| Patent application number | Description | Published |
| 20100125103 | COMPOSITION FOR THE TREATMENT OF DIABETES AND METABOLIC SYNDROME CONTAINING OBOVATOL AND ITS SYNTHESIZED DERIVATIVES - Disclosed is a pharmaceutical composition containing obovatol represented by Formula 1 and its derivatives. The obovatol and its derivatives effectively increase the activity of AMPK (AMP-activated protein kinase) that plays an important role in diabetes and metabolic syndrome, and thus may be variously used in treating diabetes and metabolic syndrome. | 05-20-2010 |
| 20110015142 | METHOD FOR PREPARING GYNOSTEMMA PENTAPHYLLUM EXTRACT WITH INCREASING DAMULIN A AND DAMULIN B CONTENTS, AND PHARMACEUTICAL COMPOSITIONS OF THE SAME FOR TREATING METABOLIC DISEASE - Disclosed is an AMPK activating material used for improving and treating metabolic syndrome, in which AMPK (AMP-activated protein kinase) is a main enzyme for regulating an energy sensor and lipid/glucose metabolism in the body. The activation of AMPK inhibits the synthesis of fat and cholesterol, and accelerates the reduction of body fat and blood glucose, thereby improving obesity, diabetes, and hyperlipidaemia. The disclosed AMPK activating material contains, as active ingredients having an improving and treating effect on metabolic syndrome, including obesity, diabetes, and hyperlipidaemia, a novel compound 2α,3β,12β-trihydroxydammar-20(22)-E,24-diene-3-O-[β-D-glucopyranosyl-(1→)-β-D-glucopyranoside], named Damulin A, and a novel compound 2α,3β,12β-trihydroxydammara-20,24-diene-3-O-[β-D-glucopyranosyl-(1→)-β-D-glucopyranoside], named Damulin B. Herein, the contents of damulin A and damulin B (as active indicator ingredients for AMPK activation) can be increased by treating a | 01-20-2011 |
| Patent application number | Description | Published |
| 20080298690 | Digital Photo Content Processing System and Method and Apparatus for Transmitting/Receiving Digital Photo Contents Thereof - A system for processing digital photo contents in a digital camera is disclosed. The system includes a content transmitting unit, and a content receiving unit. The content transmitting unit creates an image by photographing objects in a photographing area, requests supplementary information to at least one of persons in the photographing area, receives personal IDs from at least one of target persons, composes digital photo contents using the created image and the personal ID and stores the composed digital photo contents, and transmits after classifying the stored digital photo content by the received personal ID. The content receiving unit transmits an own personal ID when a request for supplementary information to identify a target person from a content transmitting unit of a photographer, receives digital photo contents composed using an image captured from the content transmitting unit and the personal ID, and displays the received digital photo contents. | 12-04-2008 |
| 20090241171 | WEARABLE COMPUTER SYSTEM AND METHOD CONTROLLING INFORMATION/SERVICE IN WEARABLE COMPUTER SYSTEM - A wearable system and a method for transferring and controlling information/service based on biologically generated information from a user are provided. In the method, an intuitive bio signal generated by a user is sensed and a device pointed by the sensed bio signal is selected. Then, bio signal information is created using the sensed bio signal and the generated bio signal information is transmitted to the selected device. After transmitting, the information/service is transferred to the selected device after confirming that the selected device that receives the bio signal information is activated. | 09-24-2009 |
| 20100151393 | METHOD OF MANUFACTURING NANO-STRUCTURE AND METHOD OF MANUFACTURING A PATTERN USING THE METHOD - According to an example embodiment of the present invention, a photoresist pattern is formed on a base substrate including a neutral layer. A sacrifice structure including a first sacrifice block and a second sacrifice block is formed on the base substrate having the photoresist pattern, and the sacrifice structure is formed from a first thin film including a first block copolymer. Thus, a chemical pattern is formed to form a nano-structure. Therefore, the nano-structure may be easily formed on a substrate having a large size by using a block copolymer, and productivity and manufacturing reliability may be improved. | 06-17-2010 |
| 20100245118 | MULTIMODAL FUSION APPARATUS CAPABLE OF REMOTELY CONTROLLING ELECTRONIC DEVICES AND METHOD THEREOF - There are provided a multimodal fusion apparatus capable of remotely controlling a number of electronic devices and a method for remotely controlling a number of electronic devices in the multimodal fusion apparatus. In accordance with the present invention, instead of one input device, such as a remote control or the like, multimodal commands, such as user-familiar voice, gesture and the like, are used to remotely control a number of electronic devices equipped at home or within a specific space. That is, diverse electronic devices are controlled in the same manner by the multimodal commands. When a new electronic device is added, control commands thereof are automatically configured to control the new electronic device. | 09-30-2010 |
| 20110226515 | TEXTILE-TYPE ELECTRONIC COMPONENT PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MOUNTING THE SAME ON TEXTILE - A textile-type electronic component package includes a textile base; a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base; a thermoplastic adhesive formed on the bottom surface of the textile base; a plurality of mounting pads formed on the thermoplastic adhesive and facing the conductive patterns, respectively; and a plurality of via-hole-type coupling parts penetrating end contact points of the conductive patterns, the textile base, and the thermoplastic adhesive, and electrically coupling the mounting pads and the conductive patterns, wherein the via-hole-type coupling parts includes a bunch of via-holes filled with a conductive polymer. | 09-22-2011 |
| 20110233452 | GRAPHENE COMPOSITION HAVING LIQUID CRYSTALLINE PROPERTIES AND PREPARATION METHOD THEREOF - The present invention relates to a graphene composition having liquid crystalline properties and a preparation method thereof, and more particularly to a graphene composition wherein graphene having useful electrical properties is uniformly dispersed in a medium, whereby it is chemically and physically stable, exhibits a liquid crystal phase in a wide temperature range and has good compatibility with other compounds, and to a preparation method thereof. In the graphene composition, liquid crystalline properties are imparted to graphene, which can be produced in large amounts and has excellent mechanical, chemical and electrical properties, and thus the graphene composition can provide a chance to apply functional carbon materials in various fields, including nanocomposites, energy storage materials, and photonics. | 09-29-2011 |
| Patent application number | Description | Published |
| 20090053857 | SEMICONDUCTOR PACKAGING METHOD - The present invention relates to a semiconductor packaging method. The method comprises (S | 02-26-2009 |
| 20090140426 | FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A flip chip package includes a substrate and a semiconductor chip. The substrate includes a substrate body, a metal wiring having a terminal part some of which is disposed in the substrate body, a solder resist pattern formed on the substrate body with an opening for exposing the terminal part, and an organic anti-oxidation layer for covering the terminal part. The semiconductor chip has a bump formed through (e.g., penetrates) the organic anti-oxidation layer and is electrically connected to the terminal part. The present invention prevents oxidation of the terminal part and allows easy coupling of a bump of a semiconductor chip and the terminal part of the substrate, since an anti-oxidation layer including an organic matter is formed over a surface of a terminal part including copper which is easily oxidized. | 06-04-2009 |
| 20100092718 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive member is disposed at the first region. The second adhesive member is disposed at the third region. | 04-15-2010 |
| 20110189928 | WAFER MOUNT TAPE, WAFER PROCESSING APPARATUS AND METHOD OF USING THE SAME FOR USE IN THINNING WAFERS - A wafer mount tape, a wafer processing apparatus and an associated method of using the wafer mount tape for use in wafer thinning operations is presented. The wafer mount tape includes a tape body, a first adhesive member and a second adhesive member. The tape body has a first region, a second region and a third region. The first region of the tape body is for being disposed onto a wafer. The second region of the tape body is defined along a periphery of the first region. The third region of the tape body is defined along a periphery of the second region. The first adhesive is member is disposed at the first region. The second adhesive member is disposed at the third region. | 08-04-2011 |
| Patent application number | Description | Published |
| 20090113469 | METHOD FOR PROVIDING BROADCAST-RELATED INFORMATION AND DISPLAY APPARATUS USING THE SAME - A method for providing broadcast-related information and a display apparatus using the method are provided. The method for providing broadcast-related information receiving additional information regarding a broadcast contained in a broadcast signal from a broadcast receiving apparatus, acquiring broadcast-related information from a connected network using the additional information, and displaying the acquired broadcast-related information. Therefore, it is possible to provide a user with richer broadcast-related information without any additional effort. | 04-30-2009 |
| 20090113470 | CONTENT MANAGEMENT METHOD, AND BROADCAST RECEIVING APPARATUS AND VIDEO APPARATUS USING THE SAME - A content management method and a broadcast receiving apparatus and a video apparatus using the method are provided. The content management method of the broadcast receiving apparatus includes receiving content satisfying content receiving conditions input by a user among content stored in an external apparatus wirelessly connected to the broadcast receiving apparatus, and storing the received content. | 04-30-2009 |
| 20090113495 | DISPLAY APPARATUS AND CONTROL METHOD THEREOF - A display apparatus and a control method of the display apparatus are provided. The display apparatus displays information regarding peripheral apparatuses communicably connected to a broadcast receiving apparatus, reduces a size of one or more content items selected from displayed content items, displays the content items the size of which is reduced, and sends a request to the broadcast receiving apparatus to display one of the displayed content items. | 04-30-2009 |
| 20090119709 | METHOD FOR PROVIDING COMMUNICATION USING ELECTRONIC PROGRAM GUIDE (EPG) AND IMAGE APPARATUS USING THE SAME - A method for providing communication of an image apparatus, and an image apparatus applying the same are provided. The method includes selecting, using an input device, a program on an Electronic Program Guide (EPG); and inputting, using the input device, a communication request regarding the selected program to an external image apparatus connected via a communication network. | 05-07-2009 |
| 20090119712 | METHOD FOR PROVIDING MULTIMEDIA CONTENT LIST AND SUB-LIST, AND BROADCAST RECEIVING APPARATUS USING THE SAME - Methods for providing a multimedia content list and a sub-list and a broadcast receiving apparatus using the methods are provided. The method for providing a multimedia content list includes generating a broadcast program list using electronic program guide (EPG) information, extracting a video file list of video files stored in storage medium or an external device, and displaying a multimedia content list including the generated broadcast program list and the extracted video file list on a screen. | 05-07-2009 |
| 20090119725 | METHOD FOR PROVIDING VIDEO TELEPHONY USING BROADCAST RECEIVING APPARATUS - A method for providing video telephony is presented. By the method, a telephone directory of a broadcast receiving apparatus can be updated by receiving a telephone directory of a connected external device is provided. A call request signal can be transmitted to an information communication terminal of the user of an external broadcast receiving apparatus when the external broadcast receiving apparatus is turned off A video telephony mode can change according to whether or not audio signals are transmitted and received when video telephony is connected. The volume of a plurality of windows can each be adjusted separately. As a result, users can utilize video telephony more conveniently. | 05-07-2009 |
| 20090119726 | METHOD FOR PROVIDING VIEWING INFORMATION FOR DISPLAYING A LIST OF CHANNELS VIEWED BY CALL RECIPIENTS - A method for providing viewing information is presented. The method includes displaying a call recipient list including at least one call recipient; and displaying a channel being viewed by each call recipient on the call recipient list. | 05-07-2009 |
| Patent application number | Description | Published |
| 20110100952 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING BUMP - A method of manufacturing a printed circuit board having a bump is disclosed. The method includes preparing a first carrier having a first circuit formed thereon, compressing the first carrier to one surface of an insulation layer such that the first circuit is buried, stacking an etching resist on the first carrier in accordance with where the bump is to be formed and forming the bump by etching the first carrier. In accordance with an embodiment of the present invention, the difference in height between a bump and its adjacent bump in a printed circuit board can be reduced, and thus electrical connection between an electronic component and the printed circuit board can be better implemented. | 05-05-2011 |
| 20110110058 | BOARD ON CHIP PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF - A single-layer board on chip package substrate and a manufacturing method thereof are disclosed. In accordance with an embodiment of the present invention, the single-layer board on chip package substrate includes an insulator, a circuit pattern and a flip-chip bonding pad, which are formed on an upper surface of the insulator, a conductive bump, which is in contact with a lower surface of the circuit pattern and penetrates through the insulator, a solder resist layer, which is formed on the upper surface of the insulator such that at least a portion of the flip-chip bonding pad is exposed, and a flip-chip bonding bump, which is formed on an upper surface of the flip-chip bonding pad in order to make a flip-chip connection with an electronic component. | 05-12-2011 |
| 20110186342 | SINGLE-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A single layered printed circuit board and a method of manufacturing the same are disclosed. In accordance with an embodiment of the present invention, the method can include forming a bonding pad, a circuit pattern and a post on a surface of an insulation film, in which one end part of the post is electrically connected to at least a portion of the circuit pattern, pressing an insulator on the surface of the insulation film, in which the circuit pattern and the post are buried in the insulator, selectively etching the insulator such that the other end part of the post is exposed, and opening a portion of the insulation film such that at least a portion of the bonding pad is exposed. | 08-04-2011 |