| Patent application number | Description | Published |
|---|
| 20090059536 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink. | 03-05-2009 |
| 20090290342 | LIGHT-GUIDING MODULE AND LED LIGHT SOURCE USING THE SAME - An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED. | 11-26-2009 |
| 20090323347 | LED LAMP - An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates. | 12-31-2009 |
| 20100002438 | LED LAMP - An LED lamp includes a heat sink having a base and a plurality of LED module assemblies mounted on a top surface of the base of the heat sink. Each of the LED module assemblies includes a fixing bracket secured to the top surface of the base, an LED module mounted on a top surface of the fixing bracket and two heat pipes engaging with the fixing bracket and the heat sink. The fixing bracket includes a bottom plate attached on the top surface of the base, a top plate on which the LED module is attached and a connecting plate interconnecting the bottom plate with the top plate. The heat pipes thermally connect the bottom plate and the heat sink with the top plate. | 01-07-2010 |
| 20100097766 | FIXING DEVICE FOR HEAT SINK - A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards. | 04-22-2010 |
| 20110061918 | BACKBOARD ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME - A backboard assembly includes a back plate, an electrically insulative sheet and a connection element. The connection element comprises a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of second engaging structures on a second side opposing to the first side to engage with the electrically insulative sheet. | 03-17-2011 |
