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| 20090111219 | WAFER-LEVEL CHIP SCALE PACKAGE AND METHOD FOR FABRICATING AND USING THE SAME - A packaged semiconductor device (a wafer-level chip scale package) containing a conductive adhesive material as an electrical interconnect route between the semiconductor die and a patterned conductive substrate is described. The patterned conductive substrate acts not only as a substrate, but also as a redistribution layer that converts the dense pad layout of the die to a larger array configuration of the solder balls in the circuit board. Using the invention allows the formation of a lower priced chip scale package that also overcomes the restriction of the die size used in die-sized chip packages and the input-output pattern that can be required by the printed circuit board. Thus, the invention can provide a familiar pitch (i.e., interface) to the printed circuit board for any small die. | 04-30-2009 |
| 20090146284 | Molded Leadless Packages and Assemblies Having Stacked Molded Leadless Packages - Molded leadless packages having improved stacked structures are disclosed. An exemplary molded leadless package includes a die attaching pad, a plurality of leads spaced apart from the die attaching pad at a periphery region of the die attaching pad, a semiconductor chip on the die attaching pad, a plurality of bonding wires electrically connecting the leads to the semiconductor chip, and a sealing member fixedly enclosing the semiconductor chip and the bonding wires while partly exposing an outer surface of each of the leads. The sealing member fills gaps between the die attaching pad and the leads and includes at least one protrusion protruding downward from the die attaching pad and the leads. | 06-11-2009 |
| 20100182839 | Method of Programming Nonvolatile Memory Device - According to a method of programming a nonvolatile memory device, a program operation is performed on a first page by applying a program pulse to the first page. A verification operation is performed on the program operation by applying a verification voltage to the first page. If the program operation for the first page has not been completed, a voltage selected from threshold voltages of the first page is set as a highest threshold voltage. The program operation for the first page is completed by repeatedly performing a program operation and a verification operation on the first page while a voltage level of the program pulse is increased. The sum of a program start voltage for the first page and a difference between the verification voltage and the highest threshold voltage is set as a program start voltage for a second page. | 07-22-2010 |
| 20120008416 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device includes a memory cell array comprising a plurality of cell strings and a page buffer group comprising a plurality of page buffers coupled to the respective cell string through bit lines. Each of the page buffers includes a latch unit for storing data to be programmed into memory cells included in the cell string or for storing data read from the memory cells. Each of the page buffers is coupled to a pad for the test operation of the memory cells according to data stored in the latch unit in the test operation. | 01-12-2012 |
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| 20090126174 | METHOD OF MANUFACTURING MULTI-LAYER CERAMIC CONDENSER - There is provided a method of manufacturing a multi-layer ceramic condenser. A method of manufacturing a multi-layer ceramic condenser may include: laminating a plurality of dielectric green sheets having internal electrodes formed thereon to form a laminate; forming through holes in a region of the laminate where an external electrode is to be formed; filling the through holes with conductive paste to form the external electrode; cutting the laminate having the external electrode formed thereon; and firing the cut laminate to form at least one multi-layer ceramic condenser. | 05-21-2009 |
| 20110156740 | PROBE CARD - There is provided a probe card. A probe card according to an aspect of the invention may include: a printed circuit board; a horizontal regulator passing through the printed circuit board and having an insertion portion having a horizontal regulation bolt and an insertion portion having a curved portion provided on an end portion of the horizontal regulation bolt; a probe substrate electrically connected to the printed circuit board; and a connection member mounted on the probe circuit, engaged with the horizontal regulation portion, and having an insertion recess therein so that the insertion portion is rotated within the insertion recess. | 06-30-2011 |
| 20120100036 | METHOD OF MANUFACTURING ULTRA FINE METAL POWDER AND ULTRA FINE METAL POWDER MANUFACTURED BY THE SAME - Disclosed are a method of manufacturing ultra fine metal powder used for an electrode for an MLCC and ultra fine metal powder manufactured by the same. The method of manufacturing ultra fine metal powder includes: preparing a master mold in which a pattern is formed; forming a sacrificial layer by applying a polymer material on the pattern; forming a metal layer on the sacrificial layer; and forming individual ultra fine metal powder by removing the sacrificial layer and separating the metal layer from the master mold. | 04-26-2012 |
| 20120126460 | APPARATUS AND METHOD FOR MANUFACTURING BOARD FOR PRODUCTION OF METAL FLAKE - There are provided an apparatus and method for manufacturing a board for the production of a metal flake. The apparatus includes: a base board supplying part; a patterning part forming a pattern layer on a base board supplied from the base board supplying part; a coating part forming a sacrificial layer on the base board having the pattern layer formed thereon, the sacrificial layer being decomposable by a solvent; and a base board recovering part recovering the base board having the sacrificial layer formed thereon. | 05-24-2012 |
| 20120135262 | METHOD OF MANUFACTURING FINE METAL POWDER AND FINE METAL POWDER MANUFACTURED BY USING THE SAME - There are disclosed a method of manufacturing fine metal powder and fine metal powder manufactured by using the same. The method of manufacturing fine metal powder includes forming a pattern having a predetermined size and shape on a base substrate, forming a metal film on the pattern, and separating the metal film from the pattern to obtain individual metal particles having a predetermined size and shape. The fine metal powder manufactured by the method has a uniform shape and a uniform particle size distribution. The fine metal powder is in the form of flakes, having a large ratio of particle diameter to thickness. | 05-31-2012 |
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| 20080232120 | BACKLIGHT ASSEMBLY, DISPLAY MODULE HAVING THE BACKLIGHT ASSEMBLY AND METHOD OF MANUFACTURING THE BACKLIGHT ASSEMBLY - A backlight assembly includes a light source providing light, a mold frame receiving the light source unit and a bottom chassis. The bottom chassis includes a bottom plate, sidewalls extending from the bottom plate and an extension part bent from at least one of the sidewalls and overlapping an adjacent sidewall. The mold frame and the bottom chassis are integrally formed. The extension part overlaps the adjacent sidewall at a corner of the bottom chassis. Thus, the torsional strength of the bottom chassis and a backlight assembly having the bottom chassis is improved. The torsional strength is maintained when a backlight assembly is manufactured. | 09-25-2008 |
| 20080239193 | LIQUID CRYSTAL DISPLAY MODULE - A liquid crystal display (“LCD”) module includes an LCD panel, a light source unit, a mold frame, a bottom chassis and a driving circuit substrate. The light source unit supplies light to the LCD panel. The mold frame includes a bottom part and sidewall part, and receives the LCD panel and the light source unit. The bottom chassis covers the mold frame and includes a first opening. The driving circuit substrate is disposed between the mold frame and the bottom chassis, and includes a circuit component. The circuit component is formed corresponding to the first opening. | 10-02-2008 |
| 20080284939 | BACKLIGHT ASSEMBLY AND DISPLAY APPARATUS HAVING THE SAME - A backlight assembly includes a light source, a light-guide plate, a mold frame and a bottom chassis. The mold frame includes a first bottom portion, a protrusion on a first surface of the first bottom portion and a first sidewall portion on a second surface of the first bottom portion opposite to the first surface of the first bottom portion and facing the light guide plate. The bottom chassis includes a second bottom portion having a hole to receive the protrusion of the first bottom portion, and a second sidewall portion facing the light guide plate. A cross sectional area of a first opening of the hole corresponding to an inner surface of the bottom chassis and contacting the first surface of mold frame is different than a cross sectional area of a second opening of the hole corresponding to an outer surface of the bottom chassis. | 11-20-2008 |
| 20090103326 | DISPLAY DEVICE HAVING LIGHT GUIDE UNIT - A light guide unit for a point light source includes a light incident portion, a first reflecting portion and a second reflecting portion. The light emitted from the point light source enters to the light incident portion. The light incident portion includes an optical pattern diffusing an incident light corresponding to the point light source. The first reflecting portion reflects a first light of the incident light. The second reflecting portion roundly connects the first reflecting portion to the light incident portion and reflects a second light of the incident light. | 04-23-2009 |
| 20100172155 | LIGHT GUIDE UNIT FOR POINT LIGHT SOURCE, BACKLIGHT ASSEMBLY HAVING THE LIGHT GUIDE UNIT AND DISPLAY DEVICE HAVING THE SAME - A light guide unit for a point light source includes a light incident portion, a first reflecting portion and a second reflecting portion. The light emitted from the point light source enters to the light incident portion. The light incident portion includes an optical pattern diffusing an incident light corresponding to the point light source. The first reflecting portion reflects a first light of the incident light. The second reflecting portion roundly connects the first reflecting portion to the light incident portion and reflects a second light of the incident light. | 07-08-2010 |
| 20100202077 | FLAT PANEL DISPLAY DEVICE AND METHOD FOR PRODUCING THE SAME - A flat panel display device includes a display module, a protection window member and a layer disposed in an area between the protection window member and a display area of the display module. The protection window member includes a stepped portion within which the layer is disposed. The stepped portion may include a recess or a plurality of layers. | 08-12-2010 |
