| Patent application number | Description | Published |
|---|
| 20080292203 | IMAGE PROCESSING APPARATUS AND CONTROL METHOD THEREOF - An image processing apparatus which performs dithering to an input image, includes: an input value storage unit which stores an input value to generate a mask seed value corresponding to a single pixel in a unit area among a plurality of pixels displaying an image, wherein the unit area includes a first line and at least second line; and a seed value generator which generates the mask seed value corresponding to one of pixels in the at least one second line among the pixels of the unit area based on the input value stored in the input value storage unit. | 11-27-2008 |
| 20110007098 | LIQUID CRYSTAL DISPLAY APPARATUS, LIQUID CRYSTAL DRIVING APPARATUS, AND METHOD FOR DRIVING LIQUID CRYSTAL DISPLAY APPARATUS - A liquid crystal display (LCD) apparatus, an LCD driving apparatus, and a method for driving the LCD apparatus are provided. The LCD apparatus includes a panel; and a controlling unit which inserts gray data into at least one pixel included in a pixel group. Accordingly, the stress on a liquid crystal is reduced and thus a residual image is prevented from occurring on a screen. | 01-13-2011 |
| 20110050753 | LIQUID CRYSTAL DISPLAY APPARATUS AND DRIVING METHOD THEREOF - A liquid crystal display (LCD) apparatus and a method of driving the LCD apparatus are provided. The LCD apparatus includes a panel unit including at least one pixel having a plurality of sub-pixels and a controller which inserts gray data into at least one pixel of the plurality of sub-pixels based on a frame period and a polarity of a liquid crystal of the at least one pixel. | 03-03-2011 |
| 20110141365 | METHOD FOR DISPLAYING VIDEO SIGNAL DITHERED BY RELATED MASKS AND VIDEO DISPLAY APPARATUS APPLYING THE SAME - A method for displaying a video which is dithered using related masks and a video display apparatus applying the same, the video display apparatus dithering a video signal using a first mask, performing color-processing with respect to the video signal, and dithering the color-processed video signal using a second mask which is related to the first mask. Accordingly, dithering is performed using related masks, thus preventing poor gradation of video signal. | 06-16-2011 |
| Patent application number | Description | Published |
|---|
| 20080291655 | Wiring substrate, semiconductor device package including the wiring substrate and methods of fabricating the same - Provided is a wiring substrate, a semiconductor device package including the wiring substrate, and methods of fabricating the same. The semiconductor device package may include a wiring substrate which may include a base film. The base film may include a mounting region and a non-mounting region. The wiring substrate may further include first wiring patterns on the non-mounting region and extending into the mounting region, second wiring patterns on the first wiring patterns of the non-mounting region, and an insulating layer on the non-mounting region, and a semiconductor device which may include bonding pads. At least one of side surfaces of the second wiring patterns adjacent to the mounting region may be electrically connected to at least one of the bonding pads of the semiconductor device. | 11-27-2008 |
| 20090250702 | STATIC-TOLERANT DISPLAY APPARATUS - A display apparatus includes a thin film transistor having a top-gate structure and a storage capacitor that are arranged on a first substrate. An upper electrode of the storage capacitor has a size larger than a size of a lower electrode, so as to cover an entire surface of the lower electrode in a plan view. Thus, electric field caused by static electricity may be prevented from accumulating at a corner of the upper electrode when the electric filed flows from the lower electrode to the upper electrode, thereby preventing an intermediate insulating layer from being burnt. | 10-08-2009 |
| 20100314760 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor package includes a base substrate, a semiconductor chip mounted on the base substrate and including bonding pads, first and second connection terminals disposed adjacent to the semiconductor chip on the base substrate and electrically connected to the bonding pads, a first ball land disposed on the base substrate and electrically connected to the first connection terminal, a second ball land spaced apart from the connection terminals, the first ball land disposed between the second ball land and at least one of the first and second connection terminals, a first insulating layer covering the first ball land but exposing at least a part of the second ball land, and a first conductive wire extending onto the first insulating layer and connecting the second connection terminal to the second ball land. | 12-16-2010 |
