Jin Seong
Jin Seong Choi, Anyang-Si KR
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20140308603 | TITANIUM SUBOXIDE SUPPORTS FOR CATALYST ELECTRODE OF FUEL CELL AND LOW TEMPERATURE SYNTHESIS OF TITANIUM SUBOXIDE - Titanium suboxide (Ti | 10-16-2014 |
Jin Seong Hwang, Seoul KR
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20110098869 | ELECTRIC APPLIANCE AND A CONTROL METHOD THEREOF - An electric appliance and a control method thereof are disclosed. The electric appliance includes a communication device connected with a smart grid net to recognize electric power information including power-rate information for each time period, a sensing device configured to sense a predetermined operation mode and an operation state according to the operation mode, and a control device configured to implement power-saving operation based on the received electric power information and the state information sensed by the sensing device. | 04-28-2011 |
Jin Seong Kim, Gyeonggi-Do KR
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20150035141 | SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF - A semiconductor die package includes a semiconductor die, a film for improving die warpage bonded to a first face of the semiconductor die, a plurality of electrically conductive bumps formed on a second face of the semiconductor die, a substrate onto which the electrically conductive bumps of the second face of the semiconductor die are bonded to electrically connect the semiconductor die and the substrate, and a mold compound applied these components to form an exposed surface of the semiconductor die package that is coplanar with an exposed surface of the film. | 02-05-2015 |
20150084185 | SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN EXTENDED SUBSTRATE AND A BOTTOM SUBSTRATE - A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive. | 03-26-2015 |
20150108643 | SEMICONDUCTOR DEVICE WITH EMBEDDED SEMICONDUCTOR DIE AND SUBSTRATE-TO-SUBSTRATE INTERCONNECTS - A semiconductor device having an embedded semiconductor die and substrate-to-substrate interconnects is disclosed and may include a substrate with a top surface and a bottom surface, a semiconductor die bonded to the top surface of the substrate, a first mold material encapsulating the semiconductor die and at least a portion of the top surface of the substrate, and a first conductive bump that is on the top surface of the substrate and is at least partially encapsulated by the first mold material. An extended substrate may be coupled to the substrate utilizing the first conductive bump. A second conductive bump may be formed on the bottom surface of the substrate, and a second mold material may encapsulate at least a portion of the second conductive bump and at least a portion of the bottom surface of the substrate. A third mold material may be formed between the first mold material and the extended substrate. | 04-23-2015 |
Jin Seong Kim, Goyang-Si KR
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20150279811 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY - A method of manufacturing a semiconductor device that can be transferred to a circuit board with improved product reliability, and a semiconductor device manufactured according to the method, are described. A non-limiting example of the manufacturing method includes preparing a wafer having multiple semiconductor die portions formed on the semiconductor wafer, performing a sawing operation to separate the multiple semiconductor die portions into multiple discrete semiconductor die, arranging the multiple discrete semiconductor die on an adhesive member, encapsulating the multiple semiconductor die using an encapsulant, and performing a second sawing operation upon the encapsulated multiple semiconductor die to produce multiple individual encapsulated semiconductor devices. | 10-01-2015 |
20160104659 | Stacked Semiconductor Package and Manufacturing Method Thereof - A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles. | 04-14-2016 |
20160124280 | In-Cell Touch Liquid Crystal Display Apparatus, Method Of Manufacturing The Same, Method Of Manufacturing Thin Film Transistor Array Substrate, And Method Of Manufacturing Color Filter Array Substrate - Disclosed are an in-cell touch liquid crystal display (LCD) device based on a twisted nematic (TN) mode, a method of manufacturing the same, a method of manufacturing a thin film transistor (TFT) array substrate, and a method of manufacturing a color filter array substrate. The TFT array substrate includes a TFT disposed in a pixel area defined by an intersecting gate line and data line, a conductive line disposed on the TFT, and a transparent conductive layer in electrical contact with the conductive line. The color filter array substrate includes a light shield layer, a color filter, an overcoat layer covering the light shield layer and the color filter, a column spacer disposed on the overcoat layer, and a common electrode disposed on the overcoat layer and the column spacer, where the conductive line supplies the common electrode with a common voltage or a touch driving signal. | 05-05-2016 |
Jin Seong Kim, Suwon-Si KR
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20150156825 | CONTROL PANEL AND MICROWAVE OVEN - A control panel having a tunnel structure of discharging infiltrated moisture, and a microwave oven having the same. The microwave oven includes a cabinet provided with a cooking compartment in which food is heated by microwaves and a machine room divided from the cooking compartment and in which machine parts are installed, a door coupled to a front side of the cooking compartment so as to open and close, and a control panel coupled to a front side of the machine room and provided to allow a function to be selected, wherein the control panel is provided at an inside thereof with at least one tunnel allowing moisture infiltrated into the control panel to pass therethrough so that the moisture is discharged to the outside. The tunnel is formed along an outer peripheral surface of the input unit, thereby preventing device malfunction due to moisture infiltrated into the control panel. | 06-04-2015 |
Jin Seong Kim, Daejeon KR
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20120216598 | SYSTEM FOR MEASURING ABSOLUTE QUANTITY OF EACH COMPONENT OF GAS USING QMS - The present invention relates to a system for measuring an absolute quantity of each component of a gas using a QMS, more particularly to a system for measuring an absolute quantity of each component of a gas using a QMS, which is capable of performing not only a qualitative analysis but also a quantitative analysis in an accurate manner, using just a trace amount of gas introduced through a pinhole. According to the present invention, the productivity of products can be improved, and production management can be performed in an efficient manner, thereby improving industrial competitiveness. | 08-30-2012 |
Jin Seong Lee, Seoul KR
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20160125402 | METHOD AND DEVICE FOR PAYMENT USING TOKEN - Methods and devices for payment using token are provided, one of methods comprises, receiving a public key and a payment device token from a payment device, creating a digital signature through encryption of the payment device token and a stored user token using the public key, and payment request data including the digital signature, transmitting the payment request data to the payment device and updating the user token through performing of a token update operation. | 05-05-2016 |
Jin Seong Lee, Nonsan-Si KR
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20110034587 | Flameproof Thermoplastic Resin Composition and Method for Preparing the Same - A flameproof thermoplastic resin composition comprises (A) 100 parts by weight of a thermoplastic resin; (B) about 1 to about 40 parts by weight of a sublimational filler; and (C) about 1 to about 30 parts by weight of a flame retardant. The thermoplastic resin composition can solve the problems of high specific gravity and deterioration of flame retardancy caused by adding a conventional filler. | 02-10-2011 |
Jin Seong Lee, Suwon-Si KR
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20130168619 | Thermoplastic Resin Composition Having Excellent Flame Retardancy, Colorability and Thermal Stability - A thermoplastic resin composition comprises (A) about 45 to about 95% by weight of an aromatic copolymer, (B) about 5 to about 55% by weight of a polycarbonate resin, (C) about 1 to about 30 parts by weight of a halogen-containing compound based on about 100 parts by weight of the aromatic copolymer (A) and the polycarbonate resin (B), and (D) about 0 to about 2 parts by weight of an antimony compound based on about 100 parts by weight of the aromatic copolymer (A) and the polycarbonate resin (B). The thermoplastic resin composition can have excellent flame retardancy, colorability and thermal stability. | 07-04-2013 |
Jin Seong Lim, Seoul KR
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20100161962 | SYSTEM AND METHOD OF TRANSMITTING/RECEIVING SECURITY DATA - There are provided a security server for intermediating transmission/reception of security data between a service providing server and a user terminal, a security data transmission/reception system and a method. In order to intermediate the transmission/reception of security data between the service providing server and the user terminal, the security server may generate a session key corresponding to a secret key provided from a user terminal, receive security data together with the session key from a security data transmitter, encode the security data with the secret key corresponding to the session key, store the encoded security data, provide a data encryption key to the security data transmitter, decode the encoded security data with the secret key corresponding to the session key when the session key is received together with a security data request key from a security data receiver, and provide the decoded security data to the security data receiver. | 06-24-2010 |
Jin Seong Park, Gyeonggi-Do KR
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20100176380 | ORGANIC PHOTOELECTRIC DEVICE AND MATERIAL USED THEREIN - The present invention relates to an organic photoelectric device and a material used therein. The organic photoelectric device includes a substrate, an anode disposed on the substrate, a hole transport layer (HTL) disposed on the anode, an emission layer disposed on the hole transport layer (HTL), and a cathode disposed on the emission layer. The emission layer is characterized in that it includes a host and a phosphorescent dopant, and the host has a difference between the reduction potential or oxidation potential of the host and the reduction potential or oxidation potential of the phosphorescent dopant of less than 0.5 eV. The organic photoelectric device according to the present invention is capable of accomplishing higher efficiency and a lower driving voltage than those of the conventional organic photoelectric device, and has a simplified structure resulting in saving of manufacturing cost. | 07-15-2010 |
Jin Seong Park, Gwangju KR
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20130208764 | COMPOSITE MATERIAL FOR A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING A TEMPERATURE SENSOR USING THE SAME - The present disclosure relates to a composite material for a temperature sensor, and a method of manufacturing the temperature sensor using the same. The composite material according to the disclosure may contain four or more kinds of metal oxides that are combined with highly insulating materials, thereby producing a material with semiconductor-like properties that makes it possible to easily and accurately measure a temperature even at a high temperature in the range of 500° C. and above. Furthermore, unlike a conventional temperature sensors in which an electrode is printed/plated on the device surface, the sensor of the disclosure includes electrode wires with a predetermined diameter that are inserted into the metal oxide of the temperature sensor during a process in which the metal oxide is press-molded to form the temperature sensor so the electrode wires are prevented from becoming disconnected from the device. | 08-15-2013 |
20130308683 | COMPOSITION FOR SENSOR ELEMENT, TEMPERATURE SENSOR AND METHOD FOR MANUFACTURING TEMPERATURE SENSOR - Disclosed herein is a composition of a sensor element, a temperature sensor having the composition of the sensor element and a method of manufacturing the temperature sensor. The sensor element composition comprising Y | 11-21-2013 |
20140367621 | COMPOSITE MATERIAL FOR A TEMPERATURE SENSOR, AND A METHOD OF MANUFACTURING A TEMPERATURE SENSOR USING THE SAME - A composite material for a temperature sensor and a method of manufacturing the temperature sensor using the composite material are provided. The composite material contains four or more kinds of metal oxides combined with highly insulating materials to produce a material with semiconductor-like properties to more accurately measure a temperature at high temperatures in the range of 500° C. and above. The sensor includes electrode wires having a predetermined diameter inserted into the metal oxide of the temperature sensor when the metal oxide is press-molded to form the temperature sensor. Through the connection of the electrode wires to the temperature sensor device, disconnection of the electrode wires from the device even at a high temperature. | 12-18-2014 |
20150137050 | METAL-OXIDE SINTERED BODY FOR TEMPERATURE SENSOR, AND METHOD FOR MANUFACTURING SAME - A metal-oxide sintered body for a temperature sensor that can be installed in a combustion engine and components connected to the engine in order to sense temperature uses metal oxide. The metal-oxide sintered body has particles with large resistance values and particles with small resistance values mixed therein. The particles with the small resistance values may serve as a main resistance component in the temperature range of 0° C. to 500° C., and the particles with the large resistance values may contribute to the total resistance in proportion to the mixing ratio in the temperature range of 500° C. to 900° C. Thus, the metal-oxide sintered body enables a single sensor to measure all resistances, and can be used in an exhaust device or the like of a motor vehicle that requires temperature measurement over a wide range of temperatures. | 05-21-2015 |
Jin Seong Park, Seoul KR
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20150290113 | HYDROPHILIC SILICON PARTICLES WITH IMPROVED HEAT RESISTANCE AND FEEL, AND PREPARATION METHOD THEREFOR - The present invention is related to hydrophilic silicone powders and the methods to prepare the same that contain 1-30 mol % of units selected from a group consisting of (a) partially hydrolyzed silsesquioxane containing one hydroxyl group (T2) and silica (Q3), (b) partially hydrolyzed silsesquioxane containing two hydroxyl groups (T1) and silica (Q3), (c) silica containing three hydroxyl groups (Q1), hydrolyzed silicone containing siloxane (D1), and mixtures thereof, and hydrophilic silicone powders consisting of core described above and shells composed of silica, and/or titanium dioxide. The particles are useful as ingredients for cosmetics and emulsions because they have good heat resistance, good touching feeling, and readily disperse in water due to their hydrophilic nature and high water absorbency. | 10-15-2015 |
Jin-Seong Hwang, Geumcheon-Gu KR
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20120330442 | DEVICE FOR CONTROLLING WASHING MACHINE AND CONTROL METHOD THEREOF - Disclosed is a control apparatus and method of a clothes treating machine. Power consumption can be expected or detected when an operation of the clothes treating apparatus is determined, and greenhouse gas emissions to an energy source or electricity prices according can be expected on the basis of power consumption. In addition, reasonable operations can be determined on the basis of recommended operation conditions provided by the clothes treating apparatus, and power consumption of the clothes treating machine, greenhouse gas emissions to an energy source or electricity prices can be easily calculated without providing an additional complicated power detection circuit. | 12-27-2012 |
Jin-Seong Jang, Seoul KR
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20150130461 | MAGNETIC RESONANCE IMAGING APPARATUS AND OPERATING METHOD FOR THE SAME - Provided is a magnetic resonance imaging (MRI) apparatus. The MRI apparatus includes: a storage configured to store a plurality of MR signal data sets generated by applying a plurality of values of a first MR parameter and a plurality of values of a second MR parameter to an MR signal data generation model; a data acquisition unit configured to acquire an MR signal data set for a specific position of an object by undersampling an MR signal, based on the values of the first MR parameter; and an image processor configured to extract an MR signal data set that matches the MR signal data set acquired by undersampling the MR signal (hereinafter referred to as the ‘undersampled MR signal data set’) from among the stored MR signal data sets, obtain a value of the second MR parameter for the undersampled MR signal data set based on the extracted MR signal data set, and interpolate unsampled MR signal data in the undersampled MR signal data set (hereinafter, referred to as the ‘interpolated MR signal data set’) by using the value of the second MR parameter. | 05-14-2015 |
20150135838 | METHOD AND APPARATUS FOR DETECTING AN ENVELOPE FOR ULTRASONIC SIGNALS - A method and apparatus for envelope detection are disclosed. An envelope detection method according to an embodiment of the invention can include: receiving ultrasonic signals reflected off a target object; detecting peaks by using differences in pulses in the received signals; and generating an envelope by connecting the detected peaks with straight or curved lines. | 05-21-2015 |
20150212176 | MAGNETIC RESONANCE IMAGING APPARATUS AND METHOD FOR OPERATING THE SAME - Provided is a magnetic resonance imaging (MRI) apparatus. The MRI apparatus includes: a data acquisition unit configured to acquire a first k-space including a first missing line by undersampling an MR signal received from an object at a first time point, acquire a second k-space including a first acquired line corresponding to the first missing line by undersampling an MR signal received from the object at a second time point, and acquire a third k-space including a second acquired line corresponding to the first missing line by undersampling an MR signal received from the object at a third time point; and an image processor configured to interpolate data in the first missing line based on data in the first and second acquired lines. | 07-30-2015 |
Jin-Seong Kim, Incheon KR
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20130223425 | APPARATUS AND METHOD FOR ACTIVELY DETERMINING COMMUNICATION LINK IN COMMUNICATION SYSTEM - An apparatus and a method for determining a communication link in a client node of a communication system are provided. In the method, access network information and channel state information for at least one host node are determined. Link state information for each host node is determined using the access network information and the channel state information for the corresponding host node. One of the at least one host node is determined with consideration of the link state information for each of the at least one host node. | 08-29-2013 |
Jin-Seong Kim, Seoul KR
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20090304123 | APPARATUS AND METHOD FOR DETECTING SIGNAL IN MIMO SYSTEM - An apparatus and method for detecting a signal in a Multiple-Input Multiple-Output (MIMO) system are provided. The method includes filtering each stream of a received signal, acquiring a new search space by acquiring a set of candidates having reliability greater than a threshold with respect to each filtered stream, and detecting a signal for each stream of the new search space. | 12-10-2009 |
20140070249 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM INCLUDING THE SAME - A light emitting device according to the embodiment includes a body; a first lead electrode having a first bonding part and a second bonding part; a second lead electrode having a third bonding part and a fourth bonding part; a gap part between the first and second lead electrodes; a third lead electrode on a bottom surface of the body; a fourth lead electrode on the bottom surface of the body; a first connection electrode; a second connection electrode; a light emitting chip; and a first bonding member, wherein the gap part includes a first gap part disposed between the first and third bonding parts, and the first gap part includes first and second regions spaced apart from each other corresponding to a width of the third bonding part, and a third region connected to the first and second regions and disposed perpendicularly to the first and second regions. | 03-13-2014 |
20140070259 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME - Disclosed are a light emitting device and a lighting system having the same. The light emitting device includes a body including first and second lateral side parts, third and fourth lateral side parts, and a cavity, a first lead frame extending in a direction of the first lateral side part of the body, a second lead frame extending in a direction of the second lateral side part of the body, a gap part between the first and second lead frames, and a molding member in the cavity. The first lead frame includes a first recess part having a first depth, and a second recess part recessed at a second depth in a region adjacent to the first lateral side part of the body, and the first depth of the first recess part is different from the second depth of the second recess part. | 03-13-2014 |
20140071689 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM HAVING THE SAME - Disclosed are a light emitting device. The light emitting device includes a body having a cavity; a plurality of lead frames in the cavity; a light emitting chip; a first molding member having a first metal oxide material around the light emitting chip; and a second molding member having a second metal oxide material on the first molding member and the light emitting chip, wherein the light emitting chip includes a reflective electrode layer under a light emitting structure, wherein a top surface of the first molding member extends from a region between a top surface of the light emitting chip and a lateral side of the reflective electrode layer at a predetermined curvature, and wherein a bottom surface of the second molding member includes a curved surface which is convex toward the first molding member. | 03-13-2014 |
20140071700 | LIGHT EMITTING DEVICE AND LIGHTING SYSTEM INCLUDING THE SAME - Disclosed is a light emitting device. The light emitting device includes: a body including a cavity having first and second inner sides opposite to each other and third and fourth inner sides connected to first and second inner sides and opposite to each other; a first lead frame extending from a bottom of cavity under a first inner side of cavity; a second lead frame extending from the bottom of cavity under a second inner side of cavity; a gap part in the bottom of cavity between first and second lead frames; a light emitting chip on first lead frame; a protective chip on the second lead frame; a recess region recessed outward of body from at least one of third and fourth inner sides of cavity; and a first wire connected to the second frame disposed between light emitting chip and a sidewall of the recess region. | 03-13-2014 |
20140097744 | PHOSPHOR AND LIGHT EMITTING DEVICE - A phosphor and a light emitting device including the phosphor may be provided that emits light having a peak wavelength between a green wavelength band and a yellow wavelength band and has a triclinic system crystal structure of which the chemical formula is MSi | 04-10-2014 |
Jin-Seong Lee, Anyang-Si KR
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20150125050 | FINGERPRINT RECOGNITION SENSOR MODULE HAVING SENSING REGION SEPARATED FROM ASIC - Disclosed is a fingerprint recognition sensor module including a flexible printed circuit board. The flexible printed circuit board includes a first sensing region formed with a first sensing input unit, a second sensing region formed with a second sensing input unit, a chip mounting region on which an ASIC is mounted to convert a fingerprint sensed through the input units into a digital signal and transmit the digital signal to a connector, and a connection section to which the connector is connected. The chip mounting region and the first and second sensing regions are separated from each other on the same surface, and the flexible printed circuit board is folded such that projection planes of the chip mounting region and the first and second sensing regions are superposed one above another. | 05-07-2015 |
Jin-Seong Lee, Gapyeong-Gun KR
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20130248980 | CAPACITORLESS MEMORY DEVICE - According to an example embodiment of inventive concepts, a capacitorless memory device includes a capacitorless memory cell that includes a bit line on a substrate; a read transistor, and a write transistor. The read transistor may include first to third impurity layers stacked in a vertical direction on the bit line. The first and third layers may be a first conductive type, and the second impurity layer may be a second conductive type that differs from the first conductive type. The write transistor may include a source layer, a body layer, and a drain layer stacked in the vertical direction on the substrate, and a gate line that is adjacent to a side surface of the body layer. The gate line may be spaced apart from the side surface of the body layer. The source layer may be adjacent to a side surface of the second impurity layer. | 09-26-2013 |
20130256774 | SEMICONDUCTOR MEMORY DEVICES - Semiconductor memory devices may include a write transistor including a first write gate controlling a first source/drain terminal and a second write gate controlling a channel region, and a read transistor including a memory node gate connected to the first source/drain terminal of the write transistor. The first write gate may have a first work function and the second write gate may have a second work function different from the first work function. The first source/drain terminal of the write transistor may not have a PN junction. | 10-03-2013 |