| Patent application number | Description | Published |
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| 20110048786 | PRINTED CIRCUIT BOARD HAVING A BUMP AND A METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board having a bump and a method of manufacturing the same. The printed circuit board having a bump includes an insulating layer into which an inner circuit layer is impregnated; a protective layer that is formed under the insulating layer and has an opening exposing a pad unit of the inner circuit layer; and a bump that is integrally formed with the pad unit and is protruded from the inner side of the protective layer to the outside of the protective layer through the opening. The bump is integrally formed with the pad unit, thereby improving bonding strength between the bump and the printed circuit board, and the surface area of the bump is formed to be wide, thereby improving bonding strength between a solder ball and the printed circuit board. | 03-03-2011 |
| 20110061922 | PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME - Disclosed is a package substrate, which includes an insulating layer including a circuit layer having a via for connecting layers and an insulating member formed in the insulating layer so as to separate the insulating layer, thus preventing the package substrate from warping and reducing land co-planarity of the substrate. A method of fabricating the package substrate is also provided, including (a) forming a first circuit layer on a carrier, (b) forming an insulating layer on the carrier having the first circuit layer, (c) forming an insulating member in the insulating layer so as to separate the insulating layer, (d) forming a second circuit layer including a via on the insulating layer and the insulating member, and (e) removing the carrier. | 03-17-2011 |
| 20110159282 | CARRIER FOR MANUFACTURING SUBSTRATE AND METHOD OF MANUFACTURING SUBSTRATE USING THE SAME - Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably. | 06-30-2011 |
| 20110163064 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME - Disclosed is a carrier for manufacturing a printed circuit board, which includes a first carrier including a first binder having a first opening and a first metal layer formed in the first opening of the first binder, and a second carrier, stacked with the first carrier and including a second binder having a second opening and a second metal layer which is formed in the second opening of the second binder and which partially overlaps with the first metal layer, so that the carrier is simply configured and the binders are formed not only on the lateral surfaces of the metal layers but also on the upper surfaces thereof, thus improving the reliability of bonding of the carrier at the periphery. A method of manufacturing the carrier and a method of manufacturing a printed circuit board using the carrier are also provided. | 07-07-2011 |
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| 20080314621 | Parallel chip embedded printed circuit board and manufacturing method thereof - A parallel chip embedded printed circuit board and manufacturing method thereof are disclosed. With a method of manufacturing a parallel chip embedded printed circuit board, comprising: (a) forming a parallel chip by connecting in parallel a plurality of unit chips having electrodes or electrically connected members formed on the upper and lower surfaces thereof, using at least one conductive member; (b) joining an electrode on one side of the parallel chip to a first board; and (c) joining an electrode on the other side of the parallel chip to a second board, chips may be embedded in a printed circuit board at a low cost, as a plurality of unit chips can be embedded at once, and a mechanical drill or router can be used instead of a laser drill in perforating the cavity or via holes. | 12-25-2008 |
| 20090106791 | METHOD AND APPARATUS FOR TRANSMITTING ADDITIONAL DATA RELATED TO BROADCASTING SERVICE, AND METHOD AND APPARATUS FOR RECEIVING ADDITIONAL DATA RELATED TO BROADCASTING SERVICE - Provided are a method and apparatus for transmitting section data and a method and apparatus for receiving section data. The method of receiving updated additional data from among additional data related to a broadcasting service includes: receiving an update information list including information regarding updates of the additional data; and receiving at least one of updated additional data based on the received update information list. | 04-23-2009 |
| 20090205005 | DIGITAL BROADCAST RECEPTION APPARATUS AND METHOD OF PROVIDING ADDITIONAL CONTENT - Disclosed is a method of providing additional content in a digital broadcast reception apparatus, the method including receiving a locator of additional content from a broadcast server while a user watches a broadcast program, receiving an instruction to insert the additional content from the broadcast server, receiving and reproducing the additional content from a content providing server designated by the locator, and switching back to the broadcast program. Thus, it is not necessary to allocate a separate channel and/or to switch channels for providing additional content. | 08-13-2009 |
| 20090307228 | METHOD OF SHARING USAGE INFORMATION, AND APPARATUS AND SYSTEM THEREOF - Provided are a method, apparatus, and system for sharing usage information of daily life. Usage information sharing system includes: a first home network including at least one electronic device generating metadata with respect to human behavior; a first collecting device collecting metadata with respect to usage information from first home network; a second collecting device transmitting metadata of first home network that is received from the first collecting device to a second home network; and a second home network comprising at least one electronic device receiving the metadata from the second collecting device and performing an operation corresponding to the metadata. Accordingly, behavioral actions of a person in daily life can be dynamically recognized via a home network and home electronic devices and converted into metadata, and transmitted to another home network in real-time via a network. Thus, the experiences and feelings of a user can be dynamically shared. | 12-10-2009 |
| 20100177356 | METHOD AND APPARATUS FOR PROCESSING IMAGE IN DIGITAL PRINTER - Provided are a method and apparatus for processing image data in a printer, in which page description language (PDL) data is analyzed and generated as standard color data, the generated standard color data is converted to a plurality of printer outputting colors, image conversion processes are parallely performed on the printer outputting colors, and printing data is generated on a page-by-page basis based on the printer outputting colors to which the image conversion processes are performed. | 07-15-2010 |
| 20110163974 | MULTI-TOUCH INPUT PROCESSING METHOD AND APPARATUS - A multi-touch input processing method performed by a multi-touch input device and a multi-touch recognition apparatus, the method including: recognizing a touch input from at least one input device; connecting the at least one input device via a radio communication; receiving touch input data from the at least one input device; and executing an application based on the touch input and the touch input data. The apparatus includes a multi-touch processing unit for recognizing a touch input from at least one input device; a radio communicating unit for connecting the at least one input device with the multi-touch processing unit via a radio communication; a touch input data receiving unit for receiving touch input data from the at least one input device, and an application executing unit for executing an application based on the touch input and the touch input data. | 07-07-2011 |
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| 20090038837 | Multilayered printed circuit board and manufacturing method thereof - A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board. | 02-12-2009 |
| 20090084494 | Substrate manufacturing method - A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate. | 04-02-2009 |
| 20090236125 | Multi-layer board and manufacturing method thereof - A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times. | 09-24-2009 |
