Patent application number | Description | Published |
20100099043 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) a first polybenzoxazole precursor that includes: a repeating unit of Chemical Formula 1 and a thermally polymerizable functional group at least one terminal end; (B) a second polybenzoxazole precursor that includes a repeating unit of Chemical Formula 3; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent. | 04-22-2010 |
20110003248 | Positive photosensitive resin composition - A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage. | 01-06-2011 |
20110111346 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes: (A) a polybenzoxazole precursor including a repeating unit represented by the Chemical Formula 1, a repeating unit represented by the Chemical Formula 2, or a combination thereof, and a thermally polymerizable functional group at least one terminal end of the polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound including a cross-linking functional group; and (E) a solvent. | 05-12-2011 |
20110159428 | Positive Type Photosensitive Resin Composition - This disclosure relates to a positive photosensitive resin composition including (A) a resin precursor including a polybenzoxazole precursor, a polyamic acid, or a combination thereof, (B) a dissolution-controlling agent having a boiling point ranging from about 210° C. to about 400° C. and a polarity ranging from about 1D to about 4D, (C) an acid generator, (D) a silane-based compound, and (E) a solvent. The polybenzoxazole precursor includes a repeating unit represented by Chemical Formula 1, or both of repeating units represented by Chemical Formulae 1 and 2 and has a thermally polymerizable functional group at least one end. The polyamic acid includes a repeating unit of Chemical Formulae 50 and 51. | 06-30-2011 |
20110171578 | Positive Photosensitive Resin Composition - A positive photosensitive resin composition includes: (A) a polybenzoxazole precursor; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a polyamic acid ester compound; and (E) a solvent. The positive photosensitive resin composition can reduce film shrinkage, can have high sensitivity, high resolution, and excellent residue removal properties, and can provide good pattern shapes. | 07-14-2011 |
20120156614 | Novel Phenol Compounds and Positive Photosensitive Resin Composition Including the Same - Disclosed are a novel phenol compound comprising a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, or a combination thereof, and a positive photosensitive resin composition including the same. | 06-21-2012 |
20120156616 | Positive Photosensitive Resin Composition - Disclosed is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. | 06-21-2012 |
20120156622 | Ortho-Nitrobenzyl Ester Compound and Positive Type Photosensitive Resin Composition Including the Same - An ortho-nitrobenzyl ester compound including a compound represented by Chemical Formula 1, and a positive photosensitive resin composition including the same are provided. | 06-21-2012 |
20120171609 | Positive Photosensitive Resin Composition, Photosensitive Resin Layer Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Layer - Provided is a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by Chemical Formula 1 and a repeating unit represented by Chemical Formula 2, and having a thermally polymerizable functional group at least one terminal end; (B) a photosensitive diazoquinone compound; (C) a silane compound; (D) a phenol compound; and (E) a solvent. A photosensitive resin film fabricated using the positive photosensitive resin composition is provided. | 07-05-2012 |
20120171610 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a novolac resin including a repeating unit represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, a photosensitive resin film prepared by using the positive photosensitive resin composition, and a semiconductor device including the photosensitive resin film. | 07-05-2012 |
20120171614 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin; (B) a dissolution controlling agent including the compound represented by Chemical Formula 6; (C) a photosensitive diazoquinone compound; (D) a silane compound; and (E) a solvent, and a photosensitive resin film prepared by using the same. | 07-05-2012 |
20130137036 | Positive Photosensitive Resin Composition, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed are a positive photosensitive resin composition that includes (A) a polybenzoxazole precursor including a first polybenzoxazole precursor including a repeating unit represented by the following Chemical Formula 1 and a repeating unit represented by the following Chemical Formula 2, and having a thermally polymerizable functional group at at least one of the terminal end; (B) a dissolution controlling agent including a novolac resin including a repeating unit represented by the following Chemical Formula 4; (C) a photosensitive diazoquinone compound; (D) a silane compound; (E) an acid generator; and (F) a solvent, a photosensitive resin film prepared using the same, and a semiconductor device including the photosensitive resin film. | 05-30-2013 |
20130171563 | Photosensitive Novolac Resin, Positive Photosensitive Resin Composition Including Same, Photosensitive Resin Film Prepared by Using the Same, and Semiconductor Device Including the Photosensitive Resin Film - Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R | 07-04-2013 |
20140158952 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed are a photosensitive resin composition for a color filter that includes (A) a colorant including a cyanine dye represented by the following Chemical Formula 1, (B) an acrylic-based binder resin, (C) a photopolymerizable monomer, (D) a photopolymerization initiator, and (E) a solvent, and a color filter using the same. | 06-12-2014 |
20140175344 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - Disclosed are a photosensitive resin composition for a color filter including (A) a colorant including a compound represented by the following Chemical Formula 1 and/or a compound including repeating units represented by the following Chemical Formula 2 and the following Chemical Formula 3; (B) a binder resin; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, and a color filter using the same. | 06-26-2014 |
20140343187 | Photosensitive Resin Composition for Color Filter and Color Filter Using the Same - A photosensitive resin composition for a color filter includes (A) a yellow or orange dye; (B) a dye combination of a cyanine dye represented by the following Chemical Formula 1, wherein in Chemical Formula 1, each substituent is the same as described in the detailed description, and a metal complex dye; (C) an acrylic-based binder resin; (D) a photopolymerizable monomer; (E) a photopolymerization initiator; and (F) a solvent, and a color filter using the same. | 11-20-2014 |