Patent application number | Description | Published |
20090088996 | Jitter measuring system and method - The present invention relates to a jitter measuring system, comprising: a delay circuit for receiving a clock signal and delaying the clock signal to generate a delay signal; a jitter amplifier for receiving the clock signal and delay signal to generate a first signal and a second signal; and a converter for converting a phase different between the first signal and the second signal into a relevant digital code; wherein the phase difference between the first signal and the second signal is an amplification of jitter. | 04-02-2009 |
20100088655 | YIELD EVALUATING APPARATUS AND METHOD THEREOF - A yield evaluating apparatus and a method thereof are provided. The yield evaluating apparatus includes a spatial correlation module. The spatial correlation module receives at least one process-related data and a plurality of circuit layouts and obtains a correlation coefficient between unit elements in the circuit layouts according to the process-related data. The spatial correlation module calculates a spatial correlation between elements in each of the circuit layouts according to the correlation coefficient and selects one of the circuit layouts according to the spatial correlations. | 04-08-2010 |
20120146693 | APPARATUS FOR CLOCK SKEW COMPENSATION - An apparatus for clock skew compensation is provided. The apparatus includes a first delay locked loop (DLL) module disposed in a first die and a second DLL module disposed in a second die. A first input terminal of the first DLL module receives a reference clock. A first input terminal of the second DLL module is electrically connected to an output terminal of the first DLL module. An output terminal of the second DLL module is electrically connected to a second input terminal of the first DLL module. | 06-14-2012 |
20130290914 | Methods and Apparatus for Floorplanning and Routing Co-Design - Methods and apparatus of performing floorplanning and routing for function blocks within a die and among multiple die are disclosed. Multiple die together with function blocks within each die may be represented by a flexible hierarchical (FH) tree. An initial floorplan for multiple die may be generated and hot spots between die or among function blocks within a die may be identified. Spacer blocks may be inserted between die, and block inflation may be performed, to remove hot spots. More perturbation of the block positions can be performed on the FH tree to rearrange the blocks and die. After the multiple die floorplanning, a plurality of micro bumps may be mapped to a plurality of pins of blocks of the plurality of die, placement and routing may be performed for the plurality of blocks within each die and connections for the plurality of dies. | 10-31-2013 |
20130326463 | Method to Determine Optimal Micro-Bump-Probe Pad Pairing for Efficient PGD Testing in Interposer Designs - The present disclosure relates to a method of routing probe pads to micro-bumps of an interposer. An interposer is provided having target micro-bumps and probe pads. The probe pads are initially unassigned. Target micro-bump locations and probe pad locations are obtained. Possible route assignments from the probe pads to the target micro-bumps are obtained. Costs are developed for the possible route assignments at least partially according to the target micro-bump locations and the probe pad locations. Final assignments are selected from the possible assignments according to the costs. | 12-05-2013 |
20140049281 | Diagnosis Framework to Shorten Yield Learning Cycles of Advanced Processes - The present disclosure relates to a diagnosis framework to shorten yield learning cycles of technology node manufacturing processes from the high defect density stage to technology maturity. A plurality of defect under test (DUT) structures are designed to capture potential manufacturing issues associated with defect formation. A test structure is formed by arranging the DUT structures within a DUT carrier unit, which has been yield-hardened though heuristic yield analysis such that a defect density of the DUT carrier unit is essentially zero. Possible outcomes of an application of test patterns and various failure scenarios associated with defects formed within the DUT structures within the DUT carrier unit are simulated and stored in a look-up table (LUT). The LUT may then be referenced to determine a location of a defect within the test structure without the need for iterative analysis to correctly select defect candidates for physical failure analysis (PFA). | 02-20-2014 |
20150115329 | Method and Apparatus for Repairing Monolithic Stacked Integrated Circuits - Provided is a monolithic stacked integrated circuit (IC). The IC includes a first layer over a substrate and a second layer over the first layer. The first layer includes a first plurality of circuit elements where a first portion of the first plurality of circuit elements has defects. The second layer includes a second plurality of circuit elements. The IC further includes interconnect elements coupling the first portion to a second portion of the second plurality of circuit elements for mitigating the defects. | 04-30-2015 |
20160055631 | DEFECT DIAGNOSIS - A method for diagnosing a defect is provided. A first candidate pair comprises a first defect candidate and a second defect candidate. A first pattern is generated to distinguish one or more faults of the first defect candidate from one or more faults of the second defect candidate. The first defect candidate is removed responsive to determining that the first pattern does not detect the first defect candidate and determining that an automatic test equipment (ATE) failure log associates the first pattern with failure. Removing the first candidate pair, as well as additional candidate pairs when possible, promotes diagnosis efficiency by reducing a number of computations required. | 02-25-2016 |