Patent application number | Description | Published |
20080305591 | METAL OXIDE ALLOY LAYER, METHOD OF FORMING THE METAL OXIDE ALLOY LAYER, AND METHODS OF MANUFACTURING A GATE STRUCTURE AND A CAPACITOR INCLUDING THE METAL OXIDE ALLOY LAYER - A metal oxide alloy layer comprises a first layer including a first metal oxide and having a first thickness, and a second layer formed on the first layer, the second layer including a second metal oxide and having a second thickness, wherein a value of the first thickness is such that the first metal oxide is allowed to move into the second layer and a value of the second thickness is such that the second metal oxide is allowed to move into the first layer to form a single-layered structure in which the first and second metal oxides are mixed. | 12-11-2008 |
20090097349 | Row active time control circuit and a semiconductor memory device having the same - A row active time control circuit is described that includes a master signal generating circuit and a row active control signal generating circuit. The master signal generating circuit generates one or more row active master signals based on an active command signal, a pre-charge command signal, and one or more row active control signals. The row active control signal generating circuit generates a pulse signal that oscillates based on the one or more row active master signals. The row active control signal also generates the one or more row active control signals by dividing a frequency of the generated pulse signal. | 04-16-2009 |
20100125048 | COSMETIC COMPOSITIONS FOR SKIN-TIGHTENING AND METHOD OF SKIN-TIGHTENING USING THE SAME - The present invention relates to a skin-tightening cosmetic composition and a method of applying the same, and more specifically, to a cosmetic composition a method of applying the same that includes a hydrolyzed plant protein and glycoprotein. The cosmetic composition includes a hydrolyzed plant protein and glycoprotein in an optimal amount, thereby causing the occurrence of an immediate contraction effect and a long-lasting contracting effect, and achieving skin improvements such as skin moisturizing and induction of synthesizing collagen and elastine in use of the composition over a long period of time. | 05-20-2010 |
20100244227 | Semiconductor packages and electronic systems including the same - Provided are semiconductor packages and electronic systems including the same. A first memory chip may be stacked on a first portion of a substrate. A controller chip may be stacked on a second portion of the substrate, which is different from the first portion. At least one first bonding wire may directly connect the first memory chip with the controller chip. At least one second bonding wire may directly connect the first memory chip with the substrate, and may be electrically connected with the at least one first bonding wire. | 09-30-2010 |
20100295835 | Voltage Boosting Circuit and Display Device Including the Same - Provided are a voltage boosting circuit and a display device including the same. The voltage boosting circuit includes a booster input voltage generator configured to receive a power supply voltage, operate with a first current drive capability, and generate a booster input voltage in a switched mode in which the voltage boosting circuit switches from a standby mode to an operation mode, and configured to receive the power supply voltage, operate with a second current drive capability higher than the first current drive capability, and generate the booster input voltage in the operation mode, and a booster configured to receive the booster input voltage and generate a boost voltage. | 11-25-2010 |
20100303368 | IMAGE DISPLAY METHOD, IMAGE MATCHING METHOD, AND DISPLAY APPARATUS USING THE SAME - An image display method, an image matching method, and a display apparatus using the same. An image display method includes determining a representative property of an image, and displaying the image together with representative property information. Accordingly, images are displayed in a row so that a user does not need to wait while an image is being decoded, and information regarding a property of the image to be displayed is previously provided the user, so the user can effectively watch the image. | 12-02-2010 |
20110157251 | INTERFACE CIRCUIT, AND SEMICONDUCTOR DEVICE AND LIQUID CRYSTAL DISPLAY DEVICE INCLUDING THE SAME - A method of reducing power consumption caused by leakage current in an interface circuit between modules that are driven by different power sources is disclosed. The interface circuit includes an output driver that operates by a first power supply voltage in a first mode and does not operate in a second mode in which the first power supply voltage is prevented from being applied, an input buffer that is operated by a second power supply voltage in the first and second modes, and a transmission line that connects an output terminal of the output driver to an input terminal of the input buffer. The interface circuit further includes a current leakage prevention circuit that prevents, in the second mode, a current leakage in the input buffer between a second power supply voltage source that supplies the second power supply voltage and a ground voltage source. | 06-30-2011 |
20110316119 | SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR - Provided is a semiconductor package including a de-coupling capacitor. The semiconductor package includes a substrate, on an upper surface of which a semiconductor chip is mounted; a plurality of first conductive bumps that are disposed on a lower surface of the substrate and that electrically connect the substrate to an external device; and a de-coupling capacitor that is disposed on the lower surface of the substrate and includes an electrode portion and at least one dielectric layer, wherein the electrode portion of the de-coupling capacitor includes second conductive bumps that electrically connect the substrate to an external device. | 12-29-2011 |
20120080222 | CIRCUIT BOARD INCLUDING EMBEDDED DECOUPLING CAPACITOR AND SEMICONDUCTOR PACKAGE THEREOF - A circuit board including an embedded decoupling capacitor and a semiconductor package thereof are provided. The circuit board may include a core layer including an embedded decoupling capacitor, a first build-up layer at one side of the core layer, and a second build-up layer at the other side of the core layer, wherein the embedded decoupling capacitor includes a first electrode and a second electrode, the first build-up layer includes a first via contacting the first electrode, and the second build-up layer includes a second via contacting the first electrode. | 04-05-2012 |
20130087929 | Semiconductor Packages And Electronic Systems Including The Same - Provided are semiconductor packages and electronic systems including the same. A first memory chip may be stacked on a first portion of a substrate. A controller chip may be stacked on a second portion of the substrate, which is different from the first portion. At least one first bonding wire may directly connect the first memory chip with the controller chip. At least one second bonding wire may directly connect the first memory chip with the substrate, and may be electrically connected with the at least one first bonding wire. | 04-11-2013 |