Patent application number | Description | Published |
20080286689 | Antireflective Coating Compositions - The present invention relates to antireflective coating compositions. | 11-20-2008 |
20090042133 | Antireflective Coating Composition - An antireflective coating composition which forms films with high n values is described. | 02-12-2009 |
20090130591 | Antireflective Coating Composition and Process Thereof - The present invention relates to an antireflective composition comprising a polymer, a thermal acid generator and optionally a crosslinking agent, where the polymer comprises at least one hydrophobic unit (1), at least one chromophore unit (2), at least one unit with a crosslinking site (3) and optionally a unit capable of crosslinking the polymer, | 05-21-2009 |
20100009297 | Antireflective Coating Compositions - Antireflective coatings and related polymers are disclosed. | 01-14-2010 |
20100015550 | DUAL DAMASCENE VIA FILLING COMPOSITION - Compositions for use in dual damascene process are disclosed. | 01-21-2010 |
20100092894 | Bottom Antireflective Coating Compositions - Antireflective coating compositions are discussed. | 04-15-2010 |
20110250544 | BOTTOM ANTIREFLECTIVE COATING COMPOSITIONS - Antireflective coating compositions are discussed. | 10-13-2011 |
20120028195 | Composition for Coating over a Photoresist Pattern - The present invention relates to an aqueous composition for coating over a photoresist pattern comprising a first water soluble compound comprising at least a silicon moiety and at least one amino group, and a second compound comprising at least 1 carboxylic acid group. The invention further relates to processes for using the novel invention. | 02-02-2012 |
20130078576 | COMPOSITIONS OF NEUTRAL LAYER FOR DIRECTED SELF ASSEMBLY BLOCK COPOLYMERS AND PROCESSES THEREOF - The present invention relates to novel neutral layer compositions and methods for using the compositions. The neutral layer composition comprises at least one random copolymer having at least one unit of structure (1), at least one unit of structure (2) and at least one unit of structure (3) | 03-28-2013 |
20130233827 | METHODS AND MATERIALS FOR REMOVING METALS IN BLOCK COPOLYMERS - The present invention relates to a method for treating a block copolymer solution, wherein the method comprises: providing a solution comprising a block copolymer in a non aqueous solvent; and, treating the solution to remove metals using an ion exchange resin. The invention also relates to a method of forming patterns using the treated block copolymer. | 09-12-2013 |
20130330668 | NEUTRAL LAYER POLYMER COMPOSITION FOR DIRECTED SELF ASSEMBLY AND PROCESSES THEREOF - The present invention relates to a novel polymeric composition comprising a novel polymer having two or more repeat units and a terminus having the structure (1): | 12-12-2013 |
20140151330 | METHODS AND MATERIALS FOR REMOVING METALS IN BLOCK COPOLYMERS - The present invention relates to a method for treating a block copolymer solution, wherein the method comprises: providing a solution comprising a block copolymer in a non aqueous solvent; and, treating the solution to remove metals using an ion exchange resin. The invention also relates to a method of forming patterns using the treated block copolymer. | 06-05-2014 |
20140193754 | COMPOSITIONS OF NEUTRAL LAYER FOR DIRECTED SELF ASSEMBLY BLOCK COPOLYMERS AND PROCESSES THEREOF - The present invention relates to novel neutral layer compositions and methods for using the neutral layer compositions for aligning microdomains of directed self-assembling block copolymers (BCP). The compositions and processes are useful for fabrication of electronic devices. The neutral layer composition comprises at least one random copolymer having at least one unit of structure (1), at least one unit of structure (2) and at least one unit of structure (3) | 07-10-2014 |
20140342290 | COMPOSITION COMPRISING A POLYMERIC THERMAL ACID GENERATOR AND PROCESSES THEREOF - The present invention relates a novel aqueous composition comprising polymeric thermal acid generator and a process of coating the novel composition onto photoresist pattern, thereby forming a layer of the polymeric thermal acid generator over the photoresist pattern. The polymeric thermal acid generator comprises a polymer having at least one repeating unit of structure 2; | 11-20-2014 |
20150093912 | UNDERLAYER COMPOSITION FOR PROMOTING SELF ASSEMBLY AND METHOD OF MAKING AND USING - Disclosed herein is a formulation for depositing a cured underlayer for promoting the formation of self assembled structures. The underlayer comprises: (a) a polymer comprising at least one pendant vinyl ether monomer repeat unit having the structure, (I): | 04-02-2015 |
Patent application number | Description | Published |
20110205709 | SANDWICH STRUCTURE WITH DOUBLE-SIDED COOLING AND EMI SHIELDING - A sandwich structure and method thereof is disclosed for double-sided cooling, EMI noise shielding and current carrying in mini-modules. The proposed structure comprises a top structure and a bottom structure to achieve double-sided cooling. Meanwhile, the top structure is configured to shield EMI noises as well. The proposed structure further comprises a first set of connecting structures for connecting devices of the mini-modules with the top structure and a second set of connecting structure for connecting the top structure with the bottom structure. The connecting structures are capable of carrying current. | 08-25-2011 |
20110228507 | MOLDED POWER-SUPPLY MODULE WITH BRIDGE INDUCTOR OVER OTHER COMPONENTS - An embodiment of a power-supply module includes a molded package, power-supply components disposed within the package, and an inductor disposed within the package and over the power-supply components. For example, for a given output-power rating, such a power-supply module may be smaller, more efficient, and more reliable than, and may run cooler than, a power-supply module having the inductor mounted outside of the package or side-by-side with other components. And for a given size, such a module may have a higher output-power rating than a module having the inductor mounted outside of the package or side-by-side with other components. | 09-22-2011 |
20120063038 | POWER-SUPPLY MODULE WITH ELECTROMAGNETIC-INTERFERENCE (EMI) SHIELDING, COOLING, OR BOTH SHIELDING AND COOLING, ALONG TWO OR MORE SIDES - An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components. | 03-15-2012 |
20130106500 | INDUCTOR STRUCTURE INCLUDING INDUCTORS WITH NEGLIGIBLE MAGNETIC COUPLING THEREBETWEEN | 05-02-2013 |
20130313694 | PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE - Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate. | 11-28-2013 |
20130314879 | CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY (HDA) POWER MODULE, AND METHOD OF MAKING SAME - A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components. | 11-28-2013 |
Patent application number | Description | Published |
20120078966 | File System With Content Identifiers - A method for operating a file system includes receiving a write instruction including a file descriptor associated with a file and a content identifier, a content offset, and a content length, associating a region within the file with the content identifier, saving the association of the region and the content identifier. | 03-29-2012 |
20120185499 | Scalable Package Management For Virtual-Machine Images - A method for managing a virtual machine image includes receiving a request to change a package configuration of a machine, processing an image action received in the request, wherein the processing the image action received includes, opening the image action with associated action inputs, comparing the opened image action inputs with inputs associated with action instances in a database, determining whether the compared opened image action inputs match the inputs associated with action instances, retrieving from the database, image difference data associated with the image action responsive to determining that the compared opened image action inputs match the inputs associated with action instances in the database, and applying the image difference data to an image to transform the image, determining whether each image action in the request has been processed and processing a second image action responsive to determining that each image action has not been processed. | 07-19-2012 |
20130297868 | METHOD AND SYSTEM FOR MANAGING POWER GRID DATA - A system and method of managing time-series data for smart grids is disclosed. Data is collected from a plurality of sensors. An index is modified for a newly created block. A one disk operation per read or write is performed. The one disk operation per read includes accessing and looking up the index to locate the data without movement of an arm of the disk, and obtaining the data. The one disk operation per write includes searching the disk for free space, calculating an offset, modifying the index, and writing the data contiguously into a block of the disk the index points to. | 11-07-2013 |
Patent application number | Description | Published |
20150115910 | POWER SUPPLY WITH ENHANCED PHASE CURRENT SHARING - A system, power supplies, controller and method for enhanced phase current sharing are disclosed. For example, a power supply for enhanced phase current sharing is disclosed, which includes a plurality of power modules, a communication bus coupled to an input of each power module of the plurality power modules, and an output voltage node coupled to a first side of an inductor of each power module of the plurality of power modules, wherein each power module of the plurality of power modules includes a digital controller coupled to the input of the power module, and an RC circuit enabled to generate a feedback signal, coupled to a second side of the inductor and the output voltage node. In some implementations, the power supply is at least part of a power management integrated circuit (PMIC) or at least part of a power supply formed on a semiconductor IC, wafer, chip or die. | 04-30-2015 |
20150194370 | PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE - Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate. | 07-09-2015 |