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Jew, CA
Kevin Gene-Wah Jew, Fremont, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090309182 | ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE - A first embodiment of an Electrostatic Discharge (ESD) structure for an integrated circuit for protecting the integrated circuit from an ESD signal, has a substrate of a first conductivity type. The substrate has a top surface. A first region of a second conductivity type is near the top surface and receives the ESD signal. A second region of the second conductivity type is in the substrate, separated and spaced apart from the first region in a substantially vertical direction. A third region of the first conductivity type, heavier in concentration than the substrate, is immediately adjacent to and in contact with the second region, substantially beneath the second region. In a second embodiment, a well of a second conductivity type is provided in the substrate of the first conductivity type. The well has a top surface. A first region of the second conductivity type is near the top surface. A second region of the second conductivity type is in the well, substantially along the bottom of the well. A third region of the first conductivity type, is immediately adjacent to and in contact with the second region, substantially beneath the second region. A fourth region of the first conductivity type is in the well, along the top surface thereof, and spaced apart from the first region. The first region and the fourth region receive the ESD signal. | 12-17-2009 |
Leona Bonanza Jew, Pleasanton, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110056025 | Infant mattress with curved top surface - Embodiments of the present invention provide an apparatus to be used as an alternative infant mattress having a curved top surface which is formed based on a curve comprising a segment of sine wave and a segment of tail line. The segment of sine wave preferably consists of a partial wave crest and a full wave trough. The length of the apparatus is preferably identical to the wave length of the sine wave. | 03-10-2011 |
Leon Emmanuel Jew, Pleasanton, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090199334 | Deep skin cleaning apparatus - The invention teaches a device for deep skin cleansing. The device includes a dispenser, with one or more outlets, for dispensing a beam or beams of high-pressured water, a switch or button for controlling release of the high-pressured water beam, and a source for providing high-pressured water such as a pre-filled canister or a powered pump. | 08-13-2009 |
| 20090214415 | System for generating oxygen using heat recycled from engine exhaust - A system for optimizing the quality of a vehicle's inner air includes an oxygen generator and an optimizer. The oxygen generator generates oxygen by dissociating water using recycled heat from the vehicle's exhaust. The optimizer automatically adjusts oxygen amount added into the vehicle's inner air according to the user's settings through an interface. | 08-27-2009 |
| 20110056025 | Infant mattress with curved top surface - Embodiments of the present invention provide an apparatus to be used as an alternative infant mattress having a curved top surface which is formed based on a curve comprising a segment of sine wave and a segment of tail line. The segment of sine wave preferably consists of a partial wave crest and a full wave trough. The length of the apparatus is preferably identical to the wave length of the sine wave. | 03-10-2011 |
Leon Emmanuel Jew, Hayward, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090208900 | Bifunctional dental apparatus - The invention teaches an apparatus used in dental care service for providing gaseous oxygen to a patient and removing dental impurities from the patient's mouth concurrently. The apparatus includes a first bendable nozzle for dispensing gaseous oxygen to a space near the patient's nose and a second bendable nozzle for sucking dental impurities from the patient's mouth. | 08-20-2009 |
Myron L. Jew, Canoga Park, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090100678 | ROCKET ENGINE NOZZLE AND METHOD OF FABRICATING A ROCKET ENGINE NOZZLE USING PRESSURE BRAZING - A method of fabrication of a rocket engine nozzle assembly using pressure brazing generally includes initially assembling a rocket engine nozzle liner into a rocket engine nozzle jacket for a rocket engine nozzle assembly. The rocket engine nozzle assembly may then be sealed. Prior to pressure brazing the rocket engine nozzle assembly, pressure brazing parameters may be determined. The pressure brazing may be performed with the determined pressure brazing parameters to complete the fabrication of the rocket engine nozzle. The rocket engine nozzle assembly may include a rocket engine nozzle jacket and a rocket engine nozzle liner having a plurality of channels, with the space between each channel defining a land, and the rocket engine nozzle liner having at least a pair of endlands disposed at each end thereof. The rocket engine nozzle liner is bonded to the rocket engine nozzle jacket by the endlands being bonded to the nozzle jacket and the lands being pressure brazed to the nozzle jacket. | 04-23-2009 |
Samuel Jew, Cupertino, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090215538 | Method for dynamically synchronizing computer network latency - A software method for synchronizing the output of data communications across several output devices, despite geographical distance and/or latency, allowing for the data stream to be dynamically-altered in real time and providing for instant and seamless echoing of local input. | 08-27-2009 |
Stephen Jew, San Jose, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20090057264 | HIGH THROUGHPUT LOW TOPOGRAPHY COPPER CMP PROCESS - Embodiments described herein generally provide a method for processing metals disposed on a substrate in a chemical mechanical polishing system. The apparatus advantageously facilitates efficient bulk and residual conductive material removal from a substrate. In one embodiment a method for chemical mechanical polishing (CMP) of a conductive material disposed on a substrate is provided. A substrate comprising a conductive material disposed over an underlying barrier material is positioned on a first platen containing a first polishing pad. The substrate is polished on a first platen to remove a bulk portion of the conductive material. A rate quench process is performed in order to reduce a metal ion concentration in the polishing slurry. The substrate is polished on the first platen to breakthrough the conductive material exposing a portion of the underlying barrier material. | 03-05-2009 |
| 20090061743 | METHOD OF SOFT PAD PREPARATION TO REDUCE REMOVAL RATE RAMP-UP EFFECT AND TO STABILIZE DEFECT RATE - A method and apparatus for pre-conditioning a new soft polishing pad and processing a substrate on a soft polishing pad is described. The method includes coupling a soft polishing pad to a platen, contacting the processing surface of the soft polishing pad with a conditioning disk, applying a pressure conditioning disk, removing the conditioning disk from contact with the processing surface of the soft polishing pad, and contacting a first substrate with the processing surface of the soft polishing pad to perform a polishing process on the first substrate. | 03-05-2009 |
| 20090264056 | SUBSTRATE HOLDER WITH LIQUID SUPPORTING SURFACE - Embodiments of the present invention generally relate to a substrate transferring system. One embodiment of the present invention provides a substrate holder comprising a pedestal plate, a basin wall extending from a top surface of the pedestal plate, wherein the basin wall has a substantially leveled top surface, the basin wall and the pedestal plate define a basin configured to retain a liquid therein, and a liquid port opening to the basin, wherein the liquid port is configured to flow a liquid to the basin and allow the liquid to overflow from the basin wall, and a top surface of the overflow liquid in the basin is configured to support a substrate without contacting the basin wall or the pedestal plate. | 10-22-2009 |
| 20100081360 | USE OF PAD CONDITIONING IN TEMPERATURE CONTROLLED CMP - A method and apparatus for temperature control for a chemical mechanical polishing process is provided. In one embodiment, the method comprises polishing the substrate with a surface of a polishing pad assembly, measuring a real-time temperature of the surface of the polishing pad assembly, determining whether the real-time temperature of the surface of the polishing pad assembly is within a predetermined processing temperature range, and contacting the surface of the polishing pad assembly with a pad conditioner to adjust the temperature of the surface of the polishing pad assembly to fall within the predetermined temperature range. | 04-01-2010 |
| 20100120330 | ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING - A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring system. A projected thickness that each substrate will have at a target time is determined based on the measurement data. The polishing parameter for at least one substrate is adjusted to adjust the polishing rate of the at least one substrate such that the substrates have closer to the same thickness at the target time than without the adjustment. | 05-13-2010 |
| 20100120331 | ENDPOINT CONTROL OF MULTIPLE-WAFER CHEMICAL MECHANICAL POLISHING - A computer-implemented method includes polishing substrates simultaneously in a polishing apparatus. Each substrate has a polishing rate independently controllable by an independently variable polishing parameter. Measurement data that varies with the thickness of each of the substrates is acquired from each of the substrates during polishing with an in-situ monitoring system. A projected time at which each substrate will reach a target thickness is determined based on the measurement data. The polishing parameter for at least one substrate is adjusted to adjust the polishing rate of the at least one substrate such that the substrates reach the target thickness closer to the same time than without the adjustment. | 05-13-2010 |
| 20100279435 | TEMPERATURE CONTROL OF CHEMICAL MECHANICAL POLISHING - A chemical mechanical polishing apparatus including a platen for holding a pad having a polishing surface, a subsystem for holding a substrate and the polishing surface together during a polishing step, and a temperature sensor oriented to measure a temperature of the polishing surface, wherein the subsystem accepts the temperature measured by the sensor and is programmed to vary a polishing process parameter in response to the measured temperature. In an aspect, a chemical mechanical polishing apparatus having a platen for holding a pad having a polishing surface, a fluid delivery system for transporting a fluid from a source to the polishing surface, and a temperature controller which during operation controls the temperature of the fluid transported by the delivery system. | 11-04-2010 |
Sydney Furan Jew, Pleasanton, CA US
| Patent application number | Description | Published |
|---|---|---|
| 20110056025 | Infant mattress with curved top surface - Embodiments of the present invention provide an apparatus to be used as an alternative infant mattress having a curved top surface which is formed based on a curve comprising a segment of sine wave and a segment of tail line. The segment of sine wave preferably consists of a partial wave crest and a full wave trough. The length of the apparatus is preferably identical to the wave length of the sine wave. | 03-10-2011 |