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| 20110050890 | METHOD AND SYSTEM FOR MEASURING STRUCTURAL VIBRATION USING CURVE FITTING FROM VIDEO SIGNAL - A method and system for measuring structural vibration using curve fitting from a video signal, which can reduce an error in vibration measurement displacement, is provided. A method for measuring structural vibration using curve fitting from a video signal, the method includes the steps of: obtaining a video signal of the object; converting the video signal of the object into a gray video signal; adjusting the brightness of the converted video signal; separating an area to be measured from the brightness-adjusted video signal; selecting an edge area of the object from a video signal of the separated area; removing noises from the edge regions; and performing curve fitting with respect to the noise-removed video signal of the edge area. Accordingly, a displacement error is reduced, so that vibration can be more exactly measured. | 03-03-2011 |
| 20110185790 | Leakage Detection Method and System Using Camera Image - Provided is a leakage detection system and method using an image that may detect a leakage of high temperature high pressure steam using an image. The leakage detection method may include: obtaining an image of a target where a leakage of high temperature high pressure steam occurs; detecting, in the obtained image, an edge image before the leakage occurs and an edge image after the leakage occurs; detecting only a leakage edge image by comparing the edge image before the leakage occurs and the edge image after the leakage occurs; removing noise from the leakage edge image; and displaying the leakage edge image in which the noise is removed. | 08-04-2011 |
| 20110314916 | METHOD AND DEVICE FOR LOW FREQUENCY VIBRATION EXCITATION USING ULTRASONIC WAVE - Provided is a method and device for low frequency vibration excitation, which may generate a low frequency using a plurality of ultrasonic generators for high frequency. The method generates ultrasonic waves using a plurality of ultrasonic generators attached to a target structure to induce a beat phenomenon, and extract a frequency lower than a frequency of each of the plurality of the ultrasonic generators to measure a property of the target structure, and thereby may be freely applied to a target structure, regardless of a shape of the target structure such as a plate, a curved pipe, and the like, using a relatively small-sized ultrasonic sensor for high frequency, and may excite a specific frequency of an acceleration range, so that the ultrasonic excitation method may be applicable in a relatively poor Signal-to-Noise Ratio (SNR) range. | 12-29-2011 |
| 20110314917 | METHOD AND DEVICE FOR LOW FREQUENCY VIBRATION EXCITATION USING ULTRASONIC WAVE - Provided is a method and device for low frequency vibration excitation, which may generate a low frequency using a plurality of ultrasonic generators for high frequency. The method generates ultrasonic waves using a plurality of ultrasonic generators attached to a target structure to induce a beat phenomenon, and extract a frequency lower than a frequency of each of the plurality of the ultrasonic generators to measure a property of the target structure, and thereby may be freely applied to a target structure, regardless of a shape of the target structure such as a plate, a curved pipe, and the like, using a relatively small-sized ultrasonic sensor for high frequency, and may excite a specific frequency of an acceleration range, so that the ultrasonic excitation method may be applicable in a relatively poor Signal-to-Noise Ratio (SNR) range. | 12-29-2011 |
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| 20080274581 | METHOD FOR MANUFACTURING IMAGE SENSOR - A method for manufacturing an image sensor that includes reducing the surface energy of the microlenses to prevent particles generated during a wafer sawing process from damaging the microlens or adhering to the microlens to cause a defective image. | 11-06-2008 |
| 20080283949 | Image Sensor and Method for Manufacturing the Same - An image sensor and a method for manufacturing the same are provided. The image sensor comprises a pixel region defined on a substrate, an interlayer dielectric on the substrate and comprising a trench above the pixel region, a color filter within the trench, and a microlens on the color filter. | 11-20-2008 |
| 20080284024 | Semiconductor Device and Method of Manufacturing the Same - A metal interconnection of semiconductor device and method for fabricating the same is provided. The semiconductor device can include a semiconductor substrate formed with device structures such as transistors. An interlayer dielectric layer can be formed on the semiconductor substrate with a metal interconnection formed therethrough. A spacer can be formed on at least a portion of a sidewall of the metal interconnection. A diffusion barrier can be formed on an upper surface of the metal interconnection. | 11-20-2008 |
| 20090101952 | IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - An image sensor and a method for manufacturing the same that includes photodiodes formed in a semiconductor substrate, a first insulating layer formed over the semiconductor substrate, the first insulating layer including a seed pattern corresponding spatially to the positions of the photodiodes, lower microlenses composed of an organic material formed over the seed pattern, a second insulating layer formed over the lower microlenses, a third insulating layer formed over the second insulating layer, color filters formed over the third insulating layer, and upper micro lenses formed over the color filters. | 04-23-2009 |
| 20090321866 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME - An image sensor of a semiconductor and a method for fabricating the same includes a photodiode; an interlayer dielectric layer formed over the photodiode; a wave guide including an ion implantation layer formed in the interlayer dielectric; a color filter formed over the interlayer dielectric layer; and a micro lens formed over the color filter. | 12-31-2009 |
| 20100164034 | IMAGE SENSOR AND FABRICATION METHOD THEREOF - An image sensor and a method of fabricating an image sensor. A method of fabricating an image sensor may include forming a plurality of photodiodes on and/or over a semiconductor substrate, a filter array including color filters arranged corresponding to upper parts of photodiodes, a plurality of hydrophilic lenses arranged over a filter array spaced apart from one another, and/or a plurality of hydrophobic lenses arranged over a filter array between hydrophilic lenses. A curvature of a lens may be substantially equal in a horizontal, vertical and/or diagonal direction. | 07-01-2010 |
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| 20080316607 | IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME - An image sensor and a method of manufacturing the same. In one example embodiment, an image sensor includes an interlayer insulation layer formed on a substrate of a pixel area, a plurality of first microlenses spaced apart from each other on the interlayer insulation layer, and a plurality of second microlenses formed beside the plurality of first microlenses. The plurality of second microlenses each has a diameter different from a diameter of each of the plurality of first microlenses. | 12-25-2008 |
| 20100096351 | RACK MODULE AND FURNITURE HAVING A RACK MODULE - The present invention relates to a DIY or a assemble furniture which has a containing room inside the furniture and connecting members on exterior surface of the furniture. According to the present invention, user is able to make many shapes of furniture by connecting at least one of rack modules. | 04-22-2010 |
| 20120060226 | METHOD FOR AUTHORIZING USE OF AUGMENTED REALITY (AR) INFORMATION AND APPARATUS - A method for authorizing use of Augmented Reality (AR) information includes acquiring information regarding a location at which the AR information is to be provided, authorizing a user to use the AR information, creating attribute information including the AR information, the location information, and authority information, and transmitting the attribute information to an AR system. The AR system can register the attribute information, and can provide the AR information only to authorized users. An apparatus to authorize use of Augmented Reality (AR) information includes a location information acquiring unit, an authorization unit to authorize a user to use the AR information, and an AR information processor to create attribute information. The attribute information is transmitted to an AR system as a request for the AR system to register the attribute information so the AR system provides the AR information only to authorized users. | 03-08-2012 |
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| 20090108309 | CMOS IMAGE SENSOR AND METHOD FOR MANUFACTURING THE SAME - A CMOS image sensor, which can monitor accurate overlay information even when a dual microlens is employed, and a method for manufacturing the same are disclosed. The CMOS image sensor includes a substrate having a photosensitive element formed therein; a light shield layer formed over the substrate and having a portion spatially corresponding to the photosensitive element; a color filter formed over the light shield layer; and a microlens having a first microlens portion and a second microlens portion formed spaced apart over the color filter, the second microlens portion being formed in a region surrounded by the first microlens portion. | 04-30-2009 |
| 20100052085 | IMAGE SENSOR AND MANUFACTURING METHOD THEREOF - An image sensor has a large bridge margin from a repulsive force between adjacent micro lenses having different surface properties. The image sensor has a larger bridge margin with a configuration of a stepped portion between two areas, where the first and the second group of micro lenses are formed, over a planarization layer below these two areas. Thus, a zero gap is realized, where no gap between micro lenses exists, and the fill factor of micro lens is maximized. By the realization of the zero gap, interference effects decrease, noise decreases, and fill factor increases, and thus the sensitivity of an image sensor increases, especially the green sensitivity. | 03-04-2010 |
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| 20090035941 | METHODS AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE IN A PROCESSING CHAMBER - An apparatus for manufacturing a semiconductor device includes a process chamber configured to perform a plurality of different processes on a substrate. A gas supply unit is configured to supply at least one process gas to the process chamber. At least one upper electrode unit is positioned at an upper portion of the process chamber. At least one lower electrode unit is opposite the upper electrode unit and configured to support a substrate thereon. A driving member is connected to at least one of the lower electrode unit and the upper electrode unit and is configured to move the lower electrode unit and/or the upper electrode unit to control a distance between the upper and the lower electrode units. A power supply unit is configured to apply a first power to the upper electrode unit and to apply a second power to the lower electrode unit. | 02-05-2009 |
| 20090137117 | Method Forming Contact Plug for Semiconductor Device Using H2 Remote Plasma Treatment - Provided are methods of forming a contact plug of a semiconductor device. Methods of forming a contact plug of a semiconductor device may include forming an interlayer insulating layer on a semiconductor substrate on which a lower structure is formed, forming a contact hole in the interlayer insulating layer, the contact hole exposing the lower structure, and forming a W layer and then a WN layer to form a W/WN barrier layer in the contact hole. Methods may include H | 05-28-2009 |
| 20090147181 | BACKLIGHT ASSEMBLY, DISPLAY APPARATUS HAVING THE SAME AND METHOD FOR ASSEMBLING THE SAME - A backlight assembly comprises a light source unit emitting light, a heat-blocking plate disposed over the light source unit to prevent heat generated from the light source unit from being upwardly transmitted, and a receiving container receiving the light source unit and the heat-blocking plate. The receiving container includes a bottom plate and a plurality of sidewalls. Each of the sidewalls extends from a side of the bottom plate and has openings formed through each of the sidewalls. The openings are formed over the heat-blocking plate. | 06-11-2009 |
| 20090325371 | Methods of Forming Integrated Circuit Devices Having Stacked Gate Electrodes - A method of forming a gate electrode of a semiconductor device is provided, the method including: forming a plurality of stacked structures each comprising a tunnel dielectric layer, a first silicon layer for floating gates, an intergate dielectric layer, a second silicon layer for control gates, and a mask pattern, on a semiconductor substrate in the stated order; forming a first interlayer dielectric layer between the plurality of stacked structures so that a top surface of the mask pattern is exposed; selectively removing the mask pattern of which the top surface is exposed; forming a third silicon layer in an area from which the hard disk layer was removed, and forming a silicon layer comprising the third silicon layer and the second silicon layer; recessing the first interlayer dielectric layer so that an upper portion of the silicon layer protrudes over the he first interlayer dielectric layer; and forming a metal silicide layer on the upper portion of the silicon layer. | 12-31-2009 |
