Patent application number | Description | Published |
20090034083 | Method of forming a microlens array and imaging device and system containing such a microlens array - Method of forming a microlens array and an imaging device and system containing such a microlens array. The microlens array is formed with a plurality of substantially gapless microlenses. A plurality of overlying portions are formed on the microlenses and have substantially the same curvature and/or height. | 02-05-2009 |
20090109542 | Lens, a lens array and imaging device and system having a lens, and method of forming the same - A lens, a lens array and imaging device and system containing a lens, and a method of forming a lens array and an imaging device and system containing a lens. Each lens has varying reflection indices in a radial direction. | 04-30-2009 |
20090147379 | Microlenses with patterned holes to produce a desired focus location - A method, apparatus and system providing a microlens having a substantially flat upper surface and having a plurality of holes arranged in a pattern in a microlens material which produces a focal point at a desired location. | 06-11-2009 |
20090278977 | METHOD AND APPARATUS PROVIDING PRE-DISTORTED SOLID STATE IMAGE SENSORS FOR LENS DISTORTION COMPENSATION - Pixels in an imaging array are configured and arranged to compensate for various geometric distortions caused by a lens with which the array is used. | 11-12-2009 |
20100230794 | Method For Fabricating Semiconductor Components Using Maskless Back Side Alignment To Conductive Vias - A method for fabricating semiconductor components includes the steps of: providing a semiconductor substrate having a circuit side, a back side and conductive vias; removing portions of the substrate from the back side to expose terminal portions of the conductive vias; depositing a polymer layer on the back side encapsulating the terminal portions; and then planarizing the polymer layer and ends of the terminal portions to form self aligned conductors embedded in the polymer layer. Additional back side elements, such as terminal contacts and back side redistribution conductors, can also be formed in electrical contact with the conductive vias. A semiconductor component includes the semiconductor substrate, the conductive vias, and the back side conductors embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another. | 09-16-2010 |
20110235306 | MULTI-LENS SOLID STATE LIGHTING DEVICES - Solid state lighting (SSL) devices including a plurality of SSL emitters and methods for manufacturing SSL devices are disclosed. Several embodiments of SSL devices in accordance with the technology include a support having a first lead and a second lead, a plurality of individual SSL emitters attached to the support, and a plurality of lenses. Each SSL emitter has a first contact electrically coupled to the first lead of the support and a second contact electrically coupled to the second lead of the support such that the SSL emitters are commonly connected. Each lens has a curved surface and is aligned with a single corresponding SSL emitter. | 09-29-2011 |
20110272822 | Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors - A semiconductor component includes a semiconductor substrate, conductive vias in the substrate having terminal portions, a polymer layer on the substrate and back side conductors formed by the terminal portions of the conductive vias embedded in the polymer layer. A stacked semiconductor component includes a plurality of components having aligned conductive vias in electrical communication with one another. | 11-10-2011 |
20140175468 | MULTI-LENS SOLID STATE LIGHTING DEVICES - Solid state lighting (SSL) devices including a plurality of SSL emitters and methods for manufacturing SSL devices are disclosed. Several embodiments of SSL devices in accordance with the technology include a support having a first lead and a second lead, a plurality of individual SSL emitters attached to the support, and a plurality of lenses. Each SSL emitter has a first contact electrically coupled to the first lead of the support and a second contact electrically coupled to the second lead of the support such that the SSL emitters are commonly connected. Each lens has a curved surface and is aligned with a single corresponding SSL emitter. | 06-26-2014 |