Patent application number | Description | Published |
20090087994 | METHOD OF FORMING FINE PATTERNS AND MANUFACTURING SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE SAME - A method of forming a fine pattern begins with providing a c-plane hexagonal semiconductor crystal. A mask having a predetermined pattern is formed on the semiconductor crystal. The semiconductor crystal is dry-etched by using the mask to form a first fine pattern on the semiconductor crystal. The semiconductor crystal including the first fine pattern is wet-etched to expand the first fine pattern in a horizontal direction to form a second fine pattern. The second fine pattern obtained in the wet-etching the semiconductor crystal has a bottom surface and a sidewall that have unique crystal planes, respectively. The present fine-pattern forming process can be advantageously applied to a semiconductor light emitting device, particularly, to a phonic crystal structure required to have fine patterns or a structure using a surface plasmon resonance principle. | 04-02-2009 |
20100178046 | CAMERA FLASH LENS AND PORTABLE DEVICE INCLUDING THE SAME - A camera flash lens for a plurality of light emitting diodes (LEDs) mounted on a board and serving as a light source of a camera flash, includes a plurality of annular lenses corresponding to the plurality of LEDs, respectively. The plurality of annular lenses each include an edge portion extending toward the board to reflect and collect light emitted from the edge of a corresponding LED of the plurality of LEDs, and a central portion having an inner surface with a Fresnel shape or a curved shape to collect light emitted from the top of the corresponding LED. | 07-15-2010 |
20110019991 | MOBILE TERMINAL HAVING CAMERA FLASH AND METHOD FOR CONTROLLING CAMERA FLASH - A mobile terminal including an LED camera flash includes a lens, which is for photographing an object, an image sensing unit, which generates a sensor result value by executing automatic exposure and automatic white balance, a flash module, which includes a flash driving unit that controls the LED camera flash, an actuator, which moves the lens and records a distance traveled by the lens, and a camera control module, which sets an exposure gain value by using the sensor result value, extracts a distance current value and a distance gain value by using position information of the lens that is determined by using the distance traveled by the lens, and controls the flash driving unit so as to adjust a brightness of the LED camera flash according to a gain correction value, which is set by using the exposure gain value, the distance current value and the distance gain value. | 01-27-2011 |
20110133220 | LIGHT EMITTING DIODE, METHOD FOR FABRICATING PHOSPHOR LAYER, AND LIGHTING APPARATUS - A light emitting diode includes: a light emitting diode chip including a substrate and a light emission structure disposed on the substrate; and a phosphor layer formed to cover at least one surface of a diode upper surface and a diode lower surface, when a surface formed by the light emitting diode chip, when viewed from above the light emission structure, is defined as the diode upper surface and a surface formed by the light emitting diode chip, when viewed from below the substrate is defined as the diode lower surface. The phosphor layer is formed in a manner such that the phosphor layer does not deviate from the diode upper surface or the diode lower surface and has a flat surface parallel to the diode upper surface or the diode lower surface and a curved surface connecting the flat surface to corners of the diode upper surface or the diode lower surface. | 06-09-2011 |
20110254039 | LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package, a lighting apparatus including the same, and a method for manufacturing an LED package are disclosed. The LED package includes: a package substrate; an LED chip mounted on the package substrate; and a wavelength conversion layer formed to cover at least a portion of an upper surface of the LED chip when a surface formed by the LED chip when viewed from above is defined as the upper surface of the LED chip, wherein the wavelength conversion layer is formed so as not to exceed the area of the upper surface of the LED chip and includes a flat surface parallel to the upper surface of the LED chip and curved surfaces connecting the corners of the upper surface of the LED chip. | 10-20-2011 |
20110291143 | LIGHT-EMITTING-DEVICE PACKAGE AND A METHOD FOR PRODUCING THE SAME - A light emitting device package includes: a substrate with a mounting surface; a light emitting device bonded to the mounting surface of the substrate; a light reflecting resin part containing a high reflective material, filled on the substrate around the light emitting device so as to extend in a space between the light emitting device and the substrate; and a packing resin part hermetically sealed to cover the light emitting device and the light reflection resin part. | 12-01-2011 |
20130175554 | LED PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING LED PACKAGE - There is provided a light emitting diode (LED) package substrate including: a substrate including a chip mounting region on which a plurality of LED chips is mountable; a conductive layer including a plurality of electrode patterns disposed on the chip mounting region; and a groove part, forming a dam, wherein the groove part surrounds the chip mounting region and is spaced apart from the chip mounting region by a predetermined interval. | 07-11-2013 |
20150189164 | ELECTRONIC APPARATUS HAVING A PHOTOGRAPHING FUNCTION AND METHOD OF CONTROLLING THE SAME - In an electronic apparatus having a photographing function and a method of controlling the same, a qualitative description and a quantitative setting link with each other flexibly so as to provide a mixed linkage guide so that the qualitative description and the quantitative setting may be reused, and a qualitative description and a quantitative setting which will be added later may link with each other freely. | 07-02-2015 |