Patent application number | Description | Published |
20110272798 | CHIP UNIT AND STACK PACKAGE HAVING THE SAME - A chip unit includes: a first semiconductor chip and a second semiconductor chip disposed such that their surfaces for forming first bonding pads and second bonding pads face each other; first and second connection members disposed on the surfaces of the first and second semiconductor chips for forming the first and second bonding pads, and having redistribution lines which have one ends connected with the first and second bonding pads and the other ends projecting beyond one edges of the first and second semiconductor chips and films; an adhesive member interposed between the first connection members and the second connection members; and via patterns passing through the adhesive member and connecting projecting portions of the redistribution lines of the first and second connection members with each other. | 11-10-2011 |
20110272820 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads. | 11-10-2011 |
20120018879 | STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stack package includes a cover film, a first package having a first semiconductor chip which is attached to the cover film, a first adhesive member which is formed to seal the first semiconductor chip and a surface of the cover film, and a first circuit pattern which is disposed over the first adhesive member and electrically connected with the first semiconductor chip; a second package disposed over the first package, having a second semiconductor chip which is electrically connected with the first circuit pattern, a second adhesive member which is formed to seal the second semiconductor chip, and a second circuit pattern which is formed over the second adhesive member, and a via formed to pass through the second circuit pattern and the second adhesive member and to be electrically connected with the first circuit pattern and the second circuit pattern. | 01-26-2012 |
20130256887 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes a semiconductor package module including a plurality of semiconductor packages each of which has a first surface, a second surface facing away from the first surface, side surfaces connecting the first surface and the second surface and through-holes formed on the side surfaces to pass through the first surface and the second surface and which are stacked such that their through-holes vertically connect with one another, and adhesive members which are formed between the semiconductor packages and attach the semiconductor packages to one another, a main substrate supporting the semiconductor package module and formed, on a third surface thereof facing the semiconductor package module, with main connection pads which are aligned with the through-holes, and conductive connection members formed in the through-holes and electrically connecting the semiconductor packages with the main connection pads. | 10-03-2013 |
20140057369 | METHODS FOR FORMING INTERCONNECTION LINE USING SCREEN PRINTING TECHNIQUE - Methods of forming an interconnection line pattern using a screen printing technique. The method includes preparing a substrate having unevenness, aligning a stencil mask on the substrate, and printing a paste including materials for forming the interconnection line pattern on a convex portion of the unevenness formed on the substrate. | 02-27-2014 |
20150061884 | DISPLAY DEVICE AND METHOD FOR CONTROLLING THE SAME - A display device is provided, which includes a display configured to display a user interface (UI) screen, a status display which includes a plurality of light emitting elements arranged on an outline region of the display, and a controller configured to control a light emitting status of the plurality of light emitting elements so as to provide a light interaction in which the plurality of light emitting elements operate in a preset display pattern based on an interaction occurring on the UI screen. | 03-05-2015 |
20150232894 | LACTATE DEHYDROGENASE MUTANT, POLYNUCLEOTIDE CODING FOR THE MUTANT, YEAST CELL INCLUDING THE POLYNUCLEOTIDE, METHOD OF PREPARING THE MUTANT, AND METHOD OF PRODUCING THE LACTATE USING THE SAME - A lactate dehydrogenase mutant, a polynucleotide encoding the mutant, a recombinant yeast cell including the polynucleotide, and a method of preparing the mutant and a method of producing lactate by using the same. | 08-20-2015 |
20150235670 | METHOD FOR CREATING A CONTENT AND ELECTRONIC DEVICE THEREOF - A method for creating a content in an electronic device is provided. The method includes acquiring first media data acquired by at least one external electronic device, acquiring second media data on a basis of at least a part of the first media data, recognizing a feature of the second media data acquired by the at least one external electronic device, and creating the content on a basis of at least a part of the feature of the second media data. | 08-20-2015 |