Patent application number | Description | Published |
20100144202 | CABLE ASSEMBLY HAVING ENHANCED INTERCONNECTION DEVICE THEREOF - A cable assembly ( | 06-10-2010 |
20110097039 | Optoelectronic interconnection system - Disclosed herewith a interconnection system includes an optoelectronic receptacle connector including insulative housing defines a cylindrical receiving chamber having a front and a rear end. An aligning pin extends from the rear end into the chamber and with an optical receiver disposed in the chamber. An optoelectronic plug connector includes a jack member defining a passage to receive the aligning pin when the plug connector is inserted into the receptacle connector. An organizer is enveloped on the jack member and defines at least a pair of orifices aligned with the optical receiver. And an optoelectronic cable includes at least a pair of fiber optics disposed within the orifices of the organizer and at least a conductive wires terminated to the jack member. | 04-28-2011 |
20110230088 | CABLE ASSEMBLY WITH IMPROVED WIRE HOLDING DEVICE - A cable assembly includes a housing including a main body and a piece of mushy insulation block on the housing, a plurality of contacts receiving in the main body of the housing, and a plurality of cable. Each of the cable includes at least an inner conductor and an outer insulation layer. The inner conductors are soldered to the contacts and the outer insulation layer each has a part fixed in the mushy insulation block of the housing. | 09-22-2011 |
20110255832 | Integrated and sealed opto-electronic device assembly - An opto-electronic device assembly adapted for mounted on a mother board includes a case and opto-electronic devices. The case has multiple cavities opening forwards and downwards. Each opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface and an electrical transmission interface with electrical pads. The electrical socket has a plurality of terminals with one ends contacting with PCB and another opposite ends contacting with the electrical pads. Each electrical transmission interface is removeably assembled in the electrical sockets to complete electrical connection between the substrate and the mother board. The opto-electrical devices are received in the cavities in a condition that the optical transmission interfaces exposes to a front open of the case. | 10-20-2011 |
20120184134 | CABLE ASSEMBLY WITH IMPROVED GROUNDING BAR - A cable assembly ( | 07-19-2012 |
20130016981 | PHOTOELECTRCI COVERSION SYSTEM WITH OPTICAL TRANSCEIVE MODULEAANM LIN; ERIC (Yuan Chieh)AACI Lake ForestAAST CAAACO USAAGP LIN; ERIC (Yuan Chieh) Lake Forest CA USAANM ZHAO; JIMAACI IrvineAAST CAAACO USAAGP ZHAO; JIM Irvine CA USAANM LIU; JIA-HAUAACI New TaipeiAACO TWAAGP LIU; JIA-HAU New Taipei TW - An optical coupling device includes a substrate loaded with a first optical module and IC drivers, and a second optical module intending to couple with the first optical module. The substrate defines an electrical connection port at one end thereof, the first optical module is located at another end of the substrate. The second optical module includes a first insulating holder and fiber cores embedded in the insulating holder. The first optical module includes a second insulating holders and VCSELS and PDS embedded with the second insulating holder, the fiber cores are directly coupled with VCSELS and PDS to transmit light lines therein. | 01-17-2013 |
20130266274 | OPTO-ELECTRONIC DEVICE ASSEMBLY - An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly. | 10-10-2013 |
20140056557 | OPTICAL MODULE FOR TRANSMITTING OPTICAL SIGNAL - An optical module comprises: a housing; a first incident surface mounted on the housing for receiving an optical signal converted from an electrical signal; a first output surface mounted on the housing for exporting the optical signal from the first incident surface; a second incident surface mounted on the housing for receiving another optical signal to be converted to another electrical signal; and a second output surface mounted on the housing for exporting the another optical signal from the second incident surface. An aperture of the first incident surface is smaller than an aperture of the second incident surface. | 02-27-2014 |
20140133809 | INTEGRATED AND SEALED OPTO-ELECTRONIC DEVICE ASSEMBLY - An opto-electronic device includes an optical engine module and an electrical socket. The optical engine module includes an optical engine, an optical transmission interface for coupling with an optical device and an electrical transmission interface, the electrical transmission interface having electrical pads. The electrical socket includes a plurality of BGA terminals, each terminal having a module-connecting end and a board-connecting end. The electrical transmission interface is removeably assembled in the electrical socket and the electrical pads contact the module-connecting ends of the electrical socket. | 05-15-2014 |
20140321819 | OPTICAL ASSEMBLY - An optical assembly ( | 10-30-2014 |
20140341513 | OPTO-ELECTRONIC DEVICE ASSEMBLY - An AOC assembly comprising two printed circuit boards (PCB) ( | 11-20-2014 |
20140357103 | CONNECTOR WITH DIFFERENTLY ARRANGED CONTACT MOUNTING PORTIONS AND CONNECTOR ASSEMBLY HAVE TWO SUCH CONNECTORS BELLY-TO-BELLY MOUNTED TO A CIRCUIT BOARD - A high speed card edge connector ( | 12-04-2014 |