the first semiconductor substrate. A microelectronic die having an integrated circuit formed therein is attached to the first opposing side and the first portion of the semiconductor substrate such that the integrated circuit is electrically connected to the first end of the radio frequency conductor. | 09-06-2012 |
20120282719 | METHODS FOR FORMING A MICRO ELECTRO-MECHANICAL DEVICE - Embodiments include methods for forming a device comprising a conductive substrate, a micro electro-mechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure. | 11-08-2012 |
20130135152 | ELECTRONIC DEVICE MODULE WITH INTEGRATED ANTENNA STRUCTURE, AND RELATED MANUFACTURING METHOD - An electronic device module as described herein includes an electronic device package having device contacts. The electronic device package is fixed within encapsulating material, along with an electrically conductive ground layer. The ground layer has a device opening in which the electronic device package resides, and the ground layer also has an antenna opening spaced apart from the device opening. The device contacts and one side of the ground layer correspond to a first surface, and a patch antenna element overlies the first surface. The antenna element is coupled to the electronic device package, and a projection of the patch antenna element onto the first surface resides within the antenna opening. Also provided are methods for manufacturing such an electronic device module. | 05-30-2013 |
20130330846 | TEST VEHICLES FOR ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGES - A mechanism to electrically evaluate signals within an encapsulated semiconductor device package without the need for redesigning the package substrate is provided. Test bond pads are provided on a top surface of a semiconductor device die being placed within the semiconductor device package. One or more wire bonds having an elevated loop height are formed on the test bond pads. After encapsulating the semiconductor device package, the package encapsulant is subject to a backgrind process to expose a portion of the test connection wire bonds. Only an amount of the package encapsulant sufficient to expose each test connection wire bond is removed, so that the remaining encapsulant will continue to have the same effect on the package as would be present in a production device. Test probes can then be applied to the exposed test connection wire bonds. | 12-12-2013 |
20140353816 | METHOD OF FORMING A HIGH THERMAL CONDUCTING SEMICONDUCTOR DEVICE PACKAGE - A semiconductor device package ( | 12-04-2014 |